DE69218069D1 - Verfahren zur Herstellung eines planarisierten Halbleiterbauelementes - Google Patents

Verfahren zur Herstellung eines planarisierten Halbleiterbauelementes

Info

Publication number
DE69218069D1
DE69218069D1 DE69218069T DE69218069T DE69218069D1 DE 69218069 D1 DE69218069 D1 DE 69218069D1 DE 69218069 T DE69218069 T DE 69218069T DE 69218069 T DE69218069 T DE 69218069T DE 69218069 D1 DE69218069 D1 DE 69218069D1
Authority
DE
Germany
Prior art keywords
production
semiconductor component
planarized semiconductor
planarized
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69218069T
Other languages
English (en)
Other versions
DE69218069T2 (de
Inventor
Shinichi Takeshiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Electronics Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Publication of DE69218069D1 publication Critical patent/DE69218069D1/de
Application granted granted Critical
Publication of DE69218069T2 publication Critical patent/DE69218069T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76819—Smoothing of the dielectric
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • H01L21/31055—Planarisation of the insulating layers involving a dielectric removal step the removal being a chemical etching step, e.g. dry etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Drying Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
DE69218069T 1991-08-26 1992-08-20 Verfahren zur Herstellung eines planarisierten Halbleiterbauelementes Expired - Fee Related DE69218069T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3212536A JP2913918B2 (ja) 1991-08-26 1991-08-26 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
DE69218069D1 true DE69218069D1 (de) 1997-04-17
DE69218069T2 DE69218069T2 (de) 1997-06-26

Family

ID=16624301

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69218069T Expired - Fee Related DE69218069T2 (de) 1991-08-26 1992-08-20 Verfahren zur Herstellung eines planarisierten Halbleiterbauelementes

Country Status (4)

Country Link
US (1) US5316980A (de)
EP (1) EP0529954B1 (de)
JP (1) JP2913918B2 (de)
DE (1) DE69218069T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05243402A (ja) * 1992-03-03 1993-09-21 Nec Corp 半導体装置の製造方法
US5461010A (en) * 1994-06-13 1995-10-24 Industrial Technology Research Institute Two step etch back spin-on-glass process for semiconductor planarization
US6297110B1 (en) 1994-07-29 2001-10-02 Stmicroelectronics, Inc. Method of forming a contact in an integrated circuit
US5567658A (en) * 1994-09-01 1996-10-22 Taiwan Semiconductor Manufacturing Company, Ltd. Method for minimizing peeling at the surface of spin-on glasses
KR0172539B1 (ko) * 1995-05-22 1999-03-30 김주용 반도체 소자의 에스.오.지막 형성방법
US5814186A (en) * 1995-08-28 1998-09-29 Advanced Micro Devices, Inc. SOG etchant gas and method for using same
US5679211A (en) * 1995-09-18 1997-10-21 Taiwan Semiconductor Manufacturing Company, Ltd. Spin-on-glass etchback planarization process using an oxygen plasma to remove an etchback polymer residue
US5821163A (en) * 1996-02-13 1998-10-13 Vlsi Technology, Inc. Method for achieving accurate SOG etchback selectivity
US5792705A (en) * 1996-06-28 1998-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Optimized planarization process for SOG filled vias
US6051502A (en) * 1997-10-20 2000-04-18 Micron Technology, Inc. Methods of forming conductive components and methods of forming conductive lines
US6391786B1 (en) * 1997-12-31 2002-05-21 Lam Research Corporation Etching process for organic anti-reflective coating
TW398053B (en) * 1998-07-31 2000-07-11 United Microelectronics Corp Manufacturing of shallow trench isolation
US6080676A (en) * 1998-09-17 2000-06-27 Advanced Micro Devices, Inc. Device and method for etching spacers formed upon an integrated circuit gate conductor
US6281132B1 (en) 1998-10-06 2001-08-28 Advanced Micro Devices, Inc. Device and method for etching nitride spacers formed upon an integrated circuit gate conductor
JP2009016375A (ja) * 2007-06-29 2009-01-22 Oki Electric Ind Co Ltd 半導体装置の製造方法及び装置
US9330910B2 (en) 2010-11-01 2016-05-03 The Board Of Trustees Of The University Of Illinois Method of forming an array of nanostructures
CN102543838B (zh) * 2010-12-22 2014-01-29 中国科学院微电子研究所 半导体器件的制造方法
CN102569062B (zh) * 2010-12-22 2015-06-03 中国科学院微电子研究所 Sog层和光抗蚀剂层的反应离子刻蚀方法
CN102543839B (zh) 2010-12-22 2014-01-08 中国科学院微电子研究所 层间电介质层的平面化方法
CN102903621B (zh) 2011-07-29 2016-02-17 中国科学院微电子研究所 半导体器件的制造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4511430A (en) * 1984-01-30 1985-04-16 International Business Machines Corporation Control of etch rate ratio of SiO2 /photoresist for quartz planarization etch back process
US4654113A (en) * 1984-02-10 1987-03-31 Fujitsu Limited Process for fabricating a semiconductor device
US4676868A (en) * 1986-04-23 1987-06-30 Fairchild Semiconductor Corporation Method for planarizing semiconductor substrates
US4676867A (en) * 1986-06-06 1987-06-30 Rockwell International Corporation Planarization process for double metal MOS using spin-on glass as a sacrificial layer
FR2627902B1 (fr) * 1988-02-26 1990-06-22 Philips Nv Procede pour aplanir la surface d'un dispositif semiconducteur
JPH03177022A (ja) * 1989-12-06 1991-08-01 Oki Electric Ind Co Ltd 半導体装置の製造方法
JPH04245628A (ja) * 1991-01-31 1992-09-02 Hitachi Ltd 絶縁膜の形成方法
JPH04370934A (ja) * 1991-06-20 1992-12-24 Fujitsu Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JP2913918B2 (ja) 1999-06-28
DE69218069T2 (de) 1997-06-26
EP0529954A1 (de) 1993-03-03
JPH0555181A (ja) 1993-03-05
EP0529954B1 (de) 1997-03-12
US5316980A (en) 1994-05-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: NEC ELECTRONICS CORP., KAWASAKI, KANAGAWA, JP

8339 Ceased/non-payment of the annual fee