DE69207213T2 - Verfahren zum Messen der Verschiebung eines Musters - Google Patents

Verfahren zum Messen der Verschiebung eines Musters

Info

Publication number
DE69207213T2
DE69207213T2 DE1992607213 DE69207213T DE69207213T2 DE 69207213 T2 DE69207213 T2 DE 69207213T2 DE 1992607213 DE1992607213 DE 1992607213 DE 69207213 T DE69207213 T DE 69207213T DE 69207213 T2 DE69207213 T2 DE 69207213T2
Authority
DE
Germany
Prior art keywords
displacement
pattern
measuring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1992607213
Other languages
English (en)
Other versions
DE69207213D1 (de
Inventor
Takatoshi Nagoya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Publication of DE69207213D1 publication Critical patent/DE69207213D1/de
Application granted granted Critical
Publication of DE69207213T2 publication Critical patent/DE69207213T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE1992607213 1991-01-10 1992-01-10 Verfahren zum Messen der Verschiebung eines Musters Expired - Fee Related DE69207213T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3012993A JPH0724278B2 (ja) 1991-01-10 1991-01-10 パターンシフト測定方法

Publications (2)

Publication Number Publication Date
DE69207213D1 DE69207213D1 (de) 1996-02-15
DE69207213T2 true DE69207213T2 (de) 1996-05-15

Family

ID=11820734

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1992607213 Expired - Fee Related DE69207213T2 (de) 1991-01-10 1992-01-10 Verfahren zum Messen der Verschiebung eines Musters

Country Status (3)

Country Link
EP (1) EP0494685B1 (de)
JP (1) JPH0724278B2 (de)
DE (1) DE69207213T2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100739259B1 (ko) * 2006-03-08 2007-07-12 주식회사 하이닉스반도체 중첩도 측정 버니어 및 그 형성 방법
CN109839799B (zh) * 2017-11-28 2022-07-19 上海仪电显示材料有限公司 掩膜组件及其曝光方法
CN113530740A (zh) * 2021-06-02 2021-10-22 中国长江电力股份有限公司 水轮发电机组定子定位筋弦距精确测量装置及方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3671748A (en) * 1970-08-24 1972-06-20 Computervision Corp Method and apparatus for positioner calibration system
DE2803653C3 (de) * 1978-01-27 1986-05-28 Texas Instruments Deutschland Gmbh, 8050 Freising Ausrichtvorrichtung
JP2666859B2 (ja) * 1988-11-25 1997-10-22 日本電気株式会社 目合せ用バーニヤパターンを備えた半導体装置

Also Published As

Publication number Publication date
JPH04239150A (ja) 1992-08-27
DE69207213D1 (de) 1996-02-15
EP0494685B1 (de) 1996-01-03
EP0494685A2 (de) 1992-07-15
JPH0724278B2 (ja) 1995-03-15
EP0494685A3 (en) 1993-03-03

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee