DE69219716D1 - Integrierte Schaltungsanordnung mit verbesserter kapazitiver Isolierung des Substrates - Google Patents

Integrierte Schaltungsanordnung mit verbesserter kapazitiver Isolierung des Substrates

Info

Publication number
DE69219716D1
DE69219716D1 DE69219716T DE69219716T DE69219716D1 DE 69219716 D1 DE69219716 D1 DE 69219716D1 DE 69219716 T DE69219716 T DE 69219716T DE 69219716 T DE69219716 T DE 69219716T DE 69219716 D1 DE69219716 D1 DE 69219716D1
Authority
DE
Germany
Prior art keywords
substrate
integrated circuit
circuit arrangement
capacitive isolation
improved capacitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69219716T
Other languages
English (en)
Other versions
DE69219716T2 (de
Inventor
Matthew J Hadwin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxim Integrated Products Inc
Original Assignee
Maxim Integrated Products Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maxim Integrated Products Inc filed Critical Maxim Integrated Products Inc
Publication of DE69219716D1 publication Critical patent/DE69219716D1/de
Application granted granted Critical
Publication of DE69219716T2 publication Critical patent/DE69219716T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
DE69219716T 1991-10-07 1992-10-05 Integrierte Schaltungsanordnung mit verbesserter kapazitiver Isolierung des Substrates Expired - Fee Related DE69219716T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/772,753 US5151775A (en) 1991-10-07 1991-10-07 Integrated circuit device having improved substrate capacitance isolation

Publications (2)

Publication Number Publication Date
DE69219716D1 true DE69219716D1 (de) 1997-06-19
DE69219716T2 DE69219716T2 (de) 1997-09-04

Family

ID=25096112

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69219716T Expired - Fee Related DE69219716T2 (de) 1991-10-07 1992-10-05 Integrierte Schaltungsanordnung mit verbesserter kapazitiver Isolierung des Substrates

Country Status (4)

Country Link
US (1) US5151775A (de)
EP (1) EP0536972B1 (de)
JP (1) JPH0621335A (de)
DE (1) DE69219716T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5354695A (en) 1992-04-08 1994-10-11 Leedy Glenn J Membrane dielectric isolation IC fabrication
US6714625B1 (en) 1992-04-08 2004-03-30 Elm Technology Corporation Lithography device for semiconductor circuit pattern generation
JP3283984B2 (ja) * 1993-12-28 2002-05-20 株式会社東芝 半導体集積回路装置
JPH09167827A (ja) * 1995-12-14 1997-06-24 Tokai Rika Co Ltd 半導体装置
WO1998020553A1 (en) * 1996-11-05 1998-05-14 Philips Electronics N.V. Semiconductor device with a high-frequency bipolar transistor on an insulating substrate
US6551857B2 (en) 1997-04-04 2003-04-22 Elm Technology Corporation Three dimensional structure integrated circuits
US5915167A (en) 1997-04-04 1999-06-22 Elm Technology Corporation Three dimensional structure memory
US6748994B2 (en) 2001-04-11 2004-06-15 Avery Dennison Corporation Label applicator, method and label therefor
EP1281976A1 (de) * 2001-07-30 2003-02-05 aix ACCT Systems GmbH Elektrometer für die Messung schneller Spannungsänderungen
US7402897B2 (en) 2002-08-08 2008-07-22 Elm Technology Corporation Vertical system integration
US6833603B1 (en) 2003-08-11 2004-12-21 International Business Machines Corporation Dynamically patterned shielded high-Q inductor

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58155752A (ja) * 1982-03-12 1983-09-16 Hitachi Ltd 半導体記憶装置
US4646002A (en) * 1984-05-10 1987-02-24 Regents Of The University Of Minnesota Circuit for high impedance broad band probe
JPS61131556A (ja) * 1984-11-30 1986-06-19 Nec Corp 半導体装置
JPS61248540A (ja) * 1985-04-26 1986-11-05 Mitsubishi Electric Corp 入力保護装置
JP2506993B2 (ja) * 1988-10-04 1996-06-12 松下電子工業株式会社 半導体装置
US5043792A (en) * 1989-04-17 1991-08-27 Nec Corporation Integrated circuit having wiring strips for propagating in-phase signals
US5077595A (en) * 1990-01-25 1991-12-31 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JP2788783B2 (ja) * 1990-08-29 1998-08-20 日本電気アイシーマイコンシステム株式会社 半導体集積回路

Also Published As

Publication number Publication date
EP0536972A2 (de) 1993-04-14
EP0536972A3 (en) 1993-06-16
DE69219716T2 (de) 1997-09-04
US5151775A (en) 1992-09-29
EP0536972B1 (de) 1997-05-14
JPH0621335A (ja) 1994-01-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee