DE69012019T2 - Aussenschichtmaterial von einer gedruckten mehrschichtleiterplatte und verfahren zu deren herstellung. - Google Patents

Aussenschichtmaterial von einer gedruckten mehrschichtleiterplatte und verfahren zu deren herstellung.

Info

Publication number
DE69012019T2
DE69012019T2 DE69012019T DE69012019T DE69012019T2 DE 69012019 T2 DE69012019 T2 DE 69012019T2 DE 69012019 T DE69012019 T DE 69012019T DE 69012019 T DE69012019 T DE 69012019T DE 69012019 T2 DE69012019 T2 DE 69012019T2
Authority
DE
Germany
Prior art keywords
production
outer layer
printed multi
layer material
layer board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69012019T
Other languages
English (en)
Other versions
DE69012019D1 (de
Inventor
Katsuhiko Fujikake
Hidetaka - - Miyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fanuc Corp
Original Assignee
Fanuc Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fanuc Corp filed Critical Fanuc Corp
Application granted granted Critical
Publication of DE69012019D1 publication Critical patent/DE69012019D1/de
Publication of DE69012019T2 publication Critical patent/DE69012019T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/20—Making multilayered or multicoloured articles
    • B29C43/203—Making multilayered articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C43/3642—Bags, bleeder sheets or cauls for isostatic pressing
    • B29C2043/3657—Bags, bleeder sheets or cauls for isostatic pressing additional materials, e.g. permeable bleeder or breather sheets, cloths, blankets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/08—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns
    • B29K2105/0872—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/25—Solid
    • B29K2105/253—Preform
    • B29K2105/256—Sheets, plates, blanks or films
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0152—Temporary metallic carrier, e.g. for transferring material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
DE69012019T 1989-02-23 1990-02-01 Aussenschichtmaterial von einer gedruckten mehrschichtleiterplatte und verfahren zu deren herstellung. Expired - Fee Related DE69012019T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1044222A JP2556897B2 (ja) 1989-02-23 1989-02-23 多層プリント配線板の外層材及び製造方法
PCT/JP1990/000132 WO1990010369A1 (en) 1989-02-23 1990-02-01 Outer layer material of multilayer printed wiring board and production thereof

Publications (2)

Publication Number Publication Date
DE69012019D1 DE69012019D1 (de) 1994-10-06
DE69012019T2 true DE69012019T2 (de) 1995-01-05

Family

ID=12685514

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69012019T Expired - Fee Related DE69012019T2 (de) 1989-02-23 1990-02-01 Aussenschichtmaterial von einer gedruckten mehrschichtleiterplatte und verfahren zu deren herstellung.

Country Status (5)

Country Link
US (1) US5482586A (de)
EP (1) EP0411142B1 (de)
JP (1) JP2556897B2 (de)
DE (1) DE69012019T2 (de)
WO (1) WO1990010369A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6129998A (en) * 1998-04-10 2000-10-10 R.E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6127051A (en) * 1998-04-10 2000-10-03 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
US6355360B1 (en) 1998-04-10 2002-03-12 R.E. Service Company, Inc. Separator sheet laminate for use in the manufacture of printed circuit boards
DE69918086T2 (de) * 1998-04-10 2005-07-07 R.E. Service Co., Inc., Lodi Trennfolien aus stahllegierung und kupfer/stahl-verbundfolien zur anwendung in der herstellung von leiterplatten
US6129990A (en) * 1998-04-10 2000-10-10 R. E. Service Company, Inc. Copper/steel laminated sheet for use in manufacturing printed circuit boards
AU2105300A (en) * 1999-01-14 2000-08-01 Hans-Jurgen Schafer Method and device for producing copper foil which is coated with polymers on both sides and which is laminated onto printed circuit boards
CA2330162A1 (en) * 2000-11-06 2002-05-06 Copper To Copper North America, Llc Hardened aluminum alloy for use in the manufacture of printed circuit boards
US20020124938A1 (en) * 2000-12-28 2002-09-12 Henrich Peter J. Apparatus and method for producing non- or lightly-embossed panels
US6673471B2 (en) 2001-02-23 2004-01-06 Nikko Materials Usa, Inc. Corrosion prevention for CAC component
US6783860B1 (en) 2001-05-11 2004-08-31 R. E. Service Company, Inc. Laminated entry and exit material for drilling printed circuit boards
DE10131887A1 (de) * 2001-07-04 2003-01-23 Dieter Backhaus Trennblech bzw. Verfahren zur Herstellung eines Trennbleches für ein Multilayerpreßpaket
CN1243460C (zh) * 2001-10-12 2006-02-22 松下电器产业株式会社 电路形成基板的制造方法
US7080445B2 (en) * 2001-10-31 2006-07-25 Denso Corporation Method for connecting printed circuit boards and connected printed circuit boards
US6955740B2 (en) 2002-01-10 2005-10-18 Polyclad Laminates, Inc. Production of laminates for printed wiring boards using protective carrier
TWI303959B (en) * 2003-01-17 2008-12-01 Matsushita Electric Ind Co Ltd Manufacturing method of substrate, release sheet, manufacturing method of substrate, and manufacturing method using the same
US20080187745A1 (en) * 2003-06-26 2008-08-07 Miles Justin Russell Component and method for manufacturing printed circuit boards
US20050064222A1 (en) * 2003-09-18 2005-03-24 Russell Miles Justin Component and method for manufacturing printed circuit boards
JP4761762B2 (ja) * 2004-12-03 2011-08-31 ソニーケミカル＆インフォメーションデバイス株式会社 多層配線基板の製造方法
CN103746064A (zh) * 2014-01-16 2014-04-23 浙江远大电子开发有限公司 一种提高光源光效的镜面铝基板及其制造方法
CN105163486A (zh) * 2015-10-07 2015-12-16 江西景旺精密电路有限公司 一种高层厚铜电路板及制作工艺
CN105586563A (zh) * 2015-12-10 2016-05-18 苏州市嘉明机械制造有限公司 一种基于等离子喷涂的防凹陷绝缘镜板的制造方法
CN108012468B (zh) * 2017-12-21 2019-08-02 四川九洲电器集团有限责任公司 一种氰酸酯树脂石英布多层印制板的层压及加工工艺

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4323632A (en) * 1978-10-17 1982-04-06 Gould Inc. Metal composites and laminates formed therefrom
JPS5678199A (en) * 1979-11-30 1981-06-26 Fujitsu Ltd Method of laminating multilayer printed board
US4431710A (en) * 1981-01-22 1984-02-14 General Electric Company Laminate product of ultra thin copper film on a flexible aluminum carrier
JPS5830195A (ja) * 1981-08-18 1983-02-22 東芝ケミカル株式会社 積層板の成形方法
US4568413A (en) * 1983-07-25 1986-02-04 James J. Toth Metallized and plated laminates
JPS60206088A (ja) * 1984-03-29 1985-10-17 日立化成工業株式会社 多層銅張積層板の製造法
JPS61277428A (ja) * 1985-06-03 1986-12-08 Ashida Seisakusho:Kk 積層板の成形方法
DE3541977A1 (de) * 1985-11-28 1986-05-22 Manfred 7341 Amstetten Roth Mehrschicht-laminat zum verpressen von gedruckten schaltungsteilen untereinander oder mit folien
JPS62232997A (ja) * 1986-03-28 1987-10-13 イソラ　ヴエルケ　アクテイ−ンゲゼルシヤフト ４つ以上の導電面を有するプリント回路の製造方法
JPS6390890A (ja) * 1986-10-03 1988-04-21 株式会社　潤工社 プリント基板
US4875283A (en) * 1986-11-13 1989-10-24 Johnston James A Method for manufacturing printed circuit boards

Also Published As

Publication number Publication date
US5482586A (en) 1996-01-09
JPH02222597A (ja) 1990-09-05
EP0411142B1 (de) 1994-08-31
EP0411142A1 (de) 1991-02-06
DE69012019D1 (de) 1994-10-06
JP2556897B2 (ja) 1996-11-27
EP0411142A4 (en) 1992-04-29
WO1990010369A1 (en) 1990-09-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee