DE69417246D1 - Epoxydharzzusammensetzung - Google Patents

Epoxydharzzusammensetzung

Info

Publication number
DE69417246D1
DE69417246D1 DE69417246T DE69417246T DE69417246D1 DE 69417246 D1 DE69417246 D1 DE 69417246D1 DE 69417246 T DE69417246 T DE 69417246T DE 69417246 T DE69417246 T DE 69417246T DE 69417246 D1 DE69417246 D1 DE 69417246D1
Authority
DE
Germany
Prior art keywords
epoxy resin
resin composition
polyhydric phenol
biphenol
castings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69417246T
Other languages
English (en)
Other versions
DE69417246T2 (de
Inventor
Yasuyuki C O Yuka Shell Murata
Yoshinori C O Yuka S Nakanishi
Mitsukazu Ochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shell Internationale Research Maatschappij BV
Original Assignee
Shell Internationale Research Maatschappij BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shell Internationale Research Maatschappij BV filed Critical Shell Internationale Research Maatschappij BV
Publication of DE69417246D1 publication Critical patent/DE69417246D1/de
Application granted granted Critical
Publication of DE69417246T2 publication Critical patent/DE69417246T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE69417246T 1993-09-24 1994-09-23 Epoxydharzzusammensetzung Expired - Fee Related DE69417246T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP25896793A JP3428699B2 (ja) 1993-09-24 1993-09-24 エポキシ樹脂組成物
PCT/EP1994/003215 WO1995008584A1 (en) 1993-09-24 1994-09-23 Epoxy resin composition

Publications (2)

Publication Number Publication Date
DE69417246D1 true DE69417246D1 (de) 1999-04-22
DE69417246T2 DE69417246T2 (de) 1999-09-02

Family

ID=17327511

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69417246T Expired - Fee Related DE69417246T2 (de) 1993-09-24 1994-09-23 Epoxydharzzusammensetzung

Country Status (12)

Country Link
US (1) US5597876A (de)
EP (1) EP0720630B1 (de)
JP (1) JP3428699B2 (de)
KR (1) KR100327918B1 (de)
CN (1) CN1051326C (de)
AT (1) ATE177767T1 (de)
AU (1) AU7810094A (de)
DE (1) DE69417246T2 (de)
ES (1) ES2130449T3 (de)
MY (1) MY111712A (de)
TW (1) TW354328B (de)
WO (1) WO1995008584A1 (de)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07304846A (ja) * 1994-05-09 1995-11-21 Yuka Shell Epoxy Kk エポキシ樹脂組成物
JPH08259665A (ja) * 1995-03-20 1996-10-08 Dainippon Ink & Chem Inc エポキシ樹脂硬化剤及びその製造方法
US5859153A (en) * 1996-06-21 1999-01-12 Minnesota Mining And Manufacturing Company Novolak compounds useful as adhesion promoters for epoxy resins
US6117536A (en) * 1998-09-10 2000-09-12 Ga-Tek Inc. Adhesion promoting layer for use with epoxy prepregs
US6132589A (en) * 1998-09-10 2000-10-17 Ga-Tek Inc. Treated copper foil and process for making treated copper foil
ES2367838T3 (es) 1998-09-10 2011-11-10 JX Nippon Mining & Metals Corp. Laminado que comprende una hoja de cobre tratada y procedimiento para su fabricación.
US6156865A (en) * 1998-11-19 2000-12-05 Nec Corporation Flame retardant thermosetting resin composition
US20050053758A1 (en) * 2001-10-25 2005-03-10 Smith Walter J. Method, apparatus and system for creating a brush seal
US20040173969A1 (en) * 2001-10-25 2004-09-09 Smith Walter J. Turbine brush seal
US20030151206A1 (en) * 2001-10-25 2003-08-14 Smith Walter J. Method, apparatus and system for creating a brush seal
JP2004010762A (ja) 2002-06-07 2004-01-15 Hitachi Ltd エポキシ樹脂，エポキシ樹脂組成物，エポキシ樹脂硬化物及びそれらの製造方法
CN1312190C (zh) * 2002-11-11 2007-04-25 西北工业大学 树脂状酚类固化剂及其制备方法
US7291684B2 (en) 2003-03-11 2007-11-06 Sumitomo Bakelite Co., Ltd. Resin composition for encapsulating semiconductor chip and semiconductor device therewith
MY134219A (en) * 2003-03-11 2007-11-30 Sumitomo Bakelite Co Resin composition for encapsulating semiconductor chip and semiconductor device therewith
WO2004085511A1 (ja) * 2003-03-25 2004-10-07 Sumitomo Bakelite Co., Ltd. 半導体封止用樹脂組成物およびこれを用いた半導体装置
EP1785441B1 (de) * 2004-09-01 2011-06-08 DIC Corporation Epoxidharzzusammensetzung, härtungsprodukte davon, material zur verkapselung von halbleitern, neues phenolharz, neues epoxidharz, verfahren zur herstellung von neuem phenolharz und verfahren zur herstellung von neuem epoxidharz
JP4941804B2 (ja) * 2005-03-02 2012-05-30 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、半導体封止材料、新規フェノール樹脂、および新規エポキシ樹脂
JP4710379B2 (ja) * 2005-03-30 2011-06-29 住友ベークライト株式会社 エポキシ樹脂組成物および半導体封止用エポキシ樹脂
KR100997606B1 (ko) * 2005-07-29 2010-11-30 스미토모 베이클라이트 가부시키가이샤 에폭시 수지 조성물 및 반도체장치
JP5257725B2 (ja) * 2005-08-03 2013-08-07 Ｄｉｃ株式会社 エポキシ樹脂，エポキシ樹脂組成物，硬化物，半導体装置，エポキシ樹脂の製造法
JP4998271B2 (ja) 2006-01-25 2012-08-15 日立化成工業株式会社 フェノール樹脂及び樹脂組成物
KR101386027B1 (ko) * 2006-06-16 2014-04-24 훈츠만 어드밴스트 머티리얼스(스위처랜드) 게엠베하 코팅 시스템
WO2008059755A1 (fr) 2006-11-13 2008-05-22 Nippon Steel Chemical Co., Ltd. Produit durci de résine cristalline, corps composite de résine cristalline et leurs procédés de fabrication
KR20160140996A (ko) * 2009-09-29 2016-12-07 히타치가세이가부시끼가이샤 다층 수지 시트 및 그 제조 방법, 다층 수지 시트 경화물의 제조 방법, 그리고, 고열전도 수지 시트 적층체 및 그 제조 방법
CN105542125B (zh) * 2009-09-29 2018-02-06 日立化成株式会社 树脂组合物、树脂片、树脂固化物及其制造方法、树脂片层叠体及其制造方法
JP5760997B2 (ja) * 2010-11-30 2015-08-12 三菱化学株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
US9349931B2 (en) * 2011-03-28 2016-05-24 Hitachi Chemical Company, Ltd. Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED device
JP6221634B2 (ja) * 2013-10-30 2017-11-01 Tdk株式会社 樹脂組成物、樹脂シート、樹脂硬化物および基板
JP5983590B2 (ja) * 2013-12-13 2016-08-31 株式会社デンソー 硬化性樹脂組成物、封止材、及びこれを用いた電子デバイス製品
TWI733770B (zh) * 2016-04-04 2021-07-21 日商迪愛生股份有限公司 環氧樹脂組成物、硬化性組成物及半導體密封材料
JP7320942B2 (ja) 2018-12-28 2023-08-04 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂、エポキシ樹脂組成物及び硬化物
KR102259563B1 (ko) * 2019-10-02 2021-06-01 한화솔루션 주식회사 커버레이용 접착제 조성물 및 이를 포함하는 fpcb용 커버레이
JP6992932B2 (ja) * 2019-10-25 2022-02-03 Dic株式会社 多官能フェノール樹脂、多官能エポキシ樹脂、それらを含む硬化性樹脂組成物及びその硬化物
JP2022007637A (ja) 2020-06-26 2022-01-13 日鉄ケミカル＆マテリアル株式会社 多価ヒドロキシ樹脂、その製造方法、及びそれを含むエポキシ樹脂組成物、並びにエポキシ樹脂硬化物

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5710651A (en) * 1980-06-23 1982-01-20 Asahi Denka Kogyo Kk Coating material composition
JPS62167318A (ja) * 1986-01-20 1987-07-23 Teijin Ltd エポキシ樹脂の硬化方法
JPH06104712B2 (ja) * 1987-04-08 1994-12-21 東レ株式会社 半導体封止用樹脂組成物
CH672493A5 (de) * 1987-07-23 1989-11-30 Ciba Geigy Ag
JPS6443521A (en) * 1987-08-10 1989-02-15 Toray Industries Epoxy resin
EP0403022B1 (de) * 1989-06-13 1996-11-13 Shell Internationale Researchmaatschappij B.V. Epoxyharzzusammensetzung zum Einkapseln
JP2732122B2 (ja) * 1989-06-13 1998-03-25 油化シエルエポキシ株式会社 エポキシ樹脂及び封止用エポキシ樹脂組成物
JPH0314818A (ja) * 1989-06-13 1991-01-23 Yuka Shell Epoxy Kk 半導体封止用エポキシ樹脂組成物
JPH082940B2 (ja) * 1990-10-30 1996-01-17 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP2837538B2 (ja) * 1990-11-29 1998-12-16 日東電工株式会社 半導体装置
US5334674A (en) * 1991-06-19 1994-08-02 Dai-Ichi Kogyo Seiyaku Co., Ltd. Polyhydroxy aromatic compounds, epoxy resins derived therefrom and epoxy resin compositions
US5319005A (en) * 1992-01-27 1994-06-07 Hitachi Chemical Co., Ltd. Epoxy resin molding material for sealing of electronic component
JP3143721B2 (ja) * 1992-05-07 2001-03-07 ジャパンエポキシレジン株式会社 封止用エポキシ樹脂組成物
JPH1043521A (ja) * 1996-08-02 1998-02-17 Sanyo Electric Co Ltd 浴水循環浄化装置

Also Published As

Publication number Publication date
CN1134713A (zh) 1996-10-30
ES2130449T3 (es) 1999-07-01
US5597876A (en) 1997-01-28
WO1995008584A1 (en) 1995-03-30
EP0720630B1 (de) 1999-03-17
KR100327918B1 (ko) 2002-07-06
TW354328B (en) 1999-03-11
CN1051326C (zh) 2000-04-12
MY111712A (en) 2000-11-30
ATE177767T1 (de) 1999-04-15
AU7810094A (en) 1995-04-10
DE69417246T2 (de) 1999-09-02
JP3428699B2 (ja) 2003-07-22
EP0720630A1 (de) 1996-07-10
JPH0790052A (ja) 1995-04-04

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee