DE69126714D1 - Teile einer Halbleitervorrichtung - Google Patents

Teile einer Halbleitervorrichtung

Info

Publication number
DE69126714D1
DE69126714D1 DE69126714T DE69126714T DE69126714D1 DE 69126714 D1 DE69126714 D1 DE 69126714D1 DE 69126714 T DE69126714 T DE 69126714T DE 69126714 T DE69126714 T DE 69126714T DE 69126714 D1 DE69126714 D1 DE 69126714D1
Authority
DE
Germany
Prior art keywords
parts
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69126714T
Other languages
English (en)
Other versions
DE69126714T2 (de
Inventor
Toshikazu Deie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE69126714D1 publication Critical patent/DE69126714D1/de
Application granted granted Critical
Publication of DE69126714T2 publication Critical patent/DE69126714T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405—Securing in non-demountable manner, e.g. moulding, riveting
    • H01R13/41—Securing in non-demountable manner, e.g. moulding, riveting by frictional grip in grommet, panel or base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE69126714T 1990-01-18 1991-01-18 Teile einer Halbleitervorrichtung Expired - Fee Related DE69126714T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009162A JPH0783080B2 (ja) 1990-01-18 1990-01-18 半導体装置用部品

Publications (2)

Publication Number Publication Date
DE69126714D1 true DE69126714D1 (de) 1997-08-14
DE69126714T2 DE69126714T2 (de) 1997-12-11

Family

ID=11712917

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69126714T Expired - Fee Related DE69126714T2 (de) 1990-01-18 1991-01-18 Teile einer Halbleitervorrichtung

Country Status (4)

Country Link
EP (1) EP0438165B1 (de)
JP (1) JPH0783080B2 (de)
KR (1) KR950002193B1 (de)
DE (1) DE69126714T2 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6339191B1 (en) 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US6828600B2 (en) 1997-05-09 2004-12-07 Eupec Europaeische Gesellschaft Fuer Leistungshalbleiter Mbh Power semiconductor module with ceramic substrate
DE19719703C5 (de) * 1997-05-09 2005-11-17 eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG Leistungshalbleitermodul mit Keramiksubstrat
US6078102A (en) * 1998-03-03 2000-06-20 Silicon Bandwidth, Inc. Semiconductor die package for mounting in horizontal and upright configurations
DE10024377B4 (de) 2000-05-17 2006-08-17 Infineon Technologies Ag Gehäuseeinrichtung und darin zu verwendendes Kontaktelement
US20040067695A1 (en) * 2002-10-02 2004-04-08 Marceau Scott P. Electrical connector assembly
JP5233853B2 (ja) * 2009-06-11 2013-07-10 富士電機株式会社 半導体装置
KR20160130910A (ko) 2015-05-04 2016-11-15 (주)누리트론 전자부품의 리드단자
US11342237B2 (en) 2015-12-15 2022-05-24 Semiconductor Components Industries, Llc Semiconductor package system and related methods
US10825748B2 (en) 2015-12-15 2020-11-03 Semiconductor Components Industries, Llc Semiconductor package system and related methods

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4379611A (en) * 1980-11-03 1983-04-12 Hughes Aircraft Company Connector with low force socket contact having an integral hood
JPS59177951A (ja) * 1983-03-29 1984-10-08 Toshiba Corp 半導体装置
US4538878A (en) * 1983-08-12 1985-09-03 Molex Incorporated Solderless circuit board connector
JPS60157243A (ja) * 1984-01-25 1985-08-17 Mitsubishi Electric Corp 半導体装置
JPS6126270U (ja) * 1984-07-24 1986-02-17 本多通信工業株式会社 コネクタのコンタクト組体
JPS62158349A (ja) * 1985-12-28 1987-07-14 Kyocera Corp プラグインパツケ−ジの製法
US5184285A (en) * 1987-11-17 1993-02-02 Advanced Interconnections Corporation Socket constructed with molded-in lead frame providing means for installing additional component such as a chip capacitor
KR930000330B1 (ko) * 1988-05-16 1993-01-15 스미도모덴기고오교오 가부시기가이샤 광 반도체장치

Also Published As

Publication number Publication date
EP0438165B1 (de) 1997-07-09
EP0438165A3 (en) 1991-11-13
KR950002193B1 (ko) 1995-03-14
EP0438165A2 (de) 1991-07-24
JPH03212962A (ja) 1991-09-18
JPH0783080B2 (ja) 1995-09-06
DE69126714T2 (de) 1997-12-11
KR910015031A (ko) 1991-08-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee