DE68901571D1 - Halbleiter-druckwandler. - Google Patents

Halbleiter-druckwandler.

Info

Publication number
DE68901571D1
DE68901571D1 DE8989400864T DE68901571T DE68901571D1 DE 68901571 D1 DE68901571 D1 DE 68901571D1 DE 8989400864 T DE8989400864 T DE 8989400864T DE 68901571 T DE68901571 T DE 68901571T DE 68901571 D1 DE68901571 D1 DE 68901571D1
Authority
DE
Germany
Prior art keywords
pressure converter
semiconductor pressure
semiconductor
converter
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8989400864T
Other languages
English (en)
Inventor
Vincent Mosser
Jean-Louis Robert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schlumberger SA
Original Assignee
Schlumberger SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from FR8804176A external-priority patent/FR2629640B1/fr
Priority claimed from FR8804175A external-priority patent/FR2629592B1/fr
Application filed by Schlumberger SA filed Critical Schlumberger SA
Application granted granted Critical
Publication of DE68901571D1 publication Critical patent/DE68901571D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D3/00—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups
    • G01D3/028—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups mitigating undesired influences, e.g. temperature, pressure
    • G01D3/036—Indicating or recording apparatus with provision for the special purposes referred to in the subgroups mitigating undesired influences, e.g. temperature, pressure on measuring arrangements themselves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G01L19/0645—Protection against aggressive medium in general using isolation membranes, specially adapted for protection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0098—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means using semiconductor body comprising at least one PN junction as detecting element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
DE8989400864T 1988-03-30 1989-03-29 Halbleiter-druckwandler. Expired - Fee Related DE68901571D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8804176A FR2629640B1 (fr) 1988-03-30 1988-03-30 Transducteur de pression hydrostatique a correction de temperature
FR8804175A FR2629592B1 (fr) 1988-03-30 1988-03-30 Capteur de pression adaptatif

Publications (1)

Publication Number Publication Date
DE68901571D1 true DE68901571D1 (de) 1992-06-25

Family

ID=26226588

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8989400864T Expired - Fee Related DE68901571D1 (de) 1988-03-30 1989-03-29 Halbleiter-druckwandler.

Country Status (4)

Country Link
US (1) US4965697A (de)
EP (1) EP0335793B1 (de)
DE (1) DE68901571D1 (de)
ES (1) ES2032119T3 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2653197B1 (fr) * 1989-10-12 1991-12-27 Vulcanic Procede d'etancheification d'une extremite d'element de chauffage electrique et element etancheifie par ce procede.
JP3116409B2 (ja) * 1991-05-07 2000-12-11 株式会社デンソー 半導体歪みセンサ
DE4238545A1 (de) * 1992-11-14 1994-05-19 Daimler Benz Ag Drucksensor und ein Verfahren zu dessen Herstellung
US5413179A (en) * 1993-04-16 1995-05-09 The Energex Company System and method for monitoring fracture growth during hydraulic fracture treatment
US5322126A (en) * 1993-04-16 1994-06-21 The Energex Company System and method for monitoring fracture growth during hydraulic fracture treatment
EP0695927A3 (de) * 1994-08-01 1996-06-26 Motorola Inc Detektor-Umformer unter Verwendung eines Schottky-Übergangs mit einer erhöhten Ausgangsspannung
US5925825A (en) * 1994-10-05 1999-07-20 Franklin Electric Co., Inc. Clamp and cup securing strain gauge cell adjacent pressure transmitting diaphragm
US5863185A (en) * 1994-10-05 1999-01-26 Franklin Electric Co. Liquid pumping system with cooled control module
US5635712A (en) * 1995-05-04 1997-06-03 Halliburton Company Method for monitoring the hydraulic fracturing of a subterranean formation
DE69706213T2 (de) * 1996-04-04 2002-05-16 Ssi Technologies, Inc. Druckmessgerät und Verfahren zu seiner Herstellung
US5831170A (en) * 1996-04-04 1998-11-03 Ssi Technologies, Inc. Pressure sensor package and method of making the same
US5874679A (en) * 1996-04-04 1999-02-23 Ssi Technologies, Inc. Pressure sensor package and method of making the same
US7127949B2 (en) * 2003-07-08 2006-10-31 National University Of Singapore Contact pressure sensor and method for manufacturing the same
JP4447871B2 (ja) * 2003-08-29 2010-04-07 キヤノン株式会社 画像形成装置
US6928878B1 (en) * 2004-09-28 2005-08-16 Rosemount Aerospace Inc. Pressure sensor
US8082796B1 (en) * 2008-01-28 2011-12-27 Silicon Microstructures, Inc. Temperature extraction from a pressure sensor
DK3426147T3 (da) * 2016-03-10 2020-09-21 Epitronic Holdings Pte Ltd Mikroelektronisk sensor til mave- og tarmdiagnostik og overvågning af tarmmotilitet
US10912474B2 (en) 2016-03-10 2021-02-09 Epitronic Holdings Pte Ltd. Microelectronic sensor for use in hypersensitive microphones
GB2559338A (en) * 2017-01-31 2018-08-08 Philip Sperring Christopher Contact pressure sensor manufacture
CN113029508B (zh) * 2021-03-24 2023-06-02 中国空气动力研究与发展中心高速空气动力研究所 一种用于风洞模型底部压力测量的微型组合式压力传感器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH250406A (de) * 1944-05-16 1947-08-31 Philips Nv Kapazitiver Druckaufnehmer.
GB1049130A (en) * 1964-03-12 1966-11-23 Intermetall Ges Fur Metallurg Improvements in pressure transducers and circuit arrangements therefor
DE2714032B2 (de) * 1977-03-30 1979-07-05 Gosudarstvennij Nautschno-Issledovatelskij I Proektnyj Institut Redkometallitscheskoj Promyschlennosti Giredmet, Moskau Halbleiterdruckgeber
US4196632A (en) * 1978-08-14 1980-04-08 The Boeing Company Dual capacitance type bonded pressure transducer
DE3212026A1 (de) * 1982-03-31 1983-10-06 Siemens Ag Temperatursensor
DE3211968A1 (de) * 1982-03-31 1983-10-13 Siemens AG, 1000 Berlin und 8000 München Drucksensor

Also Published As

Publication number Publication date
ES2032119T3 (es) 1993-01-01
EP0335793B1 (de) 1992-05-20
EP0335793A1 (de) 1989-10-04
US4965697A (en) 1990-10-23

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: DERZEIT KEIN VERTRETER BESTELLT

8339 Ceased/non-payment of the annual fee