TW253098B - - Google Patents

Info

Publication number
TW253098B
TW253098B TW083105176A TW83105176A TW253098B TW 253098 B TW253098 B TW 253098B TW 083105176 A TW083105176 A TW 083105176A TW 83105176 A TW83105176 A TW 83105176A TW 253098 B TW253098 B TW 253098B
Authority
TW
Taiwan
Application number
TW083105176A
Original Assignee
Mitsubishi Gas Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Gas Chemical Co filed Critical Mitsubishi Gas Chemical Co
Application granted granted Critical
Publication of TW253098B publication Critical patent/TW253098B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/03—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/44—Cutting by use of rotating axially moving tool with means to apply transient, fluent medium to work or product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Laminated Bodies (AREA)
  • Drilling And Boring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW083105176A 1993-06-07 1994-06-07 TW253098B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5135817A JP2828129B2 (ja) 1993-06-07 1993-06-07 プリント配線板の孔明け加工法

Publications (1)

Publication Number Publication Date
TW253098B true TW253098B (zh) 1995-08-01

Family

ID=15160506

Family Applications (1)

Application Number Title Priority Date Filing Date
TW083105176A TW253098B (zh) 1993-06-07 1994-06-07

Country Status (5)

Country Link
US (1) US5480269A (zh)
EP (1) EP0629109B1 (zh)
JP (1) JP2828129B2 (zh)
DE (1) DE69404903T2 (zh)
TW (1) TW253098B (zh)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5961255A (en) * 1996-07-30 1999-10-05 Systems Division Incorporated Entry overlay sheet and method for drilling holes
US5785465A (en) * 1996-07-30 1998-07-28 Systems Division Incorporated Entry overlay sheet and method for drilling holes
JP4543243B2 (ja) * 1999-06-01 2010-09-15 昭和電工パッケージング株式会社 小径孔あけ加工用あて板および小径孔あけ加工方法
JP4342119B2 (ja) 2000-04-06 2009-10-14 株式会社神戸製鋼所 孔開け加工時の保護用あて板及びそれを使用したプリント配線基板の孔開け加工方法
JP4201462B2 (ja) * 2000-06-05 2008-12-24 利昌工業株式会社 ドリル加工用エントリーボード
JP5041621B2 (ja) * 2000-10-11 2012-10-03 三菱瓦斯化学株式会社 孔明け用金属箔複合シート及びドリル孔明け加工法
JP4605323B2 (ja) * 2000-09-04 2011-01-05 三菱瓦斯化学株式会社 孔明け用滑剤シート及びドリル孔明け加工法
JP2002301694A (ja) * 2001-04-05 2002-10-15 Mitsubishi Gas Chem Co Inc 孔明け用金属箔複合シート及びドリル孔明け加工法
SG115399A1 (en) 2000-09-04 2005-10-28 Mitsubishi Gas Chemical Co Lubricant sheet for making hole and method of making hole with drill
JP4449196B2 (ja) * 2000-09-04 2010-04-14 三菱瓦斯化学株式会社 孔明け用滑剤シート及びドリル孔明け加工法
JP4810722B2 (ja) * 2000-09-04 2011-11-09 三菱瓦斯化学株式会社 孔明け用滑剤シート及び孔明け加工法
AU2001284510A1 (en) * 2000-09-14 2002-03-26 Ohtomo Chemical Ins., Corp. Entry boards for use in drilling small holes
US6669805B2 (en) * 2001-02-16 2003-12-30 International Business Machines Corporation Drill stack formation
US6866450B2 (en) * 2001-10-31 2005-03-15 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling and method for drilling hole
US20030129030A1 (en) * 2002-01-04 2003-07-10 Jja, Inc. Lubricant sheet and method of forming the same
CN100348411C (zh) * 2004-04-13 2007-11-14 叶云照 钻孔润滑铝质复合材料
US20060062996A1 (en) * 2004-09-22 2006-03-23 Yun-Chao Yeh Resin matrix composite with aluminum for lubrication in drilling
JP5079238B2 (ja) * 2006-01-23 2012-11-21 日本メクトロン株式会社 混成多層回路基板の製造方法
JP5011823B2 (ja) * 2006-05-30 2012-08-29 三菱瓦斯化学株式会社 ドリル孔明け用エントリーシートの製造方法
JP4856511B2 (ja) * 2006-10-12 2012-01-18 大智化学産業株式会社 孔あけ加工用当て板及び孔あけ加工方法
JP5324037B2 (ja) * 2006-10-12 2013-10-23 大智化学産業株式会社 孔あけ加工用当て板及び孔あけ加工方法
WO2009045932A1 (en) 2007-09-28 2009-04-09 Tri-Star Laminates, Inc. Improved systems and methods for drilling holes in printed circuit boards
TWI407854B (zh) 2007-12-26 2013-09-01 Mitsubishi Gas Chemical Co 鑽孔用蓋板之製造方法及蓋板
JP2011097066A (ja) * 2010-11-25 2011-05-12 Mitsubishi Gas Chemical Co Inc 孔明け用金属箔複合シート及びドリル孔明け加工法
JP2012049550A (ja) * 2011-09-27 2012-03-08 Mitsubishi Gas Chemical Co Inc 孔明け用金属箔複合シート及びドリル孔明け加工法
JP2013099848A (ja) * 2013-02-12 2013-05-23 Mitsubishi Gas Chemical Co Inc 孔明け用金属箔複合シート及びドリル孔明け加工法
JP6206700B2 (ja) * 2013-03-28 2017-10-04 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート及びドリル孔あけ用エントリーシートの製造方法
US9528066B2 (en) 2013-08-30 2016-12-27 Halliburton Energy Services, Inc. High-temperature lubricants comprising elongated carbon nanoparticles for use in subterranean formation operations
US9493723B2 (en) 2013-08-30 2016-11-15 Halliburton Energy Services, Inc. High-temperature lubricants comprising elongated carbon nanoparticles for use in subterranean formation operations
KR20160017888A (ko) 2014-08-07 2016-02-17 지티에이 일렉트로닉스 컴퍼니 리미티드 드릴링용 가이드 시트의 감광성 코팅수지 및 그 응용
EP3157310A1 (en) 2015-10-12 2017-04-19 Agfa Graphics Nv An entry sheet for perforating electric boards such as printed circuit boards
WO2017159660A1 (ja) * 2016-03-14 2017-09-21 三菱瓦斯化学株式会社 ドリル孔あけ用エントリーシート、及びそれを用いたドリル孔あけ加工方法
CN110099515B (zh) * 2019-05-22 2021-09-14 深圳市柳鑫实业股份有限公司 一种改善pcb钻孔的方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4781495A (en) * 1986-10-14 1988-11-01 Lubra Sheet Corp. Dry lubricant drilling of thru-holes in printed circuit boards
US4929370A (en) * 1986-10-14 1990-05-29 Lubra Sheet Corporation Dry lubricant drilling of thru-holes in printed circuit boards
US5067859A (en) * 1990-02-15 1991-11-26 Systems Division Incorporated Method for drilling small holes in printed circuit boards
JP2855824B2 (ja) * 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 プリント配線板の孔明け加工法
CN1047716C (zh) * 1991-02-07 1999-12-22 霍尔德斯科技有限公司 在印刷电路板钻孔过程中贴靠印刷电路板的引入板或垫板

Also Published As

Publication number Publication date
JP2828129B2 (ja) 1998-11-25
DE69404903D1 (de) 1997-09-18
US5480269A (en) 1996-01-02
EP0629109B1 (en) 1997-08-13
EP0629109A1 (en) 1994-12-14
DE69404903T2 (de) 1998-01-02
JPH06344297A (ja) 1994-12-20

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Legal Events

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MK4A Expiration of patent term of an invention patent