DE69215192D1 - Leiterplatte mit abgeschirmten bereichen sowie herstellungsverfahren einer solchen leiterplatte - Google Patents

Leiterplatte mit abgeschirmten bereichen sowie herstellungsverfahren einer solchen leiterplatte

Info

Publication number
DE69215192D1
DE69215192D1 DE69215192T DE69215192T DE69215192D1 DE 69215192 D1 DE69215192 D1 DE 69215192D1 DE 69215192 T DE69215192 T DE 69215192T DE 69215192 T DE69215192 T DE 69215192T DE 69215192 D1 DE69215192 D1 DE 69215192D1
Authority
DE
Germany
Prior art keywords
circuit board
production method
shielded areas
shielded
areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69215192T
Other languages
English (en)
Other versions
DE69215192T2 (de
Inventor
Karl-Erik Leeb
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Application granted granted Critical
Publication of DE69215192D1 publication Critical patent/DE69215192D1/de
Publication of DE69215192T2 publication Critical patent/DE69215192T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C45/00—Preparation of compounds having >C = O groups bound only to carbon or hydrogen atoms; Preparation of chelates of such compounds
    • C07C45/45—Preparation of compounds having >C = O groups bound only to carbon or hydrogen atoms; Preparation of chelates of such compounds by condensation
    • C07C45/46—Friedel-Crafts reactions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Structure Of Printed Boards (AREA)
DE69215192T 1991-06-14 1992-06-12 Leiterplatte mit abgeschirmten bereichen sowie herstellungsverfahren einer solchen leiterplatte Expired - Fee Related DE69215192T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9101837A SE468576B (sv) 1991-06-14 1991-06-14 Kretskort med lateralt ledningsmoenster och skaermade omraaden samt foerfarande foer dess framstaellning
PCT/SE1992/000408 WO1992022995A1 (en) 1991-06-14 1992-06-12 A circuit board having a lateral conductive pattern and shielded regions as well as a method of manufacturing such a board

Publications (2)

Publication Number Publication Date
DE69215192D1 true DE69215192D1 (de) 1996-12-19
DE69215192T2 DE69215192T2 (de) 1997-03-13

Family

ID=20383045

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69215192T Expired - Fee Related DE69215192T2 (de) 1991-06-14 1992-06-12 Leiterplatte mit abgeschirmten bereichen sowie herstellungsverfahren einer solchen leiterplatte

Country Status (8)

Country Link
US (3) US5476970A (de)
EP (1) EP0543974B1 (de)
JP (1) JP3002539B2 (de)
DE (1) DE69215192T2 (de)
SE (1) SE468576B (de)
SG (1) SG87726A1 (de)
TW (1) TW328415U (de)
WO (1) WO1992022995A1 (de)

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DE69327666D1 (de) * 1992-07-17 2000-02-24 Vlt Corp Verpackung für elektronische Komponenten
US5592199A (en) * 1993-01-27 1997-01-07 Sharp Kabushiki Kaisha Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same
US5436405A (en) * 1993-02-12 1995-07-25 Alcatel Network Systems, Inc. Electromagnetically shielded microstrip circuit and method of fabrication
SE505448C2 (sv) * 1993-05-28 1997-09-01 Ericsson Telefon Ab L M Förfarande för framställning av en mönsterkortssäkring och mönsterkortssäkring
KR960000706B1 (ko) * 1993-07-12 1996-01-11 한국전기통신공사 전력소자용 플라스틱 패키지 구조 및 그 제조방법
US5945130A (en) 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation
US5728600A (en) * 1994-11-15 1998-03-17 Vlt Corporation Circuit encapsulation process
JP2707996B2 (ja) * 1995-02-24 1998-02-04 日本電気株式会社 混成集積回路装置およびその製造方法
DE19522455A1 (de) * 1995-06-21 1997-01-02 Telefunken Microelectron EMV-Abschirmung bei elektronischen Bauelementen
US6316737B1 (en) 1999-09-09 2001-11-13 Vlt Corporation Making a connection between a component and a circuit board
US6515222B2 (en) * 2001-02-05 2003-02-04 Motorola, Inc. Printed circuit board arrangement
US6459000B1 (en) * 2001-03-26 2002-10-01 Council Of Scientific And Industrial Research Process for the liquid phase acylation of aromatic compounds
US6985341B2 (en) 2001-04-24 2006-01-10 Vlt, Inc. Components having actively controlled circuit elements
US7443229B1 (en) 2001-04-24 2008-10-28 Picor Corporation Active filtering
UA79182C2 (en) * 2002-12-13 2007-05-25 Basf Ag Method for the production of benzophenones
US20040122260A1 (en) * 2002-12-20 2004-06-24 Maleski Robert Joseph Process for preparing 2-nitro-4'-fluorobenzophenone
WO2004074328A1 (en) * 2003-02-20 2004-09-02 Ciba Specialty Chemicals Holding Inc. Photocurable compositions
US6828463B2 (en) * 2003-03-26 2004-12-07 Council Of Scientific And Industrial Research Process for the preparation of carbonyl compounds with a carbonyl group attached to the aromatic ring
US7359693B2 (en) * 2003-05-23 2008-04-15 Rfstream Corporation Enclosure and substrate structure for a tuner module
US6975517B1 (en) * 2003-05-30 2005-12-13 Nortel Networks Limited Embedded preemphasis and deemphasis circuits
US7152317B2 (en) * 2003-08-08 2006-12-26 Shmuel Shapira Circuit forming method
US20060092026A1 (en) * 2004-11-02 2006-05-04 Lawrence Daniel P Method of creating an RFID tag with substantially protected rigid electronic component
WO2006099119A2 (en) * 2005-03-11 2006-09-21 Rfstream Corporation An integrated circuit layout for a television tuner
WO2007063787A1 (en) * 2005-12-02 2007-06-07 Semiconductor Energy Laboratory Co., Ltd. Display module and electronic device using the same
JP2009158606A (ja) * 2007-12-25 2009-07-16 Toshiba Corp 電子機器
WO2014083967A1 (ja) 2012-11-29 2014-06-05 オリンパスメディカルシステムズ株式会社 基板構造
US9326369B2 (en) * 2013-06-19 2016-04-26 Keithley Instruments, Inc. Guarded printed circuit board islands
TWI623247B (zh) * 2015-06-25 2018-05-01 Wafer Mems Co Ltd Mass production method of preform of passive component
TWI629694B (zh) * 2015-06-25 2018-07-11 威華微機電股份有限公司 Mass production method of preform of magnetic core inductor
JP6648626B2 (ja) * 2016-04-27 2020-02-14 オムロン株式会社 電子装置およびその製造方法
CN107635385B (zh) * 2017-07-31 2024-04-30 武汉芯宝科技有限公司 Esd全屏蔽功能箔、全屏蔽功能箔电路板及制造方法
JP6828795B2 (ja) * 2019-12-05 2021-02-10 オムロン株式会社 電子装置およびその製造方法
CN113568530B (zh) * 2021-07-30 2022-06-03 广东省科学院半导体研究所 用于触摸屏的单层导电膜结构及其制作方法及触摸屏

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Also Published As

Publication number Publication date
US5375322A (en) 1994-12-27
DE69215192T2 (de) 1997-03-13
JP3002539B2 (ja) 2000-01-24
SE468576B (sv) 1993-02-08
WO1992022995A1 (en) 1992-12-23
SE9101837L (sv) 1992-12-15
SG87726A1 (en) 2002-04-16
SE9101837D0 (sv) 1991-06-14
US5476970A (en) 1995-12-19
EP0543974B1 (de) 1996-11-13
JPH06501137A (ja) 1994-01-27
US5298684A (en) 1994-03-29
TW328415U (en) 1998-03-11
EP0543974A1 (de) 1993-06-02

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