TW282583B - - Google Patents
Info
- Publication number
- TW282583B TW282583B TW083106179A TW83106179A TW282583B TW 282583 B TW282583 B TW 282583B TW 083106179 A TW083106179 A TW 083106179A TW 83106179 A TW83106179 A TW 83106179A TW 282583 B TW282583 B TW 282583B
- Authority
- TW
- Taiwan
Links
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B3/00—Line transmission systems
- H04B3/02—Details
- H04B3/32—Reducing cross-talk, e.g. by compensating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/4905—Shape
- H01L2224/4909—Loop shape arrangement
- H01L2224/49095—Loop shape arrangement parallel in plane
- H01L2224/49096—Loop shape arrangement parallel in plane horizontal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01055—Cesium [Cs]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
- H01L2924/30111—Impedance matching
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Cable Transmission Systems, Equalization Of Radio And Reduction Of Echo (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/115,291 US5376902A (en) | 1993-08-31 | 1993-08-31 | Interconnection structure for crosstalk reduction to improve off-chip selectivity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW282583B true TW282583B (zh) | 1996-08-01 |
Family
ID=22360414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW083106179A TW282583B (zh) | 1993-08-31 | 1994-07-06 |
Country Status (15)
| Country | Link |
|---|---|
| US (1) | US5376902A (zh) |
| EP (1) | EP0641034B1 (zh) |
| JP (1) | JPH07106810A (zh) |
| KR (1) | KR0137111B1 (zh) |
| CN (1) | CN1104373A (zh) |
| AU (1) | AU665718B2 (zh) |
| BR (1) | BR9403019A (zh) |
| CA (1) | CA2130225C (zh) |
| DE (1) | DE69423684T2 (zh) |
| FI (1) | FI943662A (zh) |
| IL (1) | IL110218A (zh) |
| MY (1) | MY115426A (zh) |
| RU (1) | RU2158992C2 (zh) |
| TW (1) | TW282583B (zh) |
| ZA (1) | ZA946141B (zh) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5734268A (en) * | 1996-04-08 | 1998-03-31 | Motorola, Inc. | Calibration and measurment technique and apparatus for same |
| US6687842B1 (en) * | 1997-04-02 | 2004-02-03 | Tessera, Inc. | Off-chip signal routing between multiply-connected on-chip electronic elements via external multiconductor transmission line on a dielectric element |
| US6522173B1 (en) * | 1998-03-31 | 2003-02-18 | Kanji Otsuka | Electronic device |
| US6194774B1 (en) * | 1999-03-10 | 2001-02-27 | Samsung Electronics Co., Ltd. | Inductor including bonding wires |
| EP1376747A3 (en) * | 2002-06-28 | 2005-07-20 | Texas Instruments Incorporated | Common mode rejection in differential pairs using slotted ground planes |
| US8222721B2 (en) * | 2003-09-15 | 2012-07-17 | Silicon Laboratories Inc. | Integrated circuit suitable for use in radio receivers |
| DE102005005887A1 (de) * | 2005-02-09 | 2006-08-10 | Rohde & Schwarz Gmbh & Co. Kg | Verfahren und Anordnung zur Korrektur der Rückwirkung elektrischer Messwandler auf das Messobjekt |
| DE102006024460B4 (de) * | 2006-05-24 | 2016-08-04 | Infineon Technologies Ag | Vorrichtung und Verfahren zur Durchführung eines Tests |
| DE102006024458B4 (de) * | 2006-05-24 | 2016-04-14 | Infineon Technologies Ag | Integrierte Mehrfachmischer-Schaltung |
| DE102006024457B4 (de) * | 2006-05-24 | 2014-06-05 | Infineon Technologies Ag | Integrierte Schaltung zum Senden und/oder Empfangen von Signalen |
| US8022861B2 (en) | 2008-04-04 | 2011-09-20 | Toyota Motor Engineering & Manufacturing North America, Inc. | Dual-band antenna array and RF front-end for mm-wave imager and radar |
| US7733265B2 (en) | 2008-04-04 | 2010-06-08 | Toyota Motor Engineering & Manufacturing North America, Inc. | Three dimensional integrated automotive radars and methods of manufacturing the same |
| US7830301B2 (en) | 2008-04-04 | 2010-11-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | Dual-band antenna array and RF front-end for automotive radars |
| US7990237B2 (en) | 2009-01-16 | 2011-08-02 | Toyota Motor Engineering & Manufacturing North America, Inc. | System and method for improving performance of coplanar waveguide bends at mm-wave frequencies |
| FR2945895B1 (fr) * | 2009-05-20 | 2014-04-18 | Thales Sa | Dispositif d'interconnexion pour circuits electroniques, notamment des circuits electroniques hyperfrequence |
| JP5393786B2 (ja) * | 2009-07-07 | 2014-01-22 | 松江エルメック株式会社 | コモンモードフィルタ |
| US8786496B2 (en) | 2010-07-28 | 2014-07-22 | Toyota Motor Engineering & Manufacturing North America, Inc. | Three-dimensional array antenna on a substrate with enhanced backlobe suppression for mm-wave automotive applications |
| TW201228090A (en) * | 2010-12-31 | 2012-07-01 | Ind Tech Res Inst | Input apparatus on chip for differential signals and balun thereof |
| JP2013030722A (ja) * | 2011-06-22 | 2013-02-07 | Seiko Epson Corp | 接続構造および接続方法 |
| CN105781052A (zh) * | 2014-04-29 | 2016-07-20 | 易欣 | 一种硅藻泥模块化制品 |
| RU2600731C1 (ru) * | 2015-09-30 | 2016-10-27 | Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" | Фильтр подавления электромагнитных помех |
| KR20170056774A (ko) * | 2015-11-13 | 2017-05-24 | 에스케이하이닉스 주식회사 | 반도체 장치 및 반도체 패키지 |
| CN105743334A (zh) * | 2016-03-29 | 2016-07-06 | 上海中科深江电动车辆有限公司 | 低压供电回路滤波电路 |
| JP6665759B2 (ja) * | 2016-11-10 | 2020-03-13 | 三菱電機株式会社 | 高周波回路 |
| US11516905B2 (en) * | 2020-04-14 | 2022-11-29 | Dell Products L.P. | Method to improve PCB trace conductivity and system therefor |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4350958A (en) * | 1980-01-17 | 1982-09-21 | Motorola, Inc. | Impedance matching circuitry for radio frequency signal power amplifiers |
| US4386324A (en) * | 1980-12-05 | 1983-05-31 | Hughes Aircraft Company | Planar chip-level power combiner |
| JPS5931042A (ja) * | 1982-08-12 | 1984-02-18 | Mitsubishi Electric Corp | 高周波高出力半導体装置 |
| JPS60134440A (ja) * | 1983-12-23 | 1985-07-17 | Hitachi Ltd | 半導体集積回路装置 |
| US4831497A (en) * | 1986-09-11 | 1989-05-16 | General Electric Company | Reduction of cross talk in interconnecting conductors |
| US4891616A (en) * | 1988-06-01 | 1990-01-02 | Honeywell Inc. | Parallel planar signal transmission system |
| JPH02166803A (ja) * | 1988-12-20 | 1990-06-27 | Matsushita Electric Ind Co Ltd | マイクロ波集積回路 |
| JP2736107B2 (ja) * | 1989-03-14 | 1998-04-02 | 株式会社東芝 | 信号配線基板 |
| JPH033289A (ja) * | 1989-05-30 | 1991-01-09 | Gurafuiko:Kk | ツイスト・プリント配線 |
| US5223741A (en) * | 1989-09-01 | 1993-06-29 | Tactical Fabs, Inc. | Package for an integrated circuit structure |
| JPH04180401A (ja) * | 1990-11-15 | 1992-06-26 | Hitachi Ltd | 高周波伝送線路 |
| US5223804A (en) * | 1990-11-28 | 1993-06-29 | Seiko Epson Corporation | Fabrication process for IC circuit and IC circuits fabricated thereby |
| JPH05109924A (ja) * | 1991-10-17 | 1993-04-30 | Ngk Spark Plug Co Ltd | 集積回路用パツケージ |
| US5223809A (en) * | 1992-04-24 | 1993-06-29 | At&T Bell Laboratories | Signal isolating microwave splitters/combiners |
-
1993
- 1993-08-31 US US08/115,291 patent/US5376902A/en not_active Expired - Lifetime
-
1994
- 1994-07-05 IL IL11021894A patent/IL110218A/en not_active IP Right Cessation
- 1994-07-06 TW TW083106179A patent/TW282583B/zh active
- 1994-07-08 AU AU67348/94A patent/AU665718B2/en not_active Ceased
- 1994-07-21 DE DE69423684T patent/DE69423684T2/de not_active Expired - Fee Related
- 1994-07-21 EP EP94111355A patent/EP0641034B1/en not_active Expired - Lifetime
- 1994-08-05 FI FI943662A patent/FI943662A/fi unknown
- 1994-08-15 ZA ZA946141A patent/ZA946141B/xx unknown
- 1994-08-16 CA CA002130225A patent/CA2130225C/en not_active Expired - Fee Related
- 1994-08-23 KR KR1019940020748A patent/KR0137111B1/ko not_active IP Right Cessation
- 1994-08-25 CN CN94115702A patent/CN1104373A/zh active Pending
- 1994-08-26 RU RU94031099/09A patent/RU2158992C2/ru not_active IP Right Cessation
- 1994-08-26 MY MYPI94002249A patent/MY115426A/en unknown
- 1994-08-29 JP JP6227352A patent/JPH07106810A/ja active Pending
- 1994-08-30 BR BR9403019A patent/BR9403019A/pt not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| EP0641034A2 (en) | 1995-03-01 |
| CA2130225A1 (en) | 1995-03-01 |
| EP0641034A3 (en) | 1996-01-17 |
| JPH07106810A (ja) | 1995-04-21 |
| DE69423684D1 (de) | 2000-05-04 |
| EP0641034B1 (en) | 2000-03-29 |
| BR9403019A (pt) | 1995-06-27 |
| FI943662A0 (fi) | 1994-08-05 |
| RU94031099A (ru) | 1997-04-20 |
| IL110218A0 (en) | 1994-10-21 |
| RU2158992C2 (ru) | 2000-11-10 |
| KR0137111B1 (ko) | 1998-06-01 |
| MY115426A (en) | 2003-06-30 |
| US5376902A (en) | 1994-12-27 |
| CA2130225C (en) | 1999-07-20 |
| AU6734894A (en) | 1995-03-16 |
| AU665718B2 (en) | 1996-01-11 |
| ZA946141B (en) | 1995-11-08 |
| IL110218A (en) | 1996-10-31 |
| DE69423684T2 (de) | 2000-11-09 |
| FI943662A (fi) | 1995-03-01 |
| CN1104373A (zh) | 1995-06-28 |
| KR950007088A (ko) | 1995-03-21 |