AU2001284510A1 - Entry boards for use in drilling small holes - Google Patents

Entry boards for use in drilling small holes

Info

Publication number
AU2001284510A1
AU2001284510A1 AU2001284510A AU8451001A AU2001284510A1 AU 2001284510 A1 AU2001284510 A1 AU 2001284510A1 AU 2001284510 A AU2001284510 A AU 2001284510A AU 8451001 A AU8451001 A AU 8451001A AU 2001284510 A1 AU2001284510 A1 AU 2001284510A1
Authority
AU
Australia
Prior art keywords
small holes
drilling small
entry boards
boards
entry
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001284510A
Inventor
Shingo Kaburagi
Hideo Kawai
Susumu Takada
Yoshikazu Uda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ohtomo Chemical Ins Corp
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Ohtomo Chemical Ins Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK, Ohtomo Chemical Ins Corp filed Critical Showa Denko KK
Publication of AU2001284510A1 publication Critical patent/AU2001284510A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B35/00—Methods for boring or drilling, or for working essentially requiring the use of boring or drilling machines; Use of auxiliary equipment in connection with such methods
    • B23B35/005—Measures for preventing splittering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2250/00—Compensating adverse effects during turning, boring or drilling
    • B23B2250/12—Cooling and lubrication
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/127—Lubricants, e.g. during drilling of holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T408/00—Cutting by use of rotating axially moving tool
    • Y10T408/03—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12292—Workpiece with longitudinal passageway or stopweld material [e.g., for tubular stock, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12736—Al-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31692—Next to addition polymer from unsaturated monomers
AU2001284510A 2000-09-14 2001-09-10 Entry boards for use in drilling small holes Abandoned AU2001284510A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000-279464 2000-09-14
JP2000279464 2000-09-14
US30314701P 2001-07-06 2001-07-06
US60303147 2001-07-06
PCT/JP2001/007850 WO2002022329A1 (en) 2000-09-14 2001-09-10 Entry boards for use in drilling small holes

Publications (1)

Publication Number Publication Date
AU2001284510A1 true AU2001284510A1 (en) 2002-03-26

Family

ID=26599965

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001284510A Abandoned AU2001284510A1 (en) 2000-09-14 2001-09-10 Entry boards for use in drilling small holes

Country Status (7)

Country Link
US (1) US6890664B2 (en)
JP (2) JP4798327B2 (en)
KR (1) KR100789206B1 (en)
CN (1) CN1275747C (en)
AU (1) AU2001284510A1 (en)
TW (1) TW521029B (en)
WO (1) WO2002022329A1 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6890664B2 (en) * 2000-09-14 2005-05-10 Ohtomo Chemical Inc., Corp. Entry boards for use in drilling small holes
JP4968651B2 (en) * 2001-07-17 2012-07-04 日本合成化学工業株式会社 Water-soluble resin composition for punching printed wiring board, sheet made of the composition, and method for punching printed wiring board using such sheet
JP4481553B2 (en) * 2002-06-07 2010-06-16 日本合成化学工業株式会社 Printed circuit board punching sheet and printed circuit board punching method using the sheet
JP4541128B2 (en) * 2004-12-24 2010-09-08 昭和電工パッケージング株式会社 Entry board for small-diameter drilling and small-diameter drilling method
JP4541133B2 (en) * 2004-12-27 2010-09-08 昭和電工パッケージング株式会社 Entry board for small-diameter drilling and small-diameter drilling method
JP4541134B2 (en) * 2004-12-27 2010-09-08 昭和電工パッケージング株式会社 Entry board for small-diameter drilling and small-diameter drilling method
JP4541132B2 (en) * 2004-12-27 2010-09-08 昭和電工パッケージング株式会社 Entry board for small-diameter drilling and small-diameter drilling method
US7665028B2 (en) * 2005-07-13 2010-02-16 Microsoft Corporation Rich drag drop user interface
TWI298007B (en) * 2006-04-03 2008-06-11 Uniplus Electronics Co Ltd Heat-dissipating accessory plate for high speed drilling
CN100478131C (en) * 2006-04-11 2009-04-15 合正科技股份有限公司 Heat radiation assistant board used for high speed drilling
WO2009045932A1 (en) 2007-09-28 2009-04-09 Tri-Star Laminates, Inc. Improved systems and methods for drilling holes in printed circuit boards
MY157756A (en) * 2010-06-18 2016-07-15 Mitsubishi Gas Chemical Co Entry sheet for drilling
JP5445524B2 (en) * 2011-06-27 2014-03-19 三菱瓦斯化学株式会社 Entry sheet for drilling
TWI419750B (en) * 2012-02-13 2013-12-21 Unisurpass Technology Co Ltd A multi-purpose board for drilling process
CN103317791A (en) * 2012-03-22 2013-09-25 叶云照 Drilling cover plate with double-sided metal materials
CN103056918A (en) * 2012-12-21 2013-04-24 深圳市柳鑫实业有限公司 Aluminum sheet for improving accuracy of hole site of drill hole and manufacturing method
KR101411979B1 (en) 2013-10-07 2014-06-26 신창핫멜트 주식회사 The fabrication method of hole sheet for board drilling and hole sheet thereby
US11383307B2 (en) 2015-09-02 2022-07-12 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling and method for drilling processing using same
RU2693232C1 (en) * 2015-11-26 2019-07-01 Мицубиси Гэс Кемикал Компани, Инк. Method of cutting fiber-reinforced composite material
BR112018007991A2 (en) 2016-02-17 2018-10-30 Mitsubishi Gas Chemical Company, Inc. cutting work method and method to produce a cut product
SG11201811038WA (en) * 2016-06-13 2019-01-30 Mitsubishi Gas Chemical Co Drill bit and hole formation method
US11819930B2 (en) 2016-11-14 2023-11-21 Mitsubishi Gas Chemical Company, Inc. Material for built-up edge formation and built-up edge formation method
JP7057901B2 (en) 2017-05-25 2022-04-21 三菱瓦斯化学株式会社 Cutting auxiliary lubricant, cutting auxiliary lubricant sheet, and cutting method
JP6758557B2 (en) * 2018-12-27 2020-09-23 大智化学産業株式会社 Support plate for drilling

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2548204B2 (en) * 1987-06-27 1996-10-30 電気化学工業株式会社 New bioactive polypeptide
US4781495A (en) * 1986-10-14 1988-11-01 Lubra Sheet Corp. Dry lubricant drilling of thru-holes in printed circuit boards
JPH01171710A (en) * 1987-12-23 1989-07-06 Sumitomo Bakelite Co Ltd Entry board
JP2855824B2 (en) * 1990-08-08 1999-02-10 三菱瓦斯化学株式会社 Drilling method for printed wiring boards
CN1047716C (en) * 1991-02-07 1999-12-22 霍尔德斯科技有限公司 Drilling printed circuit boards and entry and backing boards therefor
JP2828129B2 (en) * 1993-06-07 1998-11-25 三菱瓦斯化学株式会社 Drilling method for printed wiring boards
US5507603A (en) * 1993-08-05 1996-04-16 Dai-Ichi Kogyo Seiyaku Co., Ltd. Method for drilling thru-holes on a lamination substrate and a sheet used therein
JP3459295B2 (en) * 1994-05-17 2003-10-20 第一工業製薬株式会社 Drilling method for laminated substrate and backing plate used for it
JPH08155896A (en) 1994-12-01 1996-06-18 Mitsubishi Plastics Ind Ltd Sheet for boring work for printed wiring board
JPH106298A (en) 1996-06-18 1998-01-13 Dai Ichi Kogyo Seiyaku Co Ltd Boring method for laminate base board and sheet used for the boring method
US5961255A (en) * 1996-07-30 1999-10-05 Systems Division Incorporated Entry overlay sheet and method for drilling holes
US5785465A (en) * 1996-07-30 1998-07-28 Systems Division Incorporated Entry overlay sheet and method for drilling holes
JP3693787B2 (en) * 1997-05-30 2005-09-07 三菱アルミニウム株式会社 Plating board for drilling printed wiring board and drilling method for printed wiring board
JP4543243B2 (en) * 1999-06-01 2010-09-15 昭和電工パッケージング株式会社 Small diameter drilling plate and small diameter drilling method
US20020085888A1 (en) * 2000-02-22 2002-07-04 Vedagiri Velpari Electronic supports and methods and apparatus for forming apertures in electronic supports
SG115399A1 (en) * 2000-09-04 2005-10-28 Mitsubishi Gas Chemical Co Lubricant sheet for making hole and method of making hole with drill
US6890664B2 (en) * 2000-09-14 2005-05-10 Ohtomo Chemical Inc., Corp. Entry boards for use in drilling small holes
US6866450B2 (en) * 2001-10-31 2005-03-15 Mitsubishi Gas Chemical Company, Inc. Entry sheet for drilling and method for drilling hole
US20030129030A1 (en) * 2002-01-04 2003-07-10 Jja, Inc. Lubricant sheet and method of forming the same

Also Published As

Publication number Publication date
WO2002022329A1 (en) 2002-03-21
JP2008055598A (en) 2008-03-13
JP2004516149A (en) 2004-06-03
TW521029B (en) 2003-02-21
JP4798327B2 (en) 2011-10-19
JP4793358B2 (en) 2011-10-12
CN1275747C (en) 2006-09-20
KR100789206B1 (en) 2007-12-31
US20040023059A1 (en) 2004-02-05
CN1455719A (en) 2003-11-12
KR20030036770A (en) 2003-05-09
US6890664B2 (en) 2005-05-10

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