DE69232826D1 - Heteroübergangsbauelement mit einer mehrschichtigen Basis - Google Patents

Heteroübergangsbauelement mit einer mehrschichtigen Basis

Info

Publication number
DE69232826D1
DE69232826D1 DE69232826T DE69232826T DE69232826D1 DE 69232826 D1 DE69232826 D1 DE 69232826D1 DE 69232826 T DE69232826 T DE 69232826T DE 69232826 T DE69232826 T DE 69232826T DE 69232826 D1 DE69232826 D1 DE 69232826D1
Authority
DE
Germany
Prior art keywords
multilayer base
heterojunction device
heterojunction
multilayer
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69232826T
Other languages
English (en)
Other versions
DE69232826T2 (de
Inventor
Burhan Bayraktaroglu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of DE69232826D1 publication Critical patent/DE69232826D1/de
Publication of DE69232826T2 publication Critical patent/DE69232826T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73—Bipolar junction transistors
    • H01L29/737—Hetero-junction transistors
    • H01L29/7371—Vertical transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1004—Base region of bipolar transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70—Bipolar devices
    • H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/73—Bipolar junction transistors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/072—Heterojunctions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Bipolar Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
DE69232826T 1991-03-21 1992-03-20 Heteroübergangsbauelement mit einer mehrschichtigen Basis Expired - Fee Related DE69232826T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/672,809 US5132764A (en) 1991-03-21 1991-03-21 Multilayer base heterojunction bipolar transistor

Publications (2)

Publication Number Publication Date
DE69232826D1 true DE69232826D1 (de) 2002-11-28
DE69232826T2 DE69232826T2 (de) 2003-08-14

Family

ID=24700091

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69232826T Expired - Fee Related DE69232826T2 (de) 1991-03-21 1992-03-20 Heteroübergangsbauelement mit einer mehrschichtigen Basis

Country Status (5)

Country Link
US (2) US5132764A (de)
EP (1) EP0504925B1 (de)
JP (1) JPH06132296A (de)
KR (1) KR100289473B1 (de)
DE (1) DE69232826T2 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5132764A (en) * 1991-03-21 1992-07-21 Texas Instruments Incorporated Multilayer base heterojunction bipolar transistor
US5208184A (en) * 1991-04-30 1993-05-04 Texas Instruments Incorporated P-n junction diffusion barrier employing mixed dopants
US5352912A (en) * 1991-11-13 1994-10-04 International Business Machines Corporation Graded bandgap single-crystal emitter heterojunction bipolar transistor
JPH0669227A (ja) * 1992-05-29 1994-03-11 Texas Instr Inc <Ti> 化合物半導体のヘテロ接合バイポーラトランジスタ及びその製造方法
US5321279A (en) * 1992-11-09 1994-06-14 Texas Instruments Incorporated Base ballasting
US5365077A (en) * 1993-01-22 1994-11-15 Hughes Aircraft Company Gain-stable NPN heterojunction bipolar transistor
US5404028A (en) * 1993-01-22 1995-04-04 Hughes Aircraft Company Electrical junction device with lightly doped buffer region to precisely locate a p-n junction
JP3117831B2 (ja) * 1993-02-17 2000-12-18 シャープ株式会社 半導体装置
DE19718624A1 (de) * 1997-05-02 1998-11-05 Daimler Benz Ag Heterobipolartransistor mit Mehrschicht-Emitterstruktur
US6107151A (en) * 1997-05-09 2000-08-22 Research Triangle Institute Heterojunction bipolar transistor and method of manufacturing
JPH10335345A (ja) * 1997-06-04 1998-12-18 Mitsubishi Electric Corp ヘテロ接合バイポーラトランジスタおよびその製造方法
KR100299097B1 (ko) * 1998-02-05 2001-11-22 김효근 이종베이스도핑소스를이용한이종접합쌍극자소자구조
JP2000012552A (ja) * 1998-06-17 2000-01-14 Toshiba Corp 半導体装置の製造方法及び半導体装置
JP2000068284A (ja) * 1998-08-19 2000-03-03 Sharp Corp ヘテロ接合バイポーラトランジスタの製造方法及びパワーアンプ
US6368930B1 (en) 1998-10-02 2002-04-09 Ziptronix Self aligned symmetric process and device
TW512529B (en) 2000-06-14 2002-12-01 Infineon Technologies Ag Silicon bipolar transistor, circuit arrangement and method for producing a silicon bipolar transistor
US6670654B2 (en) 2002-01-09 2003-12-30 International Business Machines Corporation Silicon germanium heterojunction bipolar transistor with carbon incorporation
US7019383B2 (en) 2003-02-26 2006-03-28 Skyworks Solutions, Inc. Gallium arsenide HBT having increased performance and method for its fabrication
US6784747B1 (en) 2003-03-20 2004-08-31 Analog Devices, Inc. Amplifier circuit
US6816015B2 (en) * 2003-03-27 2004-11-09 Analog Devices, Inc. Amplifier circuit having a plurality of first and second base resistors
JP2005150531A (ja) 2003-11-18 2005-06-09 Nec Compound Semiconductor Devices Ltd 半導体装置
JP3853341B2 (ja) * 2003-11-28 2006-12-06 シャープ株式会社 バイポーラトランジスタ
TWI512905B (zh) * 2012-06-13 2015-12-11 Win Semiconductors Corp 化合物半導體元件晶圓整合結構
US11133405B2 (en) * 2018-11-20 2021-09-28 Visual Photonics Epitaxy Co., Ltd. High ruggedness heterojunction bipolar transistor

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4573064A (en) * 1981-11-02 1986-02-25 Texas Instruments Incorporated GaAs/GaAlAs Heterojunction bipolar integrated circuit devices
US4593305A (en) * 1983-05-17 1986-06-03 Kabushiki Kaisha Toshiba Heterostructure bipolar transistor
US4794440A (en) * 1983-05-25 1988-12-27 American Telephone And Telegraph Company, At&T Bell Laboratories Heterojunction bipolar transistor
US4672414A (en) * 1985-06-28 1987-06-09 Texas Instruments Incorporated Planar heterojunction bipolar device and method
JPS63181486A (ja) * 1987-01-23 1988-07-26 Hiroshima Univ 半導体発光装置
KR880010509A (ko) * 1987-02-11 1988-10-10 오레그 이. 앨버 전계효과 트랜지스터
JPS63276267A (ja) * 1987-05-08 1988-11-14 Fujitsu Ltd 半導体装置の製造方法
JPH01238161A (ja) * 1988-03-18 1989-09-22 Fujitsu Ltd 半導体装置及びその製造方法
EP0343563A3 (de) * 1988-05-26 1990-05-09 Siemens Aktiengesellschaft Bipolartransistorstruktur mit reduziertem Basiswiderstand und Verfahren zur Herstellung eines Basisanschlussbereiches für eine Bipolartransistorstruktur
US4987468A (en) * 1988-06-17 1991-01-22 Xerox Corporation Lateral heterojunction bipolar transistor (LHBT) and suitability thereof as a hetero transverse junction (HTJ) laser
US4948752A (en) * 1988-08-10 1990-08-14 Itt Corporation Method of making sagfets on buffer layers
JPH02199873A (ja) * 1989-01-30 1990-08-08 Hitachi Ltd 半導体装置
JPH0435037A (ja) * 1990-05-31 1992-02-05 Toshiba Corp ヘテロ接合バイポーラトランジスタ
DE69032597T2 (de) * 1990-02-20 1999-03-25 Kabushiki Kaisha Toshiba, Kawasaki, Kanagawa Bipolartransistor mit Heteroübergang
US5077231A (en) * 1991-03-15 1991-12-31 Texas Instruments Incorporated Method to integrate HBTs and FETs
US5132764A (en) * 1991-03-21 1992-07-21 Texas Instruments Incorporated Multilayer base heterojunction bipolar transistor
US5192698A (en) * 1992-03-17 1993-03-09 The United State Of America As Represented By The Secretary Of The Air Force Making staggered complementary heterostructure FET

Also Published As

Publication number Publication date
EP0504925A3 (en) 1993-06-16
KR100289473B1 (ko) 2001-06-01
US5468658A (en) 1995-11-21
EP0504925A2 (de) 1992-09-23
DE69232826T2 (de) 2003-08-14
US5132764A (en) 1992-07-21
KR920018968A (ko) 1992-10-22
EP0504925B1 (de) 2002-10-23
JPH06132296A (ja) 1994-05-13

Similar Documents

Publication Publication Date Title
DE69232826D1 (de) Heteroübergangsbauelement mit einer mehrschichtigen Basis
DE69230419D1 (de) Gerät mit einer Mensch-Maschine-Schnittstelle
DE69829614D1 (de) Lithographiegerät mit einer positioniervorrichtung mit zwei objekthaltern
DE69515387D1 (de) Verriegelungseinrichtung mit einer Riegelfunktion
DE69227411D1 (de) Elektronische Vorrichtung mit einer abnehmbaren Einheit ausgerüstet
DK0441643T3 (da) Inhaleringsapparat
DE69418028D1 (de) Laterale halbleiter-auf-isolator-halbleiteranordnung mit einer vergrabenen diode
DE69232401D1 (de) Mehrfachmedien-Kommunikationsvorrichtung
DE69406049D1 (de) Lichtmittierende Halbleitervorrichtung mit einer dritten Begrenzungsschicht
DE69130152D1 (de) Mikrorechner mit eingebautem d/a-wandler
DE58905087D1 (de) Tisch mit einer verbindungseinrichtung.
DE59205040D1 (de) Motorrad mit einer achsschenkellenkung
DE69203889D1 (de) Halbleiteranordnung mit einer Füllung.
DE69428378D1 (de) Halbleiteranordnung mit einer Durchgangsleitung
DE69209665D1 (de) Blattwendevorrichtung mit mehreren Ausgaberichtungen
DE59104797D1 (de) Heckbagger mit einer Verriegelungsvorrichtung.
DE69118750D1 (de) Halbleiteranordnung mit einer Wärmesenke
DE69229518D1 (de) Kommunikationseinrichtung mit Fehlertoleranz
DE69211457D1 (de) Blattstapeleinrichtung
DE69213321D1 (de) In einer TE11N-Mode betriebener Linearbeschleuniger
DE69202259D1 (de) Gerät zur Zusammenarbeit mit einer Kassette.
DE69216790D1 (de) Stapelvorrichtung
DE59611135D1 (de) Auflagetisch mit einer Spannvorrichtung
DE69211262D1 (de) Blattstapeleinrichtung mit zwei Ecken
DE69231091D1 (de) Integrierte Halbleiterschaltung mit einer Schutzvorrichtung

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee