DE69309144T2 - Härtbare Harzzusammensetzung - Google Patents
Härtbare HarzzusammensetzungInfo
- Publication number
- DE69309144T2 DE69309144T2 DE69309144T DE69309144T DE69309144T2 DE 69309144 T2 DE69309144 T2 DE 69309144T2 DE 69309144 T DE69309144 T DE 69309144T DE 69309144 T DE69309144 T DE 69309144T DE 69309144 T2 DE69309144 T2 DE 69309144T2
- Authority
- DE
- Germany
- Prior art keywords
- resin composition
- curable resin
- curable
- composition
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12808192A JP3367964B2 (ja) | 1992-04-21 | 1992-04-21 | 硬化性樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69309144D1 DE69309144D1 (de) | 1997-04-30 |
DE69309144T2 true DE69309144T2 (de) | 1997-07-31 |
Family
ID=14975947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69309144T Expired - Lifetime DE69309144T2 (de) | 1992-04-21 | 1993-04-20 | Härtbare Harzzusammensetzung |
Country Status (4)
Country | Link |
---|---|
US (1) | US5530075A (de) |
EP (1) | EP0567079B1 (de) |
JP (1) | JP3367964B2 (de) |
DE (1) | DE69309144T2 (de) |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4328466C1 (de) * | 1993-08-24 | 1995-04-13 | Siemens Ag | Siloxanhaltiges Gießharzsystem |
US5405892A (en) * | 1994-06-22 | 1995-04-11 | Miles Inc. | Melt-stable, pigmented polycarbonate composition |
US5620825A (en) * | 1995-03-23 | 1997-04-15 | Agfa-Gevaert, N.V. | Polysiloxane modified resins for toner |
DE19523897C2 (de) * | 1995-06-30 | 2002-10-24 | Bosch Gmbh Robert | Verwendung von Silicon-modifizierten Epoxidharzen als Vergußmassen für elektrotechnische oder elektronische Bauteile |
JP3611383B2 (ja) * | 1995-12-14 | 2005-01-19 | 住友ベークライト株式会社 | 電子部品封止用樹脂組成物 |
JPH1025417A (ja) * | 1996-07-08 | 1998-01-27 | Toray Dow Corning Silicone Co Ltd | 硬化性液状組成物、その硬化物、および電子部品 |
DE19630319C1 (de) * | 1996-07-26 | 1998-04-23 | Siemens Ag | Modifiziertes Epoxysiloxan Kondensat, Verfahren zu dessen Herstellung und dessen Einsatz als Low-Stress-Gießharz für die Elektronik und Elektrotechnik |
US20100273011A1 (en) * | 1996-12-20 | 2010-10-28 | Bianxiao Zhong | Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates |
JP4221545B2 (ja) * | 2001-01-05 | 2009-02-12 | 信越化学工業株式会社 | シリコーンゴム接着剤組成物並びにシリコーンゴムと熱可塑性樹脂との一体成形体及びその製造方法 |
KR100524433B1 (ko) * | 2002-07-04 | 2005-10-26 | 주식회사 동우 이앤씨 건축사사무소 | 방수성 수지 조성물 및 그 제조방법 |
TWI345576B (en) | 2003-11-07 | 2011-07-21 | Dow Corning Toray Silicone | Curable silicone composition and cured product thereof |
JP5285838B2 (ja) | 2003-12-26 | 2013-09-11 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物およびその硬化物 |
JP4664032B2 (ja) | 2004-10-13 | 2011-04-06 | 東レ・ダウコーニング株式会社 | シリルアルコキシメチルハライドの製造方法 |
CN101120054B (zh) * | 2005-02-16 | 2013-01-09 | 陶氏康宁公司 | 增强的有机硅树脂膜及其制备方法 |
US8092910B2 (en) * | 2005-02-16 | 2012-01-10 | Dow Corning Toray Co., Ltd. | Reinforced silicone resin film and method of preparing same |
JP5166677B2 (ja) * | 2005-03-15 | 2013-03-21 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
JP4931366B2 (ja) | 2005-04-27 | 2012-05-16 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
JP5392805B2 (ja) * | 2005-06-28 | 2014-01-22 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン樹脂組成物および光学部材 |
EP1910471B1 (de) * | 2005-08-04 | 2012-06-06 | Dow Corning Corporation | Verstärkte silikonharzfolie und herstellungsverfahren dafür |
US20090130463A1 (en) * | 2005-10-05 | 2009-05-21 | John Dean Albaugh | Coated Substrates and Methods for their Preparation |
EP1969065B1 (de) * | 2005-12-21 | 2011-07-27 | Dow Corning Corporation | Silikonharzfilm, herstellungsverfahren dafür und nanomaterialgefüllte silikonzusammensetzung |
EP1973964B1 (de) * | 2006-01-19 | 2011-07-06 | Dow Corning Corporation | Silikonharzfilm, herstellungsverfahren dafür und mit nanomaterial gefüllte silikonzusammensetzung |
WO2007097835A2 (en) | 2006-02-20 | 2007-08-30 | Dow Corning Corporation | Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition |
JP5285846B2 (ja) | 2006-09-11 | 2013-09-11 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
JP5388409B2 (ja) * | 2006-09-28 | 2014-01-15 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物およびその硬化物 |
CN101522838B (zh) * | 2006-10-05 | 2012-07-04 | 陶氏康宁公司 | 有机硅树脂膜及其制备方法 |
WO2008088407A1 (en) * | 2006-12-20 | 2008-07-24 | Dow Corning Corporation | Glass substrates coated or laminated with multiple layers of cured silicone resin compositions |
JP5357046B2 (ja) * | 2006-12-20 | 2013-12-04 | ダウ・コーニング・コーポレイション | 硬化シリコーン組成物で被覆またはラミネートされたガラス基板 |
KR20090107529A (ko) * | 2007-02-06 | 2009-10-13 | 다우 코닝 코포레이션 | 실리콘 수지, 실리콘 조성물, 피복된 기판 및 강화 실리콘 수지 필름 |
JP5377334B2 (ja) * | 2007-02-22 | 2013-12-25 | ダウ コーニング コーポレーション | 強化シリコーン樹脂フィルム |
WO2008103228A1 (en) * | 2007-02-22 | 2008-08-28 | Dow Corning Corporation | Reinforced silicone resin films |
US20100087581A1 (en) * | 2007-02-22 | 2010-04-08 | Mark Fisher | Reinforced Silicone Resin Film and Method of Preparing Same |
CN101627096B (zh) * | 2007-02-22 | 2012-11-07 | 道康宁公司 | 增强硅树脂膜及其制备方法 |
JP5269885B2 (ja) * | 2007-05-01 | 2013-08-21 | ダウ・コーニング・コーポレイション | ナノ材料充填シリコーン組成物及び強化シリコーン樹脂フィルム |
EP2142589A2 (de) * | 2007-05-01 | 2010-01-13 | Dow Corning Corporation | Verstärkte silikonharzfolie |
CN101939396B (zh) * | 2007-09-19 | 2012-11-21 | 东丽株式会社 | 电子部件用粘合剂组合物及使用其的电子部件用粘合剂片材 |
JP5547369B2 (ja) * | 2007-09-28 | 2014-07-09 | 東レ・ダウコーニング株式会社 | 硬化性液状エポキシ樹脂組成物およびその硬化物 |
EP2201063B1 (de) * | 2007-10-12 | 2011-07-06 | Dow Corning Corporation | Folie aus verstärktem silikonharz und nanofasergefüllte silikonzusammensetzung |
WO2009051905A2 (en) * | 2007-10-12 | 2009-04-23 | Dow Corning Corporation | Aluminum oxide dispersion and method of preparing same |
JP5422109B2 (ja) | 2007-10-16 | 2014-02-19 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物およびその硬化物 |
US20110027584A1 (en) * | 2008-03-04 | 2011-02-03 | Bianxiao Zhong | Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates |
WO2009111193A1 (en) * | 2008-03-04 | 2009-09-11 | Dow Corning Corporation | Borosiloxane composition, borosiloxane adhesive, coated and laminated substrates |
EP2285565B1 (de) * | 2008-05-27 | 2013-06-26 | Dow Corning Corporation | Klebeband und damit beschichtetes glas |
TW201004795A (en) * | 2008-07-31 | 2010-02-01 | Dow Corning | Laminated glass |
WO2012064534A1 (en) | 2010-11-09 | 2012-05-18 | Dow Corning Corporation | Hydrosilylation cured silicone resins plasticized by organophosphorous compounds |
TW201245352A (en) | 2011-03-25 | 2012-11-16 | Dow Corning | Fluoro surface segregated monolayer coating |
EP2706095B1 (de) * | 2011-05-04 | 2021-03-03 | LG Chem, Ltd. | Härtbare zusammensetzung |
TWI473842B (zh) * | 2011-11-25 | 2015-02-21 | Lg Chemical Ltd | 可固化之組成物 |
TWI498356B (zh) * | 2011-11-25 | 2015-09-01 | Lg Chemical Ltd | 有機聚矽氧烷 |
EP2784123B1 (de) * | 2011-11-25 | 2019-09-04 | LG Chem, Ltd. | Härtbare zusammensetzung |
KR101562091B1 (ko) * | 2011-11-25 | 2015-10-21 | 주식회사 엘지화학 | 경화성 조성물 |
WO2013077701A1 (ko) * | 2011-11-25 | 2013-05-30 | 주식회사 엘지화학 | 오가노폴리실록산의 제조 방법 |
CN103987787B (zh) * | 2011-11-25 | 2016-08-24 | Lg化学株式会社 | 可固化组合物 |
KR20140145198A (ko) * | 2012-04-12 | 2014-12-22 | 다우 코닝 코포레이션 | 실리콘-폴리에스테르 조성물 |
WO2015100258A1 (en) * | 2013-12-23 | 2015-07-02 | Dow Corning Corporation | Uv-curable silicone compositions and anti-dust coating compositions containing same |
JP6681317B2 (ja) * | 2016-11-21 | 2020-04-15 | 信越化学工業株式会社 | 紫外線硬化型シリコーン組成物及び硬化皮膜形成方法 |
CN111574714B (zh) * | 2020-05-15 | 2021-08-03 | 浙江新安化工集团股份有限公司 | 一种聚硅氧烷的连续化生产系统及生产方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB834326A (en) * | 1956-10-29 | 1960-05-04 | Midland Silicones Ltd | Organosilicon compounds |
JPS56136816A (en) * | 1980-03-31 | 1981-10-26 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
JPS56145942A (en) * | 1980-04-14 | 1981-11-13 | Shin Etsu Chem Co Ltd | Curable resin composition |
US4370358A (en) * | 1980-09-22 | 1983-01-25 | General Electric Company | Ultraviolet curable silicone adhesives |
JPS6058425A (ja) * | 1983-09-07 | 1985-04-04 | Hitachi Chem Co Ltd | エポキシ樹脂組成物 |
JPS61195129A (ja) * | 1985-02-22 | 1986-08-29 | Toray Silicone Co Ltd | 有機けい素重合体の製造方法 |
JPS61225253A (ja) * | 1985-03-29 | 1986-10-07 | Toray Silicone Co Ltd | 熱硬化性樹脂組成物 |
JPS6451467A (en) * | 1987-08-21 | 1989-02-27 | Toray Silicone Co | Curable resin composition |
JPH0791475B2 (ja) * | 1988-02-29 | 1995-10-04 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性樹脂組成物 |
JP2630986B2 (ja) * | 1988-05-18 | 1997-07-16 | 東レ・ダウコーニング・シリコーン株式会社 | アルカリ可溶性オルガノポリシロキサン |
JP2938158B2 (ja) * | 1990-07-20 | 1999-08-23 | 住友ベークライト株式会社 | 半導体封止用エポキシ樹脂組成物 |
US5158991A (en) * | 1990-08-24 | 1992-10-27 | General Electric Company | Epoxy-functionalized siloxane resin copolymers as controlled release additives |
JPH0578450A (ja) * | 1991-09-20 | 1993-03-30 | Toshiba Silicone Co Ltd | 電気・電子部品封止用樹脂組成物 |
JP2511348B2 (ja) * | 1991-10-17 | 1996-06-26 | 東レ・ダウコーニング・シリコーン株式会社 | オルガノポリシロキサンおよびその製造方法 |
-
1992
- 1992-04-21 JP JP12808192A patent/JP3367964B2/ja not_active Expired - Fee Related
-
1993
- 1993-04-20 EP EP93106397A patent/EP0567079B1/de not_active Expired - Lifetime
- 1993-04-20 DE DE69309144T patent/DE69309144T2/de not_active Expired - Lifetime
-
1994
- 1994-08-15 US US08/290,574 patent/US5530075A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JP3367964B2 (ja) | 2003-01-20 |
EP0567079B1 (de) | 1997-03-26 |
US5530075A (en) | 1996-06-25 |
DE69309144D1 (de) | 1997-04-30 |
JPH05295084A (ja) | 1993-11-09 |
EP0567079A1 (de) | 1993-10-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: KROHER, STROBEL RECHTS- UND PATENTANWAELTE, 80336 |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: DR. SCHOEN & PARTNER, 80336 MUENCHEN |