DE69033718D1 - Keramisches Substrat angewendet zum Herstellen einer elektrischen oder elektronischen Schaltung - Google Patents

Keramisches Substrat angewendet zum Herstellen einer elektrischen oder elektronischen Schaltung

Info

Publication number
DE69033718D1
DE69033718D1 DE69033718T DE69033718T DE69033718D1 DE 69033718 D1 DE69033718 D1 DE 69033718D1 DE 69033718 T DE69033718 T DE 69033718T DE 69033718 T DE69033718 T DE 69033718T DE 69033718 D1 DE69033718 D1 DE 69033718D1
Authority
DE
Germany
Prior art keywords
electrical
make
electronic circuit
ceramic substrate
substrate used
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Revoked
Application number
DE69033718T
Other languages
English (en)
Other versions
DE69033718T2 (de
Inventor
Hideaki Yoshida
C O Mitsubishi Metal Kuromitsu
Makoto Toriumi
Michio Yuzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26456504&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69033718(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from JP1263710A external-priority patent/JP2658435B2/ja
Priority claimed from JP11858889U external-priority patent/JPH0810202Y2/ja
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of DE69033718D1 publication Critical patent/DE69033718D1/de
Application granted granted Critical
Publication of DE69033718T2 publication Critical patent/DE69033718T2/de
Anticipated expiration legal-status Critical
Revoked legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Ceramic Products (AREA)
  • Structure Of Printed Boards (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
DE69033718T 1989-10-09 1990-10-08 Keramisches Substrat angewendet zum Herstellen einer elektrischen oder elektronischen Schaltung Revoked DE69033718T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1263710A JP2658435B2 (ja) 1989-10-09 1989-10-09 半導体装置用軽量基板
JP11858889U JPH0810202Y2 (ja) 1989-10-09 1989-10-09 半導体装置用軽量基板

Publications (2)

Publication Number Publication Date
DE69033718D1 true DE69033718D1 (de) 2001-05-03
DE69033718T2 DE69033718T2 (de) 2001-11-15

Family

ID=26456504

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69034139T Expired - Lifetime DE69034139T2 (de) 1989-10-09 1990-10-08 Keramiksubstrat zur Herstellung elektrischer oder elektronischer Schaltungen
DE69033718T Revoked DE69033718T2 (de) 1989-10-09 1990-10-08 Keramisches Substrat angewendet zum Herstellen einer elektrischen oder elektronischen Schaltung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69034139T Expired - Lifetime DE69034139T2 (de) 1989-10-09 1990-10-08 Keramiksubstrat zur Herstellung elektrischer oder elektronischer Schaltungen

Country Status (4)

Country Link
US (1) US5130498A (de)
EP (2) EP0422558B1 (de)
KR (1) KR0173782B1 (de)
DE (2) DE69034139T2 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69127927T2 (de) * 1990-05-02 1998-06-04 Mitsubishi Materials Corp Keramisches Substrat verwendet für eine elektrische oder elektronische Schaltung
US5616421A (en) * 1991-04-08 1997-04-01 Aluminum Company Of America Metal matrix composites containing electrical insulators
US5570502A (en) * 1991-04-08 1996-11-05 Aluminum Company Of America Fabricating metal matrix composites containing electrical insulators
US5775403A (en) * 1991-04-08 1998-07-07 Aluminum Company Of America Incorporating partially sintered preforms in metal matrix composites
US5474834A (en) * 1992-03-09 1995-12-12 Kyocera Corporation Superconducting circuit sub-assembly having an oxygen shielding barrier layer
WO1995002900A1 (en) * 1993-07-15 1995-01-26 Astarix, Inc. Aluminum-palladium alloy for initiation of electroless plating
US5965193A (en) 1994-04-11 1999-10-12 Dowa Mining Co., Ltd. Process for preparing a ceramic electronic circuit board and process for preparing aluminum or aluminum alloy bonded ceramic material
ES2163043T3 (es) * 1995-10-16 2002-01-16 Siemens Nv Matriz de rejilla de resaltes de polimero.
US5700549A (en) * 1996-06-24 1997-12-23 International Business Machines Corporation Structure to reduce stress in multilayer ceramic substrates
US6033787A (en) * 1996-08-22 2000-03-07 Mitsubishi Materials Corporation Ceramic circuit board with heat sink
DE19654606C2 (de) * 1996-12-20 1998-10-22 Siemens Ag Beidseitig oder mehrschichtig kupferkaschierte Leiterplatte und Verfahren zu ihrer Herstellung
JP3864282B2 (ja) 1998-09-22 2006-12-27 三菱マテリアル株式会社 パワーモジュール用基板及びその製造方法並びにこの基板を用いた半導体装置
JP2001148451A (ja) 1999-03-24 2001-05-29 Mitsubishi Materials Corp パワーモジュール用基板
DK1056321T3 (da) * 1999-05-28 2008-03-03 Denki Kagaku Kogyo Kk Keramisk substratkredslöb og dets fremstillingsproces
JP4649027B2 (ja) * 1999-09-28 2011-03-09 株式会社東芝 セラミックス回路基板
US6485816B2 (en) 2000-01-31 2002-11-26 Ngk Insulators, Ltd. Laminated radiation member, power semiconductor apparatus, and method for producing the same
EP1315205A4 (de) * 2000-08-09 2009-04-01 Mitsubishi Materials Corp Leistungsmodul und leistungsmodul mit kühlkörper
AU2002218493A1 (en) * 2000-11-29 2002-06-11 Denki Kagaku Kogyo Kabushiki Kaisha Integral-type ceramic circuit board and method of producing same
KR100565139B1 (ko) * 2001-02-22 2006-03-30 니뽄 가이시 가부시키가이샤 전자 회로용 부재 및 그 제조 방법과 전자 부품
US6670216B2 (en) 2001-10-31 2003-12-30 Ixys Corporation Method for manufacturing a power semiconductor device and direct bonded substrate thereof
JP2003163315A (ja) * 2001-11-29 2003-06-06 Denki Kagaku Kogyo Kk モジュール
ATE552717T1 (de) * 2002-04-19 2012-04-15 Mitsubishi Materials Corp Leiterplatte, prozess zu ihrer herstellung und stromversorgungsmodul
JP4028452B2 (ja) * 2003-08-27 2007-12-26 Ｄｏｗａホールディングス株式会社 電子部品搭載基板およびその製造方法
CN100508698C (zh) * 2003-09-25 2009-07-01 株式会社东芝 陶瓷电路板、其生产方法以及电源模块
KR101108454B1 (ko) * 2004-04-05 2012-01-31 미쓰비시 마테리알 가부시키가이샤 Ａｌ／ＡｌＮ 접합체, 전력 모듈용 기판 및 전력 모듈, 그리고 Ａｌ／ＡｌＮ 접합체의 제조 방법
WO2008004851A1 (en) * 2006-07-06 2008-01-10 Globetronics Industries Sdn Bhd (17765-H) A hybrid substrate and method of manufacturing the same
JP4832419B2 (ja) * 2007-12-25 2011-12-07 トヨタ自動車株式会社 半導体モジュール
JP5675610B2 (ja) * 2009-07-24 2015-02-25 株式会社東芝 窒化珪素製絶縁シートおよびそれを用いた半導体モジュール構造体
JP6307832B2 (ja) * 2013-01-22 2018-04-11 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール
JP6614026B2 (ja) * 2016-05-20 2019-12-04 株式会社オートネットワーク技術研究所 電磁シールド部材、配線モジュール及び電磁シールド部材の製造方法
CN106888551A (zh) * 2017-04-17 2017-06-23 深圳市环基实业有限公司 一种陶瓷基覆铜板及其制备工艺

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3829598A (en) * 1972-09-25 1974-08-13 Hutson Ind Inc Copper heat sinks for electronic devices and method of making same
US4409278A (en) * 1981-04-16 1983-10-11 General Electric Company Blister-free direct bonding of metals to ceramics and metals
EP0097944B1 (de) * 1982-06-29 1988-06-01 Kabushiki Kaisha Toshiba Verfahren zum direkten Verbinden von keramischen- und Metallkörpern und derartiger Verbundkörper
JPS59228740A (ja) * 1983-06-10 1984-12-22 Toshiba Corp 耐熱性絶縁板
US4700273A (en) * 1986-06-03 1987-10-13 Kaufman Lance R Circuit assembly with semiconductor expansion matched thermal path
JPS6318648A (ja) * 1986-07-11 1988-01-26 Toshiba Corp 窒化アルミニウム回路基板
JPH0834265B2 (ja) * 1987-07-07 1996-03-29 株式会社東芝 良熱伝導性基板
US4791075A (en) * 1987-10-05 1988-12-13 Motorola, Inc. Process for making a hermetic low cost pin grid array package
JPH01214194A (ja) * 1988-02-23 1989-08-28 Toshiba Corp 熱伝導性基板
JP2503775B2 (ja) * 1988-09-30 1996-06-05 三菱マテリアル株式会社 半導体装置用基板

Also Published As

Publication number Publication date
EP1020914A2 (de) 2000-07-19
KR910008854A (ko) 1991-05-31
EP0422558B1 (de) 2001-03-28
EP1020914A3 (de) 2000-08-02
KR0173782B1 (ko) 1999-02-01
EP0422558A2 (de) 1991-04-17
EP0422558A3 (en) 1991-12-18
EP1020914B1 (de) 2004-04-28
US5130498A (en) 1992-07-14
DE69034139T2 (de) 2004-11-25
DE69033718T2 (de) 2001-11-15
DE69034139D1 (de) 2004-06-03

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8331 Complete revocation