DE69122148T2 - Dünnschicht-Halbleiterbauelement - Google Patents

Dünnschicht-Halbleiterbauelement

Info

Publication number
DE69122148T2
DE69122148T2 DE69122148T DE69122148T DE69122148T2 DE 69122148 T2 DE69122148 T2 DE 69122148T2 DE 69122148 T DE69122148 T DE 69122148T DE 69122148 T DE69122148 T DE 69122148T DE 69122148 T2 DE69122148 T2 DE 69122148T2
Authority
DE
Germany
Prior art keywords
semiconductor device
film semiconductor
thin film
layer
ohmic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69122148T
Other languages
English (en)
Other versions
DE69122148D1 (de
Inventor
Shinichi Takeda
Masato Yamanobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2078401A external-priority patent/JPH03278469A/ja
Priority claimed from JP2078402A external-priority patent/JPH03278470A/ja
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69122148D1 publication Critical patent/DE69122148D1/de
Publication of DE69122148T2 publication Critical patent/DE69122148T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/6675Amorphous silicon or polysilicon transistors
    • H01L29/66765Lateral single gate single channel transistors with inverted structure, i.e. the channel layer is formed after the gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/41Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
    • H01L29/417Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
    • H01L29/41725Source or drain electrodes for field effect devices
    • H01L29/41733Source or drain electrodes for field effect devices for thin film transistors with insulated gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651Silicon transistors
    • H01L29/7866Non-monocrystalline silicon transistors
    • H01L29/78663Amorphous silicon transistors
    • H01L29/78669Amorphous silicon transistors with inverted-type structure, e.g. with bottom gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • H01L31/10Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors characterised by potential barriers, e.g. phototransistors
    • H01L31/101Devices sensitive to infrared, visible or ultraviolet radiation
    • H01L31/112Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect phototransistor
    • H01L31/113Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect phototransistor being of the conductor-insulator-semiconductor type, e.g. metal-insulator-semiconductor field-effect transistor
    • H01L31/1136Devices sensitive to infrared, visible or ultraviolet radiation characterised by field-effect operation, e.g. junction field-effect phototransistor being of the conductor-insulator-semiconductor type, e.g. metal-insulator-semiconductor field-effect transistor the device being a metal-insulator-semiconductor field-effect transistor

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Thin Film Transistor (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Electrodes Of Semiconductors (AREA)
DE69122148T 1990-03-27 1991-03-26 Dünnschicht-Halbleiterbauelement Expired - Fee Related DE69122148T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2078401A JPH03278469A (ja) 1990-03-27 1990-03-27 薄膜半導体装置
JP2078402A JPH03278470A (ja) 1990-03-27 1990-03-27 薄膜半導体装置

Publications (2)

Publication Number Publication Date
DE69122148D1 DE69122148D1 (de) 1996-10-24
DE69122148T2 true DE69122148T2 (de) 1997-02-06

Family

ID=26419477

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69122148T Expired - Fee Related DE69122148T2 (de) 1990-03-27 1991-03-26 Dünnschicht-Halbleiterbauelement

Country Status (4)

Country Link
US (1) US5150181A (de)
EP (1) EP0449585B1 (de)
AT (1) ATE143175T1 (de)
DE (1) DE69122148T2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0449598B1 (de) * 1990-03-27 1996-03-13 Canon Kabushiki Kaisha Dünnschicht-Halbleiterbauelement
US5254480A (en) * 1992-02-20 1993-10-19 Minnesota Mining And Manufacturing Company Process for producing a large area solid state radiation detector
JP3348531B2 (ja) * 1994-07-08 2002-11-20 ソニー株式会社 薄膜トランジスタの水素化方法および薄膜トランジスタの形成方法
JPH09270519A (ja) * 1996-03-31 1997-10-14 Furontetsuku:Kk 薄膜トランジスタの製造方法
JP3082679B2 (ja) 1996-08-29 2000-08-28 日本電気株式会社 薄膜トランジスタおよびその製造方法
KR100537376B1 (ko) * 1998-12-16 2006-03-14 엘지.필립스 엘시디 주식회사 박막트랜지스터 광센서의 제조방법
KR100776514B1 (ko) * 2000-12-30 2007-11-16 엘지.필립스 엘시디 주식회사 액정표시장치 및 그 제조방법
KR20070059559A (ko) * 2005-12-07 2007-06-12 삼성전자주식회사 표시 장치 및 그 제조 방법
KR20110081694A (ko) * 2010-01-08 2011-07-14 삼성모바일디스플레이주식회사 박막 트랜지스터의 제조 방법 및 표시 장치의 제조 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4522663A (en) * 1980-09-09 1985-06-11 Sovonics Solar Systems Method for optimizing photoresponsive amorphous alloys and devices
US4441113A (en) * 1981-02-13 1984-04-03 Energy Conversion Devices, Inc. P-Type semiconductor material having a wide band gap
JPS5961964A (ja) * 1982-10-01 1984-04-09 Fujitsu Ltd 薄膜トランジスタの製造方法
JPH0614560B2 (ja) * 1983-03-11 1994-02-23 キヤノン株式会社 フォトセンサ
JPS60101940A (ja) * 1983-11-07 1985-06-06 Ricoh Co Ltd イメ−ジセンサ
JPS6129170A (ja) * 1984-07-19 1986-02-10 Canon Inc フオトセンサ及びその製造法
JPS6213274A (ja) * 1985-07-11 1987-01-22 Honda Motor Co Ltd 自動シ−ム溶接装置における軌道修正方法及び軌道修正装置
JPH06104370B2 (ja) * 1985-07-12 1994-12-21 キヤノン株式会社 記録装置
JPS639157A (ja) * 1986-06-30 1988-01-14 Canon Inc 薄膜トランジスタの製造方法
JPH0668484B2 (ja) * 1985-09-25 1994-08-31 株式会社神戸製鋼所 ステンレス被覆管の超音波探傷方法
JPH0740711B2 (ja) * 1986-06-20 1995-05-01 キヤノン株式会社 光センサの駆動方法及び画像入力装置
JPH01137674A (ja) * 1987-11-25 1989-05-30 Matsushita Electric Ind Co Ltd 薄膜トランジスタ

Also Published As

Publication number Publication date
EP0449585A1 (de) 1991-10-02
ATE143175T1 (de) 1996-10-15
EP0449585B1 (de) 1996-09-18
US5150181A (en) 1992-09-22
DE69122148D1 (de) 1996-10-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee