DE69129619D1 - Halbleitervorrichtung mit einer vielzahl von anschlussstiften - Google Patents

Halbleitervorrichtung mit einer vielzahl von anschlussstiften

Info

Publication number
DE69129619D1
DE69129619D1 DE69129619T DE69129619T DE69129619D1 DE 69129619 D1 DE69129619 D1 DE 69129619D1 DE 69129619 T DE69129619 T DE 69129619T DE 69129619 T DE69129619 T DE 69129619T DE 69129619 D1 DE69129619 D1 DE 69129619D1
Authority
DE
Germany
Prior art keywords
variety
semiconductor device
connecting pins
pins
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69129619T
Other languages
English (en)
Other versions
DE69129619T2 (de
Inventor
Tetsu Tanizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of DE69129619D1 publication Critical patent/DE69129619D1/de
Application granted granted Critical
Publication of DE69129619T2 publication Critical patent/DE69129619T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
DE69129619T 1990-09-19 1991-09-19 Halbleitervorrichtung mit einer vielzahl von anschlussstiften Expired - Fee Related DE69129619T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP24934890 1990-09-19
JP24934990 1990-09-19
PCT/JP1991/001242 WO1992005583A1 (en) 1990-09-19 1991-09-19 Semiconductor device having many lead pins

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DE69129619D1 true DE69129619D1 (de) 1998-07-23
DE69129619T2 DE69129619T2 (de) 1999-02-25

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US (1) US5475261A (de)
EP (1) EP0504411B1 (de)
JP (1) JP3137977B2 (de)
KR (1) KR960016240B1 (de)
DE (1) DE69129619T2 (de)
WO (1) WO1992005583A1 (de)

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Also Published As

Publication number Publication date
US5475261A (en) 1995-12-12
JP3137977B2 (ja) 2001-02-26
EP0504411A4 (en) 1993-02-10
DE69129619T2 (de) 1999-02-25
WO1992005583A1 (en) 1992-04-02
EP0504411A1 (de) 1992-09-23
EP0504411B1 (de) 1998-06-17
KR960016240B1 (en) 1996-12-07

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