DE69410883T2 - Poliergerät für Einschnitt-Teil eines Wafers - Google Patents

Poliergerät für Einschnitt-Teil eines Wafers

Info

Publication number
DE69410883T2
DE69410883T2 DE69410883T DE69410883T DE69410883T2 DE 69410883 T2 DE69410883 T2 DE 69410883T2 DE 69410883 T DE69410883 T DE 69410883T DE 69410883 T DE69410883 T DE 69410883T DE 69410883 T2 DE69410883 T2 DE 69410883T2
Authority
DE
Germany
Prior art keywords
polisher
wafer
cut part
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69410883T
Other languages
English (en)
Other versions
DE69410883D1 (de
Inventor
Fumihiko Hasegawa
Tatsuo Ohtani
Koichiro Ichikawa
Yoshio Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Shin Etsu Handotai Co Ltd
Original Assignee
Fujikoshi Machinery Corp
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Machinery Corp, Shin Etsu Handotai Co Ltd filed Critical Fujikoshi Machinery Corp
Application granted granted Critical
Publication of DE69410883D1 publication Critical patent/DE69410883D1/de
Publication of DE69410883T2 publication Critical patent/DE69410883T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02027—Setting crystal orientation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
DE69410883T 1993-07-08 1994-07-01 Poliergerät für Einschnitt-Teil eines Wafers Expired - Fee Related DE69410883T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5193195A JP2798347B2 (ja) 1993-07-08 1993-07-08 ウェーハのノッチ部研磨装置

Publications (2)

Publication Number Publication Date
DE69410883D1 DE69410883D1 (de) 1998-07-16
DE69410883T2 true DE69410883T2 (de) 1998-12-17

Family

ID=16303891

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69410883T Expired - Fee Related DE69410883T2 (de) 1993-07-08 1994-07-01 Poliergerät für Einschnitt-Teil eines Wafers

Country Status (5)

Country Link
US (1) US5429544A (de)
EP (1) EP0633097B1 (de)
JP (1) JP2798347B2 (de)
DE (1) DE69410883T2 (de)
MY (1) MY115312A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103009421A (zh) * 2012-12-28 2013-04-03 福建省闽清县陶瓷机械设备制造厂 一种拉紧绝缘子自动修弧机

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW303487B (de) * 1995-05-29 1997-04-21 Shinetsu Handotai Co Ltd
US6563785B2 (en) * 1997-12-15 2003-05-13 Seagate Technology Llc Method of manufacturing rounded edge recording head
JPH11320388A (ja) * 1998-05-12 1999-11-24 Speedfam-Ipec Co Ltd 平面研磨装置及びワークの取出方法
US6156659A (en) * 1998-11-19 2000-12-05 Chartered Semiconductor Manufacturing Ltd. Linear CMP tool design with closed loop slurry distribution
JP2000158315A (ja) * 1998-11-27 2000-06-13 Speedfam-Ipec Co Ltd 端面研磨装置におけるノッチ研磨装置のノッチ研磨方法
JP2002301653A (ja) * 2001-04-03 2002-10-15 Sankyo Rikagaku Co Ltd 石材等の側面形状加工方法及び該方法に使用する研磨ホイール
JP2002367935A (ja) * 2001-04-06 2002-12-20 Speedfam Co Ltd ウェハ鏡面加工装置
JP2003007658A (ja) * 2001-06-20 2003-01-10 Speedfam Co Ltd ウェハノッチの鏡面研磨方法及び鏡面研磨装置
JP3759473B2 (ja) * 2002-05-30 2006-03-22 ジヤトコ株式会社 板材の面取り加工方法及び装置
JP2004087647A (ja) * 2002-08-26 2004-03-18 Nihon Micro Coating Co Ltd 研磨パッド及び方法
US20110028074A1 (en) * 2009-08-03 2011-02-03 Canon Kabushiki Kaisha Polishing method for a workpiece and polishing tool used for the polishing method
CN107363680A (zh) * 2017-08-08 2017-11-21 格林精密部件(苏州)有限公司 一种工件打磨装置
CN107350930A (zh) * 2017-08-08 2017-11-17 格林精密部件(苏州)有限公司 一种新型工件打磨装置
CN109926911A (zh) * 2019-03-04 2019-06-25 天通日进精密技术有限公司 晶圆凹口抛光装置及晶圆凹口抛光方法
CN109940498B (zh) * 2019-03-30 2024-03-15 浙江联宜电机有限公司 齿轮抛光装置
CN110883674B (zh) * 2019-12-06 2021-09-17 新昌县知贝机械有限公司 一种可自动翻转打磨面的船舶甲板用钢板抛光机
CN114310626B (zh) * 2021-12-28 2023-10-31 无锡强连科技有限公司 一种法兰盘抛光机

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1220287A (en) * 1915-12-18 1917-03-27 Harry H Styll Lens-slotting machine.
US2275483A (en) * 1937-01-15 1942-03-10 Sullivan Machinery Co Grinding apparatus
US4054010A (en) * 1976-01-20 1977-10-18 Headway Research, Inc. Apparatus for grinding edges of planar workpieces
US4174592A (en) * 1978-09-01 1979-11-20 Bernhardt Paul E Lapidary device
JP2541844B2 (ja) * 1988-09-26 1996-10-09 信越半導体株式会社 半導体ウエ―ハ、ノッチ面取り方法及びその装置
US4905425A (en) * 1988-09-30 1990-03-06 Shin-Etsu Handotai Company Limited Method for chamfering the notch of a notch-cut semiconductor wafer
IT1243912B (it) * 1990-11-20 1994-06-28 Mapos Italiana Srl Apparecchiatura combinata, per la pulitura e la lucidatura di pezzi metallici in genere.
JP2571477B2 (ja) * 1991-06-12 1997-01-16 信越半導体株式会社 ウエーハのノッチ部面取り装置
US5185965A (en) * 1991-07-12 1993-02-16 Daito Shoji Co., Ltd. Method and apparatus for grinding notches of semiconductor wafer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103009421A (zh) * 2012-12-28 2013-04-03 福建省闽清县陶瓷机械设备制造厂 一种拉紧绝缘子自动修弧机

Also Published As

Publication number Publication date
JPH0724714A (ja) 1995-01-27
MY115312A (en) 2003-05-31
EP0633097B1 (de) 1998-06-10
EP0633097A1 (de) 1995-01-11
DE69410883D1 (de) 1998-07-16
US5429544A (en) 1995-07-04
JP2798347B2 (ja) 1998-09-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee