DE69207450T2 - Ständer - Google Patents

Ständer

Info

Publication number
DE69207450T2
DE69207450T2 DE69207450T DE69207450T DE69207450T2 DE 69207450 T2 DE69207450 T2 DE 69207450T2 DE 69207450 T DE69207450 T DE 69207450T DE 69207450 T DE69207450 T DE 69207450T DE 69207450 T2 DE69207450 T2 DE 69207450T2
Authority
DE
Germany
Prior art keywords
stand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69207450T
Other languages
English (en)
Other versions
DE69207450D1 (de
Inventor
Nobushige Korenaga
Kazunori Iwamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE69207450D1 publication Critical patent/DE69207450D1/de
Application granted granted Critical
Publication of DE69207450T2 publication Critical patent/DE69207450T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
    • G03F7/2039—X-ray radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70766—Reaction force control means, e.g. countermass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/0216—Means for avoiding or correcting vibration effects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Atmospheric Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE69207450T 1991-02-25 1992-02-24 Ständer Expired - Fee Related DE69207450T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05010291A JP3182158B2 (ja) 1991-02-25 1991-02-25 露光装置用のステージ支持装置

Publications (2)

Publication Number Publication Date
DE69207450D1 DE69207450D1 (de) 1996-02-22
DE69207450T2 true DE69207450T2 (de) 1996-06-13

Family

ID=12849718

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69207450T Expired - Fee Related DE69207450T2 (de) 1991-02-25 1992-02-24 Ständer

Country Status (4)

Country Link
US (1) US5467720A (de)
EP (1) EP0501724B1 (de)
JP (1) JP3182158B2 (de)
DE (1) DE69207450T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004013707B4 (de) * 2003-08-28 2016-05-25 Cascade Microtech, Inc. Vorrichtung zum Testen von Substraten

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* Cited by examiner, † Cited by third party
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US4926517A (en) 1989-02-24 1990-05-22 Smith Keith E Sweeper
JP3200282B2 (ja) * 1993-07-21 2001-08-20 キヤノン株式会社 処理システム及びこれを用いたデバイス製造方法
US6989647B1 (en) * 1994-04-01 2006-01-24 Nikon Corporation Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device
US5874820A (en) 1995-04-04 1999-02-23 Nikon Corporation Window frame-guided stage mechanism
US5528118A (en) * 1994-04-01 1996-06-18 Nikon Precision, Inc. Guideless stage with isolated reaction stage
US7365513B1 (en) 1994-04-01 2008-04-29 Nikon Corporation Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device
TW318255B (de) 1995-05-30 1997-10-21 Philips Electronics Nv
US5812420A (en) * 1995-09-05 1998-09-22 Nikon Corporation Vibration-preventive apparatus and exposure apparatus
JP3815750B2 (ja) * 1995-10-09 2006-08-30 キヤノン株式会社 ステージ装置、ならびに前記ステージ装置を用いた露光装置およびデバイス製造方法
JP3221823B2 (ja) * 1995-11-24 2001-10-22 キヤノン株式会社 投影露光装置およびこれを用いた露光方法ならびに半導体製造方法
AU2179297A (en) * 1996-04-08 1997-10-29 Delta Tooling Co., Ltd. Magnetic spring having damping characteristics and vibration mechanism having same
JP3659529B2 (ja) * 1996-06-06 2005-06-15 キヤノン株式会社 露光装置およびデバイス製造方法
JP3266515B2 (ja) * 1996-08-02 2002-03-18 キヤノン株式会社 露光装置、デバイス製造方法およびステージ装置
JP3635600B2 (ja) * 1996-08-29 2005-04-06 キヤノン株式会社 送り装置
JP3283767B2 (ja) * 1996-10-02 2002-05-20 キヤノン株式会社 露光装置およびデバイス製造方法
JP3548353B2 (ja) * 1996-10-15 2004-07-28 キヤノン株式会社 ステージ装置およびこれを用いた露光装置ならびにデバイス製造方法
JP3689510B2 (ja) * 1996-11-15 2005-08-31 キヤノン株式会社 露光装置およびデバイス製造方法
US6222614B1 (en) * 1996-12-06 2001-04-24 Nikon Corporation Exposure elements with a cable-relaying support
JP3725272B2 (ja) * 1996-12-27 2005-12-07 株式会社デルタツーリング 振動発生機構
US6128069A (en) * 1997-03-13 2000-10-03 Canon Kabushiki Kaisha Stage mechanism for exposure apparatus
JPH1130274A (ja) * 1997-05-15 1999-02-02 Delta Tsuuring:Kk 磁気バネを有する振動機構
KR100281474B1 (ko) 1997-05-16 2001-02-01 후지타 히토시 자기스프링을구비한에너지출력기구
US6330052B1 (en) 1997-06-13 2001-12-11 Canon Kabushiki Kaisha Exposure apparatus and its control method, stage apparatus, and device manufacturing method
US6408045B1 (en) * 1997-11-11 2002-06-18 Canon Kabushiki Kaisha Stage system and exposure apparatus with the same
JP3535749B2 (ja) 1997-12-10 2004-06-07 キヤノン株式会社 ステージ装置、露光装置、並びにデバイス製造方法
JPH11191585A (ja) 1997-12-26 1999-07-13 Canon Inc ステージ装置、およびこれを用いた露光装置、ならびにデバイス製造方法
JP3630964B2 (ja) * 1997-12-26 2005-03-23 キヤノン株式会社 ステージ装置、およびこれを用いた露光装置ならびにデバイス製造方法
JP3526202B2 (ja) * 1998-02-03 2004-05-10 キヤノン株式会社 ステージ装置、およびこれを用いた露光装置、ならびにデバイス製造方法
JPH11287880A (ja) 1998-04-01 1999-10-19 Canon Inc ステージ装置、およびこれを用いた露光装置ならびにデバイス製造方法
JP3869938B2 (ja) 1998-06-05 2007-01-17 キヤノン株式会社 ステージ装置、露光装置、およびデバイス製造方法
JP3745167B2 (ja) 1998-07-29 2006-02-15 キヤノン株式会社 ステージ装置、露光装置およびデバイス製造方法ならびにステージ駆動方法
EP1050202B1 (de) * 1998-11-24 2005-06-22 Continental Teves AG & Co. oHG Anordnung zum schutz von elektronischen funktionseinheiten und/oder funktionsgruppen
TW552480B (en) * 1999-04-19 2003-09-11 Asml Netherlands Bv Moveable support in a vacuum chamber and its application in lithographic projection apparatus
JP2001160530A (ja) * 1999-12-01 2001-06-12 Nikon Corp ステージ装置及び露光装置
JP3814453B2 (ja) * 2000-01-11 2006-08-30 キヤノン株式会社 位置決め装置、半導体露光装置およびデバイス製造方法
TW509823B (en) * 2000-04-17 2002-11-11 Asml Netherlands Bv Lithographic apparatus, device manufacturing method, and device manufactured thereby
US6334398B1 (en) * 2000-04-28 2002-01-01 Tokyo Electron Limited Variable gap stop which can be used in a semiconductor processing device
JP3945148B2 (ja) * 2000-11-02 2007-07-18 株式会社日立製作所 Ｘｙテーブル及びｘｙｚテーブル
US6885430B2 (en) * 2000-11-16 2005-04-26 Nikon Corporation System and method for resetting a reaction mass assembly of a stage assembly
US6958808B2 (en) * 2000-11-16 2005-10-25 Nikon Corporation System and method for resetting a reaction mass assembly of a stage assembly
JP2003022960A (ja) * 2001-07-09 2003-01-24 Canon Inc ステージ装置及びその駆動方法
JP2003059797A (ja) * 2001-08-09 2003-02-28 Canon Inc 移動装置、ステージ装置及び露光装置
JP3977086B2 (ja) * 2002-01-18 2007-09-19 キヤノン株式会社 ステージシステム
JP4323759B2 (ja) * 2002-05-27 2009-09-02 キヤノン株式会社 露光装置およびデバイス製造方法
JP3849932B2 (ja) * 2002-08-12 2006-11-22 キヤノン株式会社 移動ステージ装置
JP3826087B2 (ja) * 2002-08-30 2006-09-27 キヤノン株式会社 位置決め装置、荷電粒子線露光装置
JP4012024B2 (ja) * 2002-09-10 2007-11-21 キヤノン株式会社 位置決め装置に於ける衝撃吸収装置
JP2004172557A (ja) 2002-11-22 2004-06-17 Canon Inc ステージ装置及びその制御方法
JP4143438B2 (ja) * 2003-02-24 2008-09-03 キヤノン株式会社 支持装置、露光装置、デバイス製造方法
JP2005005393A (ja) * 2003-06-10 2005-01-06 Canon Inc ステージ装置、露光装置、およびデバイス製造方法
JP2005142501A (ja) * 2003-11-10 2005-06-02 Canon Inc ステージ装置および露光装置ならびにデバイス製造方法
JP4486521B2 (ja) * 2005-02-08 2010-06-23 藤倉ゴム工業株式会社 レベリング調整装置
WO2007040254A1 (ja) * 2005-10-05 2007-04-12 Nikon Corporation 露光装置及び露光方法
JP2016023720A (ja) * 2014-07-22 2016-02-08 キヤノン株式会社 振動制御装置、リソグラフィ装置、および物品の製造方法
US10258150B2 (en) * 2016-12-27 2019-04-16 Yi-Cheng Tseng Height adjustable desk
US10948043B2 (en) * 2018-10-02 2021-03-16 Hiroshi Kurabayashi Damping device for structure

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DE3200815A1 (de) * 1982-01-11 1983-07-21 Gerb Gesellschaft für Isolierung mbH & Co KG, 1000 Berlin Verfahren zum ausrichten der wellen von elastisch aufgestellten maschinen
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DE3437835A1 (de) * 1983-10-31 1985-05-23 I.T.W. España, S.A., Las Franquesas des Valles, Barcelona Lagersystem fuer waschmaschinentrommeln
JPS62238005A (ja) * 1986-04-10 1987-10-19 Sumitomo Heavy Ind Ltd ピルガ−式圧延機の慣性力バランス装置
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JP2770960B2 (ja) * 1988-10-06 1998-07-02 キヤノン株式会社 Ｓｏｒ−ｘ線露光装置
US5228358A (en) * 1990-02-21 1993-07-20 Canon Kabushiki Kaisha Motion guiding device
JP3320444B2 (ja) * 1992-04-06 2002-09-03 株式会社千代田製作所 染色装置用ノズル洗浄装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004013707B4 (de) * 2003-08-28 2016-05-25 Cascade Microtech, Inc. Vorrichtung zum Testen von Substraten
DE102004013707B9 (de) * 2003-08-28 2016-06-23 Cascade Microtech, Inc. Vorrichtung zum Testen von Substraten

Also Published As

Publication number Publication date
DE69207450D1 (de) 1996-02-22
EP0501724A3 (en) 1993-03-17
EP0501724B1 (de) 1996-01-10
JPH04268713A (ja) 1992-09-24
US5467720A (en) 1995-11-21
EP0501724A2 (de) 1992-09-02
JP3182158B2 (ja) 2001-07-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee