DE69223091T2 - Verfahren zur Herstellung einer lichtemittierenden Diode - Google Patents

Verfahren zur Herstellung einer lichtemittierenden Diode

Info

Publication number
DE69223091T2
DE69223091T2 DE69223091T DE69223091T DE69223091T2 DE 69223091 T2 DE69223091 T2 DE 69223091T2 DE 69223091 T DE69223091 T DE 69223091T DE 69223091 T DE69223091 T DE 69223091T DE 69223091 T2 DE69223091 T2 DE 69223091T2
Authority
DE
Germany
Prior art keywords
manufacturing
light emitting
emitting diode
diode
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69223091T
Other languages
English (en)
Other versions
DE69223091D1 (de
Inventor
Yoshio Kurita
Yuji Sakamoto
Atsushi Imai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP3150321A external-priority patent/JP2600028B2/ja
Priority claimed from JP3219980A external-priority patent/JP2774885B2/ja
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Application granted granted Critical
Publication of DE69223091D1 publication Critical patent/DE69223091D1/de
Publication of DE69223091T2 publication Critical patent/DE69223091T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
DE69223091T 1991-06-21 1992-06-05 Verfahren zur Herstellung einer lichtemittierenden Diode Expired - Fee Related DE69223091T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP3150321A JP2600028B2 (ja) 1991-06-21 1991-06-21 半導体部品の製造方法
JP3219980A JP2774885B2 (ja) 1991-08-30 1991-08-30 発光ダイオードの製造方法

Publications (2)

Publication Number Publication Date
DE69223091D1 DE69223091D1 (de) 1997-12-18
DE69223091T2 true DE69223091T2 (de) 1998-03-05

Family

ID=26479961

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69223091T Expired - Fee Related DE69223091T2 (de) 1991-06-21 1992-06-05 Verfahren zur Herstellung einer lichtemittierenden Diode

Country Status (4)

Country Link
US (1) US5221641A (de)
EP (1) EP0521312B1 (de)
KR (1) KR100239332B1 (de)
DE (1) DE69223091T2 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4340862C2 (de) * 1993-12-01 2002-04-11 Vishay Semiconductor Gmbh Vergießvorrichtung zum Herstellen von optoelektronischen Bauelementen
DE4340864C2 (de) * 1993-12-01 1996-08-01 Telefunken Microelectron Vorrichtung und Verfahren zum Herstellen von optoelektronischen Bauelementen
DE19549818B4 (de) 1995-09-29 2010-03-18 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiter-Bauelement
JPH09307144A (ja) * 1996-05-14 1997-11-28 Matsushita Electric Ind Co Ltd 発光素子及びその製造方法
TW414924B (en) * 1998-05-29 2000-12-11 Rohm Co Ltd Semiconductor device of resin package
TW436856B (en) * 1999-07-16 2001-05-28 Taiwan Oasis Entpr Co Ltd Method for producing LED Christmas lightbulb and structure thereof
TW433551U (en) * 1999-10-26 2001-05-01 You Shang Hua Improvement of cup base for light emitting diode chip
JP4926337B2 (ja) * 2000-06-28 2012-05-09 アバゴ・テクノロジーズ・ジェネラル・アイピー（シンガポール）プライベート・リミテッド 光源
NZ574520A (en) * 2002-11-27 2011-02-25 Dmi Biosciences Inc Use of casein which is at least 10% dephosphorylated for the treatment of diseases and conditions mediated by increased phosphorylation
US20050036311A1 (en) * 2003-08-14 2005-02-17 Li-Wen Liu LED light string manufacturing method
US7352583B2 (en) 2005-10-03 2008-04-01 Remy Technologies, L.L.C. Flexible lead for a pressfit diode bridge
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
KR101216932B1 (ko) * 2006-04-03 2013-01-18 서울반도체 주식회사 램프형 발광소자
TWM340555U (en) * 2007-11-23 2008-09-11 Everlight Electronics Co Ltd Light emmitting diode device
KR101859149B1 (ko) 2011-04-14 2018-05-17 엘지이노텍 주식회사 발광 소자 패키지
KR101103674B1 (ko) 2010-06-01 2012-01-11 엘지이노텍 주식회사 발광 소자

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2444440A (en) * 1946-09-27 1948-07-06 Nordberg Manufacturing Co Internal-combustion engine
US3820237A (en) * 1971-05-17 1974-06-28 Northern Electric Co Process for packaging light emitting devices
JPS5527463B2 (de) * 1973-02-28 1980-07-21
US4209358A (en) * 1978-12-04 1980-06-24 Western Electric Company, Incorporated Method of fabricating a microelectronic device utilizing unfilled epoxy adhesive
JPS564047A (en) * 1979-06-26 1981-01-16 Nissan Motor Co Ltd Lamination type membrane-covered oxygen sensor
FR2466866A1 (fr) * 1979-10-05 1981-04-10 Thomson Csf Procede de couplage entre une fibre optique et une diode opto-electronique, et tete d'emission ou de reception realisee par ce procede
JPH0612796B2 (ja) * 1984-06-04 1994-02-16 株式会社日立製作所 半導体装置
JPS6175570A (ja) * 1984-09-18 1986-04-17 Stanley Electric Co Ltd 車両用灯具の光源ユニツトの製造方法
JPS62252181A (ja) * 1986-04-24 1987-11-02 Stanley Electric Co Ltd 光半導体素子の製造方法

Also Published As

Publication number Publication date
EP0521312B1 (de) 1997-11-12
US5221641A (en) 1993-06-22
KR930001501A (ko) 1993-01-16
DE69223091D1 (de) 1997-12-18
EP0521312A1 (de) 1993-01-07
KR100239332B1 (ko) 2000-01-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee