DE69209843T2 - Beheizter Fussboden zum Heizen eines darauf plazierten Körpers und chemischer Behandlungsreaktor mit diesem Boden - Google Patents

Beheizter Fussboden zum Heizen eines darauf plazierten Körpers und chemischer Behandlungsreaktor mit diesem Boden

Info

Publication number
DE69209843T2
DE69209843T2 DE69209843T DE69209843T DE69209843T2 DE 69209843 T2 DE69209843 T2 DE 69209843T2 DE 69209843 T DE69209843 T DE 69209843T DE 69209843 T DE69209843 T DE 69209843T DE 69209843 T2 DE69209843 T2 DE 69209843T2
Authority
DE
Germany
Prior art keywords
floor
heating
chemical treatment
body placed
treatment reactor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69209843T
Other languages
English (en)
Other versions
DE69209843D1 (de
Inventor
Chantal Arena
Patrice Noel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Publication of DE69209843D1 publication Critical patent/DE69209843D1/de
Application granted granted Critical
Publication of DE69209843T2 publication Critical patent/DE69209843T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
    • G05D23/193—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
    • G05D23/1932—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
    • G05D23/193—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
    • G05D23/1932—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces
    • G05D23/1934—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of a plurality of spaces each space being provided with one sensor acting on one or more control means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
    • G05D23/22—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature the sensing element being a thermocouple
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2213/00—Aspects relating both to resistive heating and to induction heating, covered by H05B3/00 and H05B6/00
    • H05B2213/07—Heating plates with temperature control means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Remote Sensing (AREA)
  • Control Of Resistance Heating (AREA)
DE69209843T 1991-10-07 1992-10-06 Beheizter Fussboden zum Heizen eines darauf plazierten Körpers und chemischer Behandlungsreaktor mit diesem Boden Expired - Fee Related DE69209843T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9112315A FR2682253A1 (fr) 1991-10-07 1991-10-07 Sole chauffante destinee a assurer le chauffage d'un objet dispose a sa surface et reacteur de traitement chimique muni de ladite sole.
PCT/FR1992/000926 WO1993007550A1 (fr) 1991-10-07 1992-10-06 Sole chauffante destinee a assurer le chauffage d'un objet dispose a sa surface et reacteur de traitement chimique muni de ladite sole

Publications (2)

Publication Number Publication Date
DE69209843D1 DE69209843D1 (de) 1996-05-15
DE69209843T2 true DE69209843T2 (de) 1996-10-24

Family

ID=9417659

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69209843T Expired - Fee Related DE69209843T2 (de) 1991-10-07 1992-10-06 Beheizter Fussboden zum Heizen eines darauf plazierten Körpers und chemischer Behandlungsreaktor mit diesem Boden

Country Status (6)

Country Link
US (1) US5635093A (de)
EP (1) EP0607313B1 (de)
JP (1) JPH06511335A (de)
DE (1) DE69209843T2 (de)
FR (1) FR2682253A1 (de)
WO (1) WO1993007550A1 (de)

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US5881208A (en) * 1995-12-20 1999-03-09 Sematech, Inc. Heater and temperature sensor array for rapid thermal processing thermal core
JP3563224B2 (ja) 1996-03-25 2004-09-08 住友電気工業株式会社 半導体ウエハの評価方法、熱処理方法、および熱処理装置
DE19655141C5 (de) * 1996-11-08 2013-12-05 Eppendorf Ag Gradienten-Temperierblock für Laborthermostaten
DE29623597U1 (de) * 1996-11-08 1999-01-07 Eppendorf Geraetebau Netheler Temperierblock mit Temperiereinrichtungen
KR100250636B1 (ko) * 1996-11-13 2000-05-01 윤종용 반도체 장치 제조용 가열챔버의 원형 가열판
US6091060A (en) * 1997-12-31 2000-07-18 Temptronic Corporation Power and control system for a workpiece chuck
US6222161B1 (en) * 1998-01-12 2001-04-24 Tokyo Electron Limited Heat treatment apparatus
US6147334A (en) * 1998-06-30 2000-11-14 Marchi Associates, Inc. Laminated paddle heater and brazing process
JP2000235886A (ja) * 1998-12-14 2000-08-29 Tokyo Electron Ltd 加熱手段の温度制御装置および温度制御方法
US6087632A (en) * 1999-01-11 2000-07-11 Tokyo Electron Limited Heat processing device with hot plate and associated reflector
JP2000243542A (ja) * 1999-02-24 2000-09-08 Nhk Spring Co Ltd ヒータユニット及びその製造方法
JP2000277237A (ja) * 1999-03-24 2000-10-06 Komatsu Ltd 基板温度制御プレート及びそれを備える基板温度制御装置
US6221437B1 (en) 1999-04-12 2001-04-24 Reynolds Tech Fabricators, Inc. Heated workpiece holder for wet plating bath
US6303411B1 (en) 1999-05-03 2001-10-16 Vortek Industries Ltd. Spatially resolved temperature measurement and irradiance control
US6191394B1 (en) * 1999-05-19 2001-02-20 Tokyo Electron Ltd. Heat treating apparatus
US6402509B1 (en) * 1999-09-03 2002-06-11 Tokyo Electron, Limited Substrate processing apparatus and substrate processing method
US6345150B1 (en) 1999-11-30 2002-02-05 Wafermasters, Inc. Single wafer annealing oven
US6303906B1 (en) * 1999-11-30 2001-10-16 Wafermasters, Inc. Resistively heated single wafer furnace
WO2001041508A1 (fr) * 1999-11-30 2001-06-07 Ibiden Co., Ltd. Appareil chauffant en ceramique
US20040011782A1 (en) * 1999-12-29 2004-01-22 Ibiden Co., Ltd Ceramic heater
WO2001078454A1 (fr) * 2000-04-07 2001-10-18 Ibiden Co., Ltd. Dispositif chauffant ceramique
WO2001084888A1 (en) * 2000-04-29 2001-11-08 Ibiden Co., Ltd. Ceramic heater and method of controlling temperature of the ceramic heater
DE10111734A1 (de) * 2001-03-06 2002-09-26 Schott Glas Keramisches Kochsystem mit Glaskeramikplatte, Isolationsschicht und Heizelementen
KR100431658B1 (ko) * 2001-10-05 2004-05-17 삼성전자주식회사 기판 가열 장치 및 이를 갖는 장치
GB0126150D0 (en) * 2001-10-31 2002-01-02 Gw Pharma Ltd A device method and resistive element for vaporising a substance
JP2004146568A (ja) * 2002-10-24 2004-05-20 Sumitomo Electric Ind Ltd 半導体製造装置用セラミックスヒーター
JP2004200619A (ja) * 2002-12-20 2004-07-15 Kyocera Corp ウエハ支持部材
KR101163682B1 (ko) 2002-12-20 2012-07-09 맷슨 테크날러지 캐나다 인코퍼레이티드 피가공물 지지 장치
US20040222210A1 (en) * 2003-05-08 2004-11-11 Hongy Lin Multi-zone ceramic heating system and method of manufacture thereof
DE10341433A1 (de) * 2003-09-09 2005-03-31 Braun Gmbh Beheizbarer Infrarot-Sensor und Infrarot-Thermometer mit einem derartigen Infrarot-Sensor
JP2006140367A (ja) * 2004-11-15 2006-06-01 Sumitomo Electric Ind Ltd 半導体製造装置用加熱体およびこれを搭載した加熱装置
US20060289447A1 (en) * 2005-06-20 2006-12-28 Mohamed Zakaria A Heating chuck assembly
JP5967859B2 (ja) 2006-11-15 2016-08-10 マトソン テクノロジー、インコーポレイテッド 熱処理中の被加工物を支持するシステムおよび方法
KR101610269B1 (ko) 2008-05-16 2016-04-07 맷슨 테크놀로지, 인크. 워크피스 파손 방지 방법 및 장치
CN102099894B (zh) 2008-08-27 2014-04-16 S.O.I.Tec绝缘体上硅技术公司 制造半导体结构或使用具有选择或受控晶格参数的半导体材料层的器件的方法
US8637794B2 (en) 2009-10-21 2014-01-28 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing
WO2011061580A1 (en) 2009-11-18 2011-05-26 S.O.I.Tec Silicon On Insulator Technologies Methods of fabricating semiconductor structures and devices using glass bonding layers, and semiconductor structures and devices formed by such methods
KR101644673B1 (ko) * 2009-12-15 2016-08-01 램 리써치 코포레이션 Ｃｄ 균일성을 향상시키기 위한 기판 온도의 조절
US8791392B2 (en) 2010-10-22 2014-07-29 Lam Research Corporation Methods of fault detection for multiplexed heater array
US8546732B2 (en) 2010-11-10 2013-10-01 Lam Research Corporation Heating plate with planar heater zones for semiconductor processing
US9023721B2 (en) 2010-11-23 2015-05-05 Soitec Methods of forming bulk III-nitride materials on metal-nitride growth template layers, and structures formed by such methods
FR2968830B1 (fr) 2010-12-08 2014-03-21 Soitec Silicon On Insulator Couches matricielles ameliorees pour le depot heteroepitaxial de materiaux semiconducteurs de nitrure iii en utilisant des procedes hvpe
FR2968678B1 (fr) 2010-12-08 2015-11-20 Soitec Silicon On Insulator Procédés pour former des matériaux a base de nitrure du groupe iii et structures formées par ces procédés
US9307578B2 (en) 2011-08-17 2016-04-05 Lam Research Corporation System and method for monitoring temperatures of and controlling multiplexed heater array
US10388493B2 (en) 2011-09-16 2019-08-20 Lam Research Corporation Component of a substrate support assembly producing localized magnetic fields
US8624168B2 (en) 2011-09-20 2014-01-07 Lam Research Corporation Heating plate with diode planar heater zones for semiconductor processing
US8461674B2 (en) 2011-09-21 2013-06-11 Lam Research Corporation Thermal plate with planar thermal zones for semiconductor processing
US9324589B2 (en) 2012-02-28 2016-04-26 Lam Research Corporation Multiplexed heater array using AC drive for semiconductor processing
US8809747B2 (en) 2012-04-13 2014-08-19 Lam Research Corporation Current peak spreading schemes for multiplexed heated array
US10049948B2 (en) 2012-11-30 2018-08-14 Lam Research Corporation Power switching system for ESC with array of thermal control elements
CN111565850B (zh) * 2017-08-03 2022-07-26 比奥利弗解决方案公司 用于自动化解冻袋状存储容器的系统，设备和方法
KR102091251B1 (ko) * 2018-08-21 2020-03-19 엘지전자 주식회사 전기 히터

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US3836751A (en) * 1973-07-26 1974-09-17 Applied Materials Inc Temperature controlled profiling heater
DE3417713A1 (de) * 1984-05-12 1985-11-14 E.G.O. Elektro-Geräte Blanc u. Fischer, 7519 Oberderdingen Elektrokochplatte
FR2564373B1 (fr) * 1984-05-16 1987-01-23 Denis Sa Albert Procede et dispositif de regulation thermique pour moules a canaux chauds
US4886954A (en) * 1988-04-15 1989-12-12 Thermco Systems, Inc. Hot wall diffusion furnace and method for operating the furnace
DE3827073A1 (de) * 1988-08-10 1990-02-15 Ego Elektro Blanc & Fischer Elektrokochplatte

Also Published As

Publication number Publication date
JPH06511335A (ja) 1994-12-15
DE69209843D1 (de) 1996-05-15
US5635093A (en) 1997-06-03
EP0607313A1 (de) 1994-07-27
EP0607313B1 (de) 1996-04-10
FR2682253A1 (fr) 1993-04-09
WO1993007550A1 (fr) 1993-04-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee