DE69106625T2 - Verfahren zur Bohrung von Durchgangslöchern in gedruckte Leiterplatten. - Google Patents
Verfahren zur Bohrung von Durchgangslöchern in gedruckte Leiterplatten.Info
- Publication number
- DE69106625T2 DE69106625T2 DE69106625T DE69106625T DE69106625T2 DE 69106625 T2 DE69106625 T2 DE 69106625T2 DE 69106625 T DE69106625 T DE 69106625T DE 69106625 T DE69106625 T DE 69106625T DE 69106625 T2 DE69106625 T2 DE 69106625T2
- Authority
- DE
- Germany
- Prior art keywords
- water
- soluble lubricant
- drilling
- molecular weight
- polyoxyethylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005553 drilling Methods 0.000 title claims description 25
- 238000000034 method Methods 0.000 title claims description 19
- 239000000314 lubricant Substances 0.000 claims description 34
- -1 polyoxyethylene Polymers 0.000 claims description 24
- 239000002202 Polyethylene glycol Substances 0.000 claims description 15
- 229920001223 polyethylene glycol Polymers 0.000 claims description 15
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 claims description 3
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims description 3
- 229920001214 Polysorbate 60 Polymers 0.000 claims description 2
- 229920001400 block copolymer Polymers 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 229920000223 polyglycerol Polymers 0.000 claims description 2
- 125000004185 ester group Chemical group 0.000 claims 1
- 239000011888 foil Substances 0.000 description 13
- 238000011109 contamination Methods 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 5
- MMQZBEXYFLXHEN-UHFFFAOYSA-N OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.CCCCCCCCCCCCCCCCCC(O)=O Chemical compound OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.OCC(O)CO.CCCCCCCCCCCCCCCCCC(O)=O MMQZBEXYFLXHEN-UHFFFAOYSA-N 0.000 description 3
- 235000014113 dietary fatty acids Nutrition 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000194 fatty acid Substances 0.000 description 3
- 229930195729 fatty acid Natural products 0.000 description 3
- 101100235075 Cicer arietinum leg3 gene Proteins 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 239000008240 homogeneous mixture Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 2
- 239000001818 polyoxyethylene sorbitan monostearate Substances 0.000 description 2
- 235000010989 polyoxyethylene sorbitan monostearate Nutrition 0.000 description 2
- FFJCNSLCJOQHKM-CLFAGFIQSA-N (z)-1-[(z)-octadec-9-enoxy]octadec-9-ene Chemical compound CCCCCCCC\C=C/CCCCCCCCOCCCCCCCC\C=C/CCCCCCCC FFJCNSLCJOQHKM-CLFAGFIQSA-N 0.000 description 1
- WCOXQTXVACYMLM-UHFFFAOYSA-N 2,3-bis(12-hydroxyoctadecanoyloxy)propyl 12-hydroxyoctadecanoate Chemical compound CCCCCCC(O)CCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCC(O)CCCCCC)COC(=O)CCCCCCCCCCC(O)CCCCCC WCOXQTXVACYMLM-UHFFFAOYSA-N 0.000 description 1
- WOKDXPHSIQRTJF-UHFFFAOYSA-N 3-[3-[3-[3-[3-[3-[3-[3-[3-(2,3-dihydroxypropoxy)-2-hydroxypropoxy]-2-hydroxypropoxy]-2-hydroxypropoxy]-2-hydroxypropoxy]-2-hydroxypropoxy]-2-hydroxypropoxy]-2-hydroxypropoxy]-2-hydroxypropoxy]propane-1,2-diol Chemical compound OCC(O)COCC(O)COCC(O)COCC(O)COCC(O)COCC(O)COCC(O)COCC(O)COCC(O)COCC(O)CO WOKDXPHSIQRTJF-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 101001051081 Homo sapiens Protein LEG1 homolog Proteins 0.000 description 1
- 102100024631 Protein LEG1 homolog Human genes 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 235000015278 beef Nutrition 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 229920002114 octoxynol-9 Polymers 0.000 description 1
- 239000011101 paper laminate Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003760 tallow Substances 0.000 description 1
- 229940057400 trihydroxystearin Drugs 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/127—Lubricants, e.g. during drilling of holes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T408/00—Cutting by use of rotating axially moving tool
- Y10T408/03—Processes
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Auxiliary Devices For Machine Tools (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2208239A JP2855824B2 (ja) | 1990-08-08 | 1990-08-08 | プリント配線板の孔明け加工法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69106625D1 DE69106625D1 (de) | 1995-02-23 |
| DE69106625T2 true DE69106625T2 (de) | 1995-05-18 |
Family
ID=16552963
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69106625T Expired - Lifetime DE69106625T2 (de) | 1990-08-08 | 1991-07-31 | Verfahren zur Bohrung von Durchgangslöchern in gedruckte Leiterplatten. |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5082402A (enExample) |
| EP (1) | EP0470757B1 (enExample) |
| JP (1) | JP2855824B2 (enExample) |
| KR (1) | KR100225273B1 (enExample) |
| DE (1) | DE69106625T2 (enExample) |
| TW (1) | TW223731B (enExample) |
Families Citing this family (50)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU658320B2 (en) * | 1992-08-20 | 1995-04-06 | Shell Internationale Research Maatschappij B.V. | Copolymer compositions comprising a copolymer and one or more lubricating additives |
| JP2828129B2 (ja) * | 1993-06-07 | 1998-11-25 | 三菱瓦斯化学株式会社 | プリント配線板の孔明け加工法 |
| US5507603A (en) * | 1993-08-05 | 1996-04-16 | Dai-Ichi Kogyo Seiyaku Co., Ltd. | Method for drilling thru-holes on a lamination substrate and a sheet used therein |
| US5785465A (en) * | 1996-07-30 | 1998-07-28 | Systems Division Incorporated | Entry overlay sheet and method for drilling holes |
| US5961255A (en) * | 1996-07-30 | 1999-10-05 | Systems Division Incorporated | Entry overlay sheet and method for drilling holes |
| US5984523A (en) * | 1998-02-03 | 1999-11-16 | International Business Machines Corporation | Method for recording the heat generated in a hole wall of a substrate during a drilling operation |
| US8105690B2 (en) | 1998-03-03 | 2012-01-31 | Ppg Industries Ohio, Inc | Fiber product coated with particles to adjust the friction of the coating and the interfilament bonding |
| US6949289B1 (en) | 1998-03-03 | 2005-09-27 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| US6419981B1 (en) | 1998-03-03 | 2002-07-16 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| US6593255B1 (en) | 1998-03-03 | 2003-07-15 | Ppg Industries Ohio, Inc. | Impregnated glass fiber strands and products including the same |
| US6200074B1 (en) * | 1999-04-07 | 2001-03-13 | James J. Miller | Method for drilling circuit boards |
| JP4342119B2 (ja) | 2000-04-06 | 2009-10-14 | 株式会社神戸製鋼所 | 孔開け加工時の保護用あて板及びそれを使用したプリント配線基板の孔開け加工方法 |
| SG115399A1 (en) * | 2000-09-04 | 2005-10-28 | Mitsubishi Gas Chemical Co | Lubricant sheet for making hole and method of making hole with drill |
| US6890664B2 (en) * | 2000-09-14 | 2005-05-10 | Ohtomo Chemical Inc., Corp. | Entry boards for use in drilling small holes |
| JP4968652B2 (ja) * | 2001-07-17 | 2012-07-04 | 日本合成化学工業株式会社 | プリント配線基板穿孔用水分散性樹脂組成物、該組成物よりなるシート及びかかるシートを用いたプリント配線基板の穿孔方法 |
| US6866450B2 (en) * | 2001-10-31 | 2005-03-15 | Mitsubishi Gas Chemical Company, Inc. | Entry sheet for drilling and method for drilling hole |
| JP3976228B2 (ja) * | 2001-11-09 | 2007-09-12 | 日本合成化学工業株式会社 | プリント配線基板穿孔用シート及びかかるシートを用いたプリント配線基板の穿孔方法 |
| JP3976233B2 (ja) * | 2001-12-18 | 2007-09-12 | 日本合成化学工業株式会社 | プリント配線基板穿孔用シート及びかかるシートを用いたプリント配線基板の穿孔方法 |
| US20030129030A1 (en) * | 2002-01-04 | 2003-07-10 | Jja, Inc. | Lubricant sheet and method of forming the same |
| US8062746B2 (en) * | 2003-03-10 | 2011-11-22 | Ppg Industries, Inc. | Resin compatible yarn binder and uses thereof |
| US20050112344A1 (en) * | 2003-08-20 | 2005-05-26 | Redfern Sean M. | Apparatus and method for use in printed circuit board drilling applications |
| CN100348411C (zh) * | 2004-04-13 | 2007-11-14 | 叶云照 | 钻孔润滑铝质复合材料 |
| US7354641B2 (en) | 2004-10-12 | 2008-04-08 | Ppg Industries Ohio, Inc. | Resin compatible yarn binder and uses thereof |
| TWI260094B (en) | 2005-06-13 | 2006-08-11 | Au Optronics Corp | Active device matrix substrate |
| CN100478131C (zh) * | 2006-04-11 | 2009-04-15 | 合正科技股份有限公司 | 高速钻孔用散热辅助板材 |
| JP5011823B2 (ja) * | 2006-05-30 | 2012-08-29 | 三菱瓦斯化学株式会社 | ドリル孔明け用エントリーシートの製造方法 |
| US8095616B2 (en) * | 2006-10-05 | 2012-01-10 | Waratek Pty Ltd. | Contention detection |
| KR20080055264A (ko) * | 2006-12-15 | 2008-06-19 | 홍부진 | 천공 가공용 쉬트 |
| WO2008072930A2 (en) * | 2006-12-15 | 2008-06-19 | Bu Jin Hong | Sheets for drilling |
| JP2010540260A (ja) | 2007-09-28 | 2010-12-24 | トライ−スター ラミネーツ、 インク． | プリント回路基板に孔を開けるための改善されたシステムおよび方法 |
| JP4483929B2 (ja) * | 2007-10-30 | 2010-06-16 | セイコーエプソン株式会社 | 導体パターン形成用インク、導体パターンおよび配線基板 |
| JP5195404B2 (ja) | 2007-12-26 | 2013-05-08 | 三菱瓦斯化学株式会社 | ドリル孔明け用エントリーシートの製造方法 |
| MY153546A (en) * | 2009-06-01 | 2015-02-27 | Mitsubishi Gas Chemical Co | Entry sheet for drilling |
| RU2521908C1 (ru) | 2010-06-18 | 2014-07-10 | Мицубиси Гэс Кемикал Компани, Инк. | Трафарет для высверливания отверстий |
| BR112013006112A2 (pt) | 2010-09-17 | 2017-09-19 | Mitsubishi Gas Chemical Co | folha de entrada para perfuração |
| WO2013132837A1 (ja) | 2012-03-09 | 2013-09-12 | 三菱瓦斯化学株式会社 | ドリル孔あけ用エントリーシート |
| JP5963021B2 (ja) | 2012-03-21 | 2016-08-03 | 三菱瓦斯化学株式会社 | ドリル孔あけ用エントリーシート及びその製造方法並びにドリル孔あけ方法 |
| JP5896345B2 (ja) | 2012-03-27 | 2016-03-30 | 三菱瓦斯化学株式会社 | ドリル孔あけ用エントリーシート |
| JP6206700B2 (ja) * | 2013-03-28 | 2017-10-04 | 三菱瓦斯化学株式会社 | ドリル孔あけ用エントリーシート及びドリル孔あけ用エントリーシートの製造方法 |
| US9358618B2 (en) | 2013-07-29 | 2016-06-07 | Globalfoundries Inc. | Implementing reduced drill smear |
| SG11201608111PA (en) | 2014-03-31 | 2016-11-29 | Mitsubishi Gas Chemical Co | Entry sheet for drilling |
| KR102374773B1 (ko) | 2015-03-19 | 2022-03-15 | 미츠비시 가스 가가쿠 가부시키가이샤 | 드릴 구멍뚫기용 엔트리 시트, 및 그것을 사용한 드릴 구멍뚫기 가공 방법 |
| US10478991B2 (en) | 2015-03-19 | 2019-11-19 | Mitsubishi Gas Chemical Company, Inc. | Entry sheet for drilling and method for drilling processing using same |
| CN108025450B (zh) | 2015-09-02 | 2018-12-07 | 三菱瓦斯化学株式会社 | 钻孔用盖板、和使用其的钻孔加工方法 |
| EP3157310A1 (en) | 2015-10-12 | 2017-04-19 | Agfa Graphics Nv | An entry sheet for perforating electric boards such as printed circuit boards |
| JP6860856B2 (ja) * | 2015-11-26 | 2021-04-21 | 三菱瓦斯化学株式会社 | 繊維強化複合材の切削加工方法 |
| SG11201802212QA (en) | 2016-02-17 | 2018-04-27 | Mitsubishi Gas Chemical Co | Cutting work method and method for producing cut product |
| TWI648153B (zh) | 2016-03-14 | 2019-01-21 | Mitsubishi Gas Chemical Company, Inc. | 鑽孔用輔助板及利用該輔助板的鑽孔加工方法 |
| WO2018088267A1 (ja) | 2016-11-14 | 2018-05-17 | 三菱瓦斯化学株式会社 | 構成刃先形成用部材及び構成刃先形成方法 |
| EP3633014B1 (en) | 2017-05-25 | 2026-01-07 | Mitsubishi Gas Chemical Company, Inc. | Cutting work assisting lubricating material, cutting work assisting lubricating sheet, and cutting method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2488676B1 (fr) * | 1980-08-18 | 1986-03-28 | Dacral | Procede de traitement de toles prerevetues avant faconnage |
| JPS5780495A (en) * | 1980-11-07 | 1982-05-20 | Kao Corp | Plastic working oil composition for metal |
| US4519732A (en) * | 1983-12-09 | 1985-05-28 | United Technologies Corporation | Method for the machining of composite materials |
| US4929370A (en) * | 1986-10-14 | 1990-05-29 | Lubra Sheet Corporation | Dry lubricant drilling of thru-holes in printed circuit boards |
| US4781495A (en) * | 1986-10-14 | 1988-11-01 | Lubra Sheet Corp. | Dry lubricant drilling of thru-holes in printed circuit boards |
-
1990
- 1990-08-08 JP JP2208239A patent/JP2855824B2/ja not_active Expired - Lifetime
-
1991
- 1991-07-29 US US07/737,234 patent/US5082402A/en not_active Expired - Lifetime
- 1991-07-31 EP EP91307032A patent/EP0470757B1/en not_active Expired - Lifetime
- 1991-07-31 DE DE69106625T patent/DE69106625T2/de not_active Expired - Lifetime
- 1991-08-08 KR KR1019910013698A patent/KR100225273B1/ko not_active Expired - Fee Related
- 1991-08-19 TW TW080106565A patent/TW223731B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US5082402A (en) | 1992-01-21 |
| KR100225273B1 (ko) | 1999-10-15 |
| DE69106625D1 (de) | 1995-02-23 |
| EP0470757A2 (en) | 1992-02-12 |
| EP0470757A3 (en) | 1992-06-24 |
| TW223731B (enExample) | 1994-05-11 |
| JPH0492494A (ja) | 1992-03-25 |
| KR920005676A (ko) | 1992-03-28 |
| JP2855824B2 (ja) | 1999-02-10 |
| EP0470757B1 (en) | 1995-01-11 |
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