DE69323419D1 - Herstellungsverfahren für einen leiterrahmen. - Google Patents

Herstellungsverfahren für einen leiterrahmen.

Info

Publication number
DE69323419D1
DE69323419D1 DE69323419T DE69323419T DE69323419D1 DE 69323419 D1 DE69323419 D1 DE 69323419D1 DE 69323419 T DE69323419 T DE 69323419T DE 69323419 T DE69323419 T DE 69323419T DE 69323419 D1 DE69323419 D1 DE 69323419D1
Authority
DE
Germany
Prior art keywords
manufacturing
ladder frame
ladder
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69323419T
Other languages
English (en)
Other versions
DE69323419T2 (de
Inventor
Nobuhiko Tada
Naoki Miyanagi
Yoshiaki Shimomura
Shigeyuki Sakurai
Shinya Okumura
Yoshinari Nagano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Construction Machinery Co Ltd
Original Assignee
Hitachi Construction Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Construction Machinery Co Ltd filed Critical Hitachi Construction Machinery Co Ltd
Publication of DE69323419D1 publication Critical patent/DE69323419D1/de
Application granted granted Critical
Publication of DE69323419T2 publication Critical patent/DE69323419T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4828—Etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
    • Y10T29/5147—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool
    • Y10T29/5148—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means
    • Y10T29/515—Plural diverse manufacturing apparatus including means for metal shaping or assembling including composite tool including severing means to trim electric component

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE69323419T 1992-11-24 1993-11-22 Herstellungsverfahren für einen leiterrahmen. Expired - Fee Related DE69323419T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP31361592 1992-11-24
JP16794093 1993-07-07
PCT/JP1993/001707 WO1994013015A1 (en) 1992-11-24 1993-11-22 Lead frame manufacturing method

Publications (2)

Publication Number Publication Date
DE69323419D1 true DE69323419D1 (de) 1999-03-18
DE69323419T2 DE69323419T2 (de) 1999-06-10

Family

ID=26491830

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69323419T Expired - Fee Related DE69323419T2 (de) 1992-11-24 1993-11-22 Herstellungsverfahren für einen leiterrahmen.

Country Status (5)

Country Link
US (1) US5548890A (de)
EP (1) EP0623957B1 (de)
JP (1) JP3083321B2 (de)
DE (1) DE69323419T2 (de)
WO (1) WO1994013015A1 (de)

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JP3413204B2 (ja) * 1994-10-13 2003-06-03 日立建機株式会社 ダムバー加工装置及びダムバー加工方法
JPH0917809A (ja) * 1995-06-30 1997-01-17 Sumitomo Kinzoku Electro Device:Kk 半導体セラミックパッケージの製造方法と装置
KR100392320B1 (ko) * 1996-06-24 2003-11-17 삼성전자주식회사 금도금 단자부 세척장치
US6018865A (en) * 1998-01-20 2000-02-01 Mcms, Inc. Method for calibrating the Z origin position
US6143981A (en) 1998-06-24 2000-11-07 Amkor Technology, Inc. Plastic integrated circuit package and method and leadframe for making the package
US6853086B1 (en) * 1998-10-30 2005-02-08 Seiko Epson Corporation Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument
KR100548014B1 (ko) * 1999-01-25 2006-02-01 삼성테크윈 주식회사 리드프레임 제조방법
US7174626B2 (en) * 1999-06-30 2007-02-13 Intersil Americas, Inc. Method of manufacturing a plated electronic termination
US7157038B2 (en) * 2000-09-20 2007-01-02 Electro Scientific Industries, Inc. Ultraviolet laser ablative patterning of microstructures in semiconductors
SG102609A1 (en) * 2001-01-10 2004-03-26 Aem Tech Engineers Pte Ltd Handling apparatus & method for a lead frame processing system
JP2003045539A (ja) * 2001-05-22 2003-02-14 Enplas Corp コンタクトピン及び電気部品用ソケット
US7102216B1 (en) * 2001-08-17 2006-09-05 Amkor Technology, Inc. Semiconductor package and leadframe with horizontal leads spaced in the vertical direction and method of making
JP2003218620A (ja) 2002-01-24 2003-07-31 Hitachi Cable Ltd 平板アンテナの製造方法
JP2004216385A (ja) * 2003-01-09 2004-08-05 Hitachi Via Mechanics Ltd レーザ穴明け加工方法
JP2005212582A (ja) 2004-01-29 2005-08-11 Honda Motor Co Ltd スクイブ用の点火回路
JP2005334927A (ja) * 2004-05-26 2005-12-08 Yamazaki Mazak Corp レーザ加工機における突起物除去加工装置
US7192809B2 (en) * 2005-02-18 2007-03-20 Texas Instruments Incorporated Low cost method to produce high volume lead frames
JP4198123B2 (ja) * 2005-03-22 2008-12-17 浜松ホトニクス株式会社 レーザ加工方法
EP1921674A4 (de) * 2005-08-10 2010-08-25 Mitsui High Tec Halbleiterbauelement und verfahren zu seiner herstellung
DE102005043413A1 (de) * 2005-09-13 2007-03-15 Robert Bosch Gmbh Grundmodul für einen Bewegungssensor
JP4821854B2 (ja) * 2006-06-14 2011-11-24 パナソニック株式会社 放熱配線基板
KR101165029B1 (ko) * 2007-04-24 2012-07-13 삼성테크윈 주식회사 칩 가열장치, 이를 구비한 플립 칩 본더 및 이를 이용한플립 칩 본딩 방법
JP5766423B2 (ja) * 2010-10-15 2015-08-19 三菱重工業株式会社 レーザ切断装置及びレーザ切断方法
US9805956B2 (en) * 2013-01-23 2017-10-31 Asm Technology Singapore Pte Ltd Lead frame and a method of fabrication thereof
JP6539956B2 (ja) * 2014-08-08 2019-07-10 株式会社カネカ リードフレーム、樹脂成型体、表面実装型電子部品、表面実装型発光装置、及びリードフレーム製造方法
JP6671145B2 (ja) * 2015-10-30 2020-03-25 株式会社レーザーシステム 加工樹脂基板の製造方法およびレーザー加工装置
CN112259462B (zh) * 2020-10-14 2022-06-07 天水华洋电子科技股份有限公司 一种引线框架结构、加工装置及加工方法
CN113829011A (zh) * 2021-09-27 2021-12-24 惠州Tcl移动通信有限公司 一种中框加工方法、中框及移动终端
CN114799552A (zh) * 2022-04-21 2022-07-29 南京睿芯峰电子科技有限公司 集成电路封装激光切筋方法、系统和装置
CN117894686A (zh) * 2023-11-23 2024-04-16 天水华洋电子科技股份有限公司 一种集成电镀蚀刻引线框架快速贴干膜工艺

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JPS6050349B2 (ja) * 1980-07-09 1985-11-08 住友金属鉱山株式会社 リ−ドフレ−ムの製造方法
JPS58123747A (ja) * 1982-01-20 1983-07-23 Hitachi Ltd 半導体装置の製造方法
JPS61125161A (ja) * 1984-11-22 1986-06-12 Mitsui Haitetsuku:Kk リ−ドフレ−ムの製造方法
US4711700A (en) * 1985-07-03 1987-12-08 United Technologies Corporation Method for densifying leadframe conductor spacing
JPS6293095A (ja) * 1985-10-18 1987-04-28 Matsushita Electric Ind Co Ltd レ−ザ加工装置
JPS62114254A (ja) * 1985-11-13 1987-05-26 Mitsui Haitetsuku:Kk リ−ドフレ−ムの製造方法
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US5270570A (en) * 1988-10-10 1993-12-14 Lsi Logic Products Gmbh Lead frame for a multiplicity of terminals
JPH02137687A (ja) * 1988-11-18 1990-05-25 Fuji Electric Co Ltd レーザ集光装置
US4978830A (en) * 1989-02-27 1990-12-18 National Semiconductor Corporation Laser trimming system for semiconductor integrated circuit chip packages
JPH03123063A (ja) * 1989-10-05 1991-05-24 Seiko Epson Corp 半導体装置用リードフレーム及びその製造方法
JP2843645B2 (ja) * 1990-05-30 1999-01-06 大日本印刷株式会社 金属板の加工方法
JPH05251605A (ja) * 1992-03-05 1993-09-28 Hitachi Cable Ltd リードフレームとその製造方法

Also Published As

Publication number Publication date
EP0623957A4 (de) 1995-04-19
EP0623957B1 (de) 1999-02-03
EP0623957A1 (de) 1994-11-09
WO1994013015A1 (en) 1994-06-09
JP3083321B2 (ja) 2000-09-04
DE69323419T2 (de) 1999-06-10
US5548890A (en) 1996-08-27

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