DE69333300D1 - Dreidimensionaler Mehrchipmodul - Google Patents

Dreidimensionaler Mehrchipmodul

Info

Publication number
DE69333300D1
DE69333300D1 DE69333300T DE69333300T DE69333300D1 DE 69333300 D1 DE69333300 D1 DE 69333300D1 DE 69333300 T DE69333300 T DE 69333300T DE 69333300 T DE69333300 T DE 69333300T DE 69333300 D1 DE69333300 D1 DE 69333300D1
Authority
DE
Germany
Prior art keywords
chip module
dimensional multi
dimensional
chip
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69333300T
Other languages
English (en)
Other versions
DE69333300T2 (de
Inventor
Claude Massit
Gerard Nicolas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Application granted granted Critical
Publication of DE69333300D1 publication Critical patent/DE69333300D1/de
Publication of DE69333300T2 publication Critical patent/DE69333300T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0652—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next and on each other, i.e. mixed assemblies
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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
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    • H01L2225/06562—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
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    • H01L2924/01—Chemical elements
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
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    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/16153—Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
DE69333300T 1992-08-13 1993-08-10 Dreidimensionaler Mehrchipmodul Expired - Lifetime DE69333300T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9210003 1992-08-13
FR929210003A FR2694840B1 (fr) 1992-08-13 1992-08-13 Module multi-puces à trois dimensions.

Publications (2)

Publication Number Publication Date
DE69333300D1 true DE69333300D1 (de) 2003-12-24
DE69333300T2 DE69333300T2 (de) 2004-09-09

Family

ID=9432844

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69333300T Expired - Lifetime DE69333300T2 (de) 1992-08-13 1993-08-10 Dreidimensionaler Mehrchipmodul

Country Status (4)

Country Link
US (1) US5373189A (de)
EP (1) EP0583201B1 (de)
DE (1) DE69333300T2 (de)
FR (1) FR2694840B1 (de)

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RU2148874C1 (ru) * 1996-10-10 2000-05-10 Самсунг Электроникс Ко., Лтд. Многослойная гибридная интегральная схема свч и квч диапазонов
US5856915A (en) * 1997-02-26 1999-01-05 Pacesetter, Inc. Vertically stacked circuit module using a platform having a slot for establishing multi-level connectivity
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US5987357A (en) * 1997-07-30 1999-11-16 Intermedics Inc. Stackable microelectronic components with self-addressing scheme
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US6898101B1 (en) * 1997-12-16 2005-05-24 Cypress Semiconductor Corp. Microcontroller with programmable logic on a single chip
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US6297548B1 (en) * 1998-06-30 2001-10-02 Micron Technology, Inc. Stackable ceramic FBGA for high thermal applications
US6313522B1 (en) * 1998-08-28 2001-11-06 Micron Technology, Inc. Semiconductor structure having stacked semiconductor devices
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EP0583201B1 (de) 2003-11-19
DE69333300T2 (de) 2004-09-09
EP0583201A1 (de) 1994-02-16
US5373189A (en) 1994-12-13
FR2694840A1 (fr) 1994-02-18

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