DE69410883D1 - Poliergerät für Einschnitt-Teil eines Wafers - Google Patents
Poliergerät für Einschnitt-Teil eines WafersInfo
- Publication number
- DE69410883D1 DE69410883D1 DE69410883T DE69410883T DE69410883D1 DE 69410883 D1 DE69410883 D1 DE 69410883D1 DE 69410883 T DE69410883 T DE 69410883T DE 69410883 T DE69410883 T DE 69410883T DE 69410883 D1 DE69410883 D1 DE 69410883D1
- Authority
- DE
- Germany
- Prior art keywords
- polisher
- wafer
- cut part
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02027—Setting crystal orientation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5193195A JP2798347B2 (ja) | 1993-07-08 | 1993-07-08 | ウェーハのノッチ部研磨装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69410883D1 true DE69410883D1 (de) | 1998-07-16 |
DE69410883T2 DE69410883T2 (de) | 1998-12-17 |
Family
ID=16303891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69410883T Expired - Fee Related DE69410883T2 (de) | 1993-07-08 | 1994-07-01 | Poliergerät für Einschnitt-Teil eines Wafers |
Country Status (5)
Country | Link |
---|---|
US (1) | US5429544A (de) |
EP (1) | EP0633097B1 (de) |
JP (1) | JP2798347B2 (de) |
DE (1) | DE69410883T2 (de) |
MY (1) | MY115312A (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW303487B (de) * | 1995-05-29 | 1997-04-21 | Shinetsu Handotai Co Ltd | |
US6563785B2 (en) * | 1997-12-15 | 2003-05-13 | Seagate Technology Llc | Method of manufacturing rounded edge recording head |
JPH11320388A (ja) * | 1998-05-12 | 1999-11-24 | Speedfam-Ipec Co Ltd | 平面研磨装置及びワークの取出方法 |
US6156659A (en) * | 1998-11-19 | 2000-12-05 | Chartered Semiconductor Manufacturing Ltd. | Linear CMP tool design with closed loop slurry distribution |
JP2000158315A (ja) * | 1998-11-27 | 2000-06-13 | Speedfam-Ipec Co Ltd | 端面研磨装置におけるノッチ研磨装置のノッチ研磨方法 |
JP2002301653A (ja) * | 2001-04-03 | 2002-10-15 | Sankyo Rikagaku Co Ltd | 石材等の側面形状加工方法及び該方法に使用する研磨ホイール |
JP2002367935A (ja) * | 2001-04-06 | 2002-12-20 | Speedfam Co Ltd | ウェハ鏡面加工装置 |
JP2003007658A (ja) * | 2001-06-20 | 2003-01-10 | Speedfam Co Ltd | ウェハノッチの鏡面研磨方法及び鏡面研磨装置 |
JP3759473B2 (ja) * | 2002-05-30 | 2006-03-22 | ジヤトコ株式会社 | 板材の面取り加工方法及び装置 |
JP2004087647A (ja) * | 2002-08-26 | 2004-03-18 | Nihon Micro Coating Co Ltd | 研磨パッド及び方法 |
US20110028074A1 (en) * | 2009-08-03 | 2011-02-03 | Canon Kabushiki Kaisha | Polishing method for a workpiece and polishing tool used for the polishing method |
CN103009421B (zh) * | 2012-12-28 | 2014-09-03 | 福建省闽清县陶瓷机械设备制造厂 | 一种拉紧绝缘子自动修弧机 |
JP6725831B2 (ja) * | 2016-03-04 | 2020-07-22 | ダイトロン株式会社 | ワーク加工装置 |
CN107363680A (zh) * | 2017-08-08 | 2017-11-21 | 格林精密部件(苏州)有限公司 | 一种工件打磨装置 |
CN107350930A (zh) * | 2017-08-08 | 2017-11-17 | 格林精密部件(苏州)有限公司 | 一种新型工件打磨装置 |
CN109926911A (zh) * | 2019-03-04 | 2019-06-25 | 天通日进精密技术有限公司 | 晶圆凹口抛光装置及晶圆凹口抛光方法 |
CN109940498B (zh) * | 2019-03-30 | 2024-03-15 | 浙江联宜电机有限公司 | 齿轮抛光装置 |
CN110883674B (zh) * | 2019-12-06 | 2021-09-17 | 新昌县知贝机械有限公司 | 一种可自动翻转打磨面的船舶甲板用钢板抛光机 |
CN114310626B (zh) * | 2021-12-28 | 2023-10-31 | 无锡强连科技有限公司 | 一种法兰盘抛光机 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US1220287A (en) * | 1915-12-18 | 1917-03-27 | Harry H Styll | Lens-slotting machine. |
US2275483A (en) * | 1937-01-15 | 1942-03-10 | Sullivan Machinery Co | Grinding apparatus |
US4054010A (en) * | 1976-01-20 | 1977-10-18 | Headway Research, Inc. | Apparatus for grinding edges of planar workpieces |
US4174592A (en) * | 1978-09-01 | 1979-11-20 | Bernhardt Paul E | Lapidary device |
JP2541844B2 (ja) * | 1988-09-26 | 1996-10-09 | 信越半導体株式会社 | 半導体ウエ―ハ、ノッチ面取り方法及びその装置 |
US4905425A (en) * | 1988-09-30 | 1990-03-06 | Shin-Etsu Handotai Company Limited | Method for chamfering the notch of a notch-cut semiconductor wafer |
IT1243912B (it) * | 1990-11-20 | 1994-06-28 | Mapos Italiana Srl | Apparecchiatura combinata, per la pulitura e la lucidatura di pezzi metallici in genere. |
JP2571477B2 (ja) * | 1991-06-12 | 1997-01-16 | 信越半導体株式会社 | ウエーハのノッチ部面取り装置 |
US5185965A (en) * | 1991-07-12 | 1993-02-16 | Daito Shoji Co., Ltd. | Method and apparatus for grinding notches of semiconductor wafer |
-
1993
- 1993-07-08 JP JP5193195A patent/JP2798347B2/ja not_active Expired - Fee Related
-
1994
- 1994-06-27 US US08/265,792 patent/US5429544A/en not_active Expired - Fee Related
- 1994-06-30 MY MYPI94001695A patent/MY115312A/en unknown
- 1994-07-01 DE DE69410883T patent/DE69410883T2/de not_active Expired - Fee Related
- 1994-07-01 EP EP94304858A patent/EP0633097B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69410883T2 (de) | 1998-12-17 |
US5429544A (en) | 1995-07-04 |
JP2798347B2 (ja) | 1998-09-17 |
EP0633097B1 (de) | 1998-06-10 |
EP0633097A1 (de) | 1995-01-11 |
MY115312A (en) | 2003-05-31 |
JPH0724714A (ja) | 1995-01-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |