KR880017045U - 칩 전자부품의 세라믹 기판 - Google Patents

칩 전자부품의 세라믹 기판

Info

Publication number
KR880017045U
KR880017045U KR2019870001952U KR870001952U KR880017045U KR 880017045 U KR880017045 U KR 880017045U KR 2019870001952 U KR2019870001952 U KR 2019870001952U KR 870001952 U KR870001952 U KR 870001952U KR 880017045 U KR880017045 U KR 880017045U
Authority
KR
South Korea
Prior art keywords
electronic components
ceramic substrate
chip electronic
chip
ceramic
Prior art date
Application number
KR2019870001952U
Other languages
English (en)
Other versions
KR900004584Y1 (ko
Inventor
데루오 니시까와
마사시 나미오까
다까시 하다노
마사루 쓰다
Original Assignee
알프스 덴기 가부시기 가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 알프스 덴기 가부시기 가이샤 filed Critical 알프스 덴기 가부시기 가이샤
Priority to KR2019870001952U priority Critical patent/KR900004584Y1/ko
Publication of KR880017045U publication Critical patent/KR880017045U/ko
Application granted granted Critical
Publication of KR900004584Y1 publication Critical patent/KR900004584Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
KR2019870001952U 1987-02-20 1987-02-20 칩 전자부품의 세라믹 기판 KR900004584Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019870001952U KR900004584Y1 (ko) 1987-02-20 1987-02-20 칩 전자부품의 세라믹 기판

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019870001952U KR900004584Y1 (ko) 1987-02-20 1987-02-20 칩 전자부품의 세라믹 기판

Publications (2)

Publication Number Publication Date
KR880017045U true KR880017045U (ko) 1988-10-08
KR900004584Y1 KR900004584Y1 (ko) 1990-05-25

Family

ID=19259859

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019870001952U KR900004584Y1 (ko) 1987-02-20 1987-02-20 칩 전자부품의 세라믹 기판

Country Status (1)

Country Link
KR (1) KR900004584Y1 (ko)

Also Published As

Publication number Publication date
KR900004584Y1 (ko) 1990-05-25

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