DE69404903T2 - Verfahren zum Bohren eines Lochs für eine Leiterplatte - Google Patents
Verfahren zum Bohren eines Lochs für eine LeiterplatteInfo
- Publication number
- DE69404903T2 DE69404903T2 DE69404903T DE69404903T DE69404903T2 DE 69404903 T2 DE69404903 T2 DE 69404903T2 DE 69404903 T DE69404903 T DE 69404903T DE 69404903 T DE69404903 T DE 69404903T DE 69404903 T2 DE69404903 T2 DE 69404903T2
- Authority
- DE
- Germany
- Prior art keywords
- drilling
- hole
- circuit board
- printed circuit
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/127—Lubricants, e.g. during drilling of holes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T408/00—Cutting by use of rotating axially moving tool
- Y10T408/03—Processes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T408/00—Cutting by use of rotating axially moving tool
- Y10T408/44—Cutting by use of rotating axially moving tool with means to apply transient, fluent medium to work or product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Laminated Bodies (AREA)
- Drilling And Boring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5135817A JP2828129B2 (ja) | 1993-06-07 | 1993-06-07 | プリント配線板の孔明け加工法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69404903D1 DE69404903D1 (de) | 1997-09-18 |
DE69404903T2 true DE69404903T2 (de) | 1998-01-02 |
Family
ID=15160506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69404903T Expired - Lifetime DE69404903T2 (de) | 1993-06-07 | 1994-06-03 | Verfahren zum Bohren eines Lochs für eine Leiterplatte |
Country Status (5)
Country | Link |
---|---|
US (1) | US5480269A (de) |
EP (1) | EP0629109B1 (de) |
JP (1) | JP2828129B2 (de) |
DE (1) | DE69404903T2 (de) |
TW (1) | TW253098B (de) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5961255A (en) * | 1996-07-30 | 1999-10-05 | Systems Division Incorporated | Entry overlay sheet and method for drilling holes |
US5785465A (en) * | 1996-07-30 | 1998-07-28 | Systems Division Incorporated | Entry overlay sheet and method for drilling holes |
JP4543243B2 (ja) * | 1999-06-01 | 2010-09-15 | 昭和電工パッケージング株式会社 | 小径孔あけ加工用あて板および小径孔あけ加工方法 |
JP4342119B2 (ja) | 2000-04-06 | 2009-10-14 | 株式会社神戸製鋼所 | 孔開け加工時の保護用あて板及びそれを使用したプリント配線基板の孔開け加工方法 |
JP4201462B2 (ja) * | 2000-06-05 | 2008-12-24 | 利昌工業株式会社 | ドリル加工用エントリーボード |
JP4605323B2 (ja) * | 2000-09-04 | 2011-01-05 | 三菱瓦斯化学株式会社 | 孔明け用滑剤シート及びドリル孔明け加工法 |
SG115399A1 (en) * | 2000-09-04 | 2005-10-28 | Mitsubishi Gas Chemical Co | Lubricant sheet for making hole and method of making hole with drill |
JP5041621B2 (ja) * | 2000-10-11 | 2012-10-03 | 三菱瓦斯化学株式会社 | 孔明け用金属箔複合シート及びドリル孔明け加工法 |
JP4449196B2 (ja) * | 2000-09-04 | 2010-04-14 | 三菱瓦斯化学株式会社 | 孔明け用滑剤シート及びドリル孔明け加工法 |
JP2002301694A (ja) * | 2001-04-05 | 2002-10-15 | Mitsubishi Gas Chem Co Inc | 孔明け用金属箔複合シート及びドリル孔明け加工法 |
JP4810722B2 (ja) * | 2000-09-04 | 2011-11-09 | 三菱瓦斯化学株式会社 | 孔明け用滑剤シート及び孔明け加工法 |
KR100789206B1 (ko) * | 2000-09-14 | 2007-12-31 | 오토모 가가쿠 산교 가부시키가이샤 | 소공 천공에 사용하기 위한 엔트리 기판 |
US6669805B2 (en) * | 2001-02-16 | 2003-12-30 | International Business Machines Corporation | Drill stack formation |
US6866450B2 (en) * | 2001-10-31 | 2005-03-15 | Mitsubishi Gas Chemical Company, Inc. | Entry sheet for drilling and method for drilling hole |
US20030129030A1 (en) * | 2002-01-04 | 2003-07-10 | Jja, Inc. | Lubricant sheet and method of forming the same |
CN100348411C (zh) * | 2004-04-13 | 2007-11-14 | 叶云照 | 钻孔润滑铝质复合材料 |
US20060062996A1 (en) * | 2004-09-22 | 2006-03-23 | Yun-Chao Yeh | Resin matrix composite with aluminum for lubrication in drilling |
JP5079238B2 (ja) * | 2006-01-23 | 2012-11-21 | 日本メクトロン株式会社 | 混成多層回路基板の製造方法 |
JP5011823B2 (ja) * | 2006-05-30 | 2012-08-29 | 三菱瓦斯化学株式会社 | ドリル孔明け用エントリーシートの製造方法 |
JP5324037B2 (ja) * | 2006-10-12 | 2013-10-23 | 大智化学産業株式会社 | 孔あけ加工用当て板及び孔あけ加工方法 |
JP4856511B2 (ja) * | 2006-10-12 | 2012-01-18 | 大智化学産業株式会社 | 孔あけ加工用当て板及び孔あけ加工方法 |
JP2010540260A (ja) | 2007-09-28 | 2010-12-24 | トライ−スター ラミネーツ、 インク. | プリント回路基板に孔を開けるための改善されたシステムおよび方法 |
JP5195404B2 (ja) | 2007-12-26 | 2013-05-08 | 三菱瓦斯化学株式会社 | ドリル孔明け用エントリーシートの製造方法 |
JP2011097066A (ja) * | 2010-11-25 | 2011-05-12 | Mitsubishi Gas Chemical Co Inc | 孔明け用金属箔複合シート及びドリル孔明け加工法 |
JP2012049550A (ja) * | 2011-09-27 | 2012-03-08 | Mitsubishi Gas Chemical Co Inc | 孔明け用金属箔複合シート及びドリル孔明け加工法 |
JP2013099848A (ja) * | 2013-02-12 | 2013-05-23 | Mitsubishi Gas Chemical Co Inc | 孔明け用金属箔複合シート及びドリル孔明け加工法 |
JP6206700B2 (ja) * | 2013-03-28 | 2017-10-04 | 三菱瓦斯化学株式会社 | ドリル孔あけ用エントリーシート及びドリル孔あけ用エントリーシートの製造方法 |
GB2533058A (en) | 2013-08-30 | 2016-06-08 | Halliburton Energy Services Inc | High-temperature lubricants comprising elongated carbon nanoparticles for use in subterranean formation operations |
US9528066B2 (en) | 2013-08-30 | 2016-12-27 | Halliburton Energy Services, Inc. | High-temperature lubricants comprising elongated carbon nanoparticles for use in subterranean formation operations |
KR20160017888A (ko) | 2014-08-07 | 2016-02-17 | 지티에이 일렉트로닉스 컴퍼니 리미티드 | 드릴링용 가이드 시트의 감광성 코팅수지 및 그 응용 |
EP3157310A1 (de) | 2015-10-12 | 2017-04-19 | Agfa Graphics Nv | Erfassungsblatt zur perforation elektrischer platten, wie etwa leiterplatten |
KR101975156B1 (ko) * | 2016-03-14 | 2019-05-03 | 미츠비시 가스 가가쿠 가부시키가이샤 | 드릴 천공용 엔트리 시트, 및 그것을 사용한 드릴 천공 가공 방법 |
CN110099515B (zh) * | 2019-05-22 | 2021-09-14 | 深圳市柳鑫实业股份有限公司 | 一种改善pcb钻孔的方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4781495A (en) * | 1986-10-14 | 1988-11-01 | Lubra Sheet Corp. | Dry lubricant drilling of thru-holes in printed circuit boards |
US4929370A (en) * | 1986-10-14 | 1990-05-29 | Lubra Sheet Corporation | Dry lubricant drilling of thru-holes in printed circuit boards |
US5067859A (en) * | 1990-02-15 | 1991-11-26 | Systems Division Incorporated | Method for drilling small holes in printed circuit boards |
JP2855824B2 (ja) * | 1990-08-08 | 1999-02-10 | 三菱瓦斯化学株式会社 | プリント配線板の孔明け加工法 |
CN1047716C (zh) * | 1991-02-07 | 1999-12-22 | 霍尔德斯科技有限公司 | 在印刷电路板钻孔过程中贴靠印刷电路板的引入板或垫板 |
-
1993
- 1993-06-07 JP JP5135817A patent/JP2828129B2/ja not_active Expired - Lifetime
-
1994
- 1994-06-03 EP EP94303982A patent/EP0629109B1/de not_active Expired - Lifetime
- 1994-06-03 DE DE69404903T patent/DE69404903T2/de not_active Expired - Lifetime
- 1994-06-06 US US08/254,913 patent/US5480269A/en not_active Expired - Lifetime
- 1994-06-07 TW TW083105176A patent/TW253098B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
US5480269A (en) | 1996-01-02 |
EP0629109B1 (de) | 1997-08-13 |
DE69404903D1 (de) | 1997-09-18 |
JP2828129B2 (ja) | 1998-11-25 |
JPH06344297A (ja) | 1994-12-20 |
TW253098B (de) | 1995-08-01 |
EP0629109A1 (de) | 1994-12-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |