DE68926420D1 - Halbleiter-Vergussmasse auf der Basis einer Epoxydharzzusammensetzung - Google Patents
Halbleiter-Vergussmasse auf der Basis einer EpoxydharzzusammensetzungInfo
- Publication number
- DE68926420D1 DE68926420D1 DE68926420T DE68926420T DE68926420D1 DE 68926420 D1 DE68926420 D1 DE 68926420D1 DE 68926420 T DE68926420 T DE 68926420T DE 68926420 T DE68926420 T DE 68926420T DE 68926420 D1 DE68926420 D1 DE 68926420D1
- Authority
- DE
- Germany
- Prior art keywords
- resin composition
- epoxy resin
- potting compound
- compound based
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63229012A JP2660012B2 (ja) | 1988-09-13 | 1988-09-13 | ゴム変性フェノール樹脂、エポキシ樹脂組成物及び樹脂封止型半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68926420D1 true DE68926420D1 (de) | 1996-06-13 |
DE68926420T2 DE68926420T2 (de) | 1996-10-31 |
Family
ID=16885374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68926420T Expired - Fee Related DE68926420T2 (de) | 1988-09-13 | 1989-09-13 | Halbleiter-Vergussmasse auf der Basis einer Epoxydharzzusammensetzung |
Country Status (5)
Country | Link |
---|---|
US (1) | US5068267A (de) |
EP (1) | EP0359558B1 (de) |
JP (1) | JP2660012B2 (de) |
KR (1) | KR930003800B1 (de) |
DE (1) | DE68926420T2 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0391183B1 (de) * | 1989-04-07 | 1994-06-29 | Asea Brown Boveri Ag | Elektrischer Isolator |
JPH0762063B2 (ja) * | 1990-05-11 | 1995-07-05 | 信越化学工業株式会社 | エポキシ樹脂組成物 |
JP2522588B2 (ja) * | 1990-06-23 | 1996-08-07 | 株式会社日立製作所 | リニアモ―タカ―の地上コイル用エポキシ樹脂組成物および該組成物でモ―ルドした地上コイル |
CA2066497A1 (en) * | 1991-05-01 | 1992-11-02 | Michael K. Gallagher | Epoxy molding composition for surface mount applications |
US5346743A (en) * | 1992-03-13 | 1994-09-13 | Kabushiki Kaisha Toshiba | Resin encapsulation type semiconductor device |
JPH07109337A (ja) * | 1993-08-20 | 1995-04-25 | Toshiba Corp | エポキシ樹脂注型材料 |
US6439698B1 (en) | 2000-01-14 | 2002-08-27 | Lexmark International, Inc | Dual curable encapsulating material |
US6425655B1 (en) | 2001-06-05 | 2002-07-30 | Lexmark International, Inc. | Dual curable encapsulating material |
WO2005022496A2 (en) | 2003-08-29 | 2005-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
JP5504550B2 (ja) * | 2006-01-23 | 2014-05-28 | 日立化成株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
WO2008009560A1 (en) * | 2006-07-20 | 2008-01-24 | Abb Research Ltd | Hardenable epoxy resin composition |
CN109743882B (zh) * | 2016-09-21 | 2022-12-30 | 三菱电机株式会社 | 半导体装置以及电力变换装置 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5454168A (en) * | 1977-10-07 | 1979-04-28 | Hitachi Ltd | Epoxy resin composition |
JPS54160453A (en) * | 1978-06-09 | 1979-12-19 | Sanko Kaihatsu Kagaku Kenkiyuu | Internal plastisizer for phenol resin |
JPS57184242A (en) * | 1981-05-08 | 1982-11-12 | Matsushita Electric Works Ltd | Molding material for sealing electronic part |
JPS5834824A (ja) * | 1981-08-26 | 1983-03-01 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及びその製造方法 |
JPS58210920A (ja) * | 1982-05-31 | 1983-12-08 | Shin Etsu Chem Co Ltd | 熱硬化性エポキシ樹脂組成物 |
US4529755A (en) * | 1982-10-23 | 1985-07-16 | Denki Kagaku Kogyo Kabushiki Kaisha | Epoxy resin composition for encapsulating semiconductor |
US4902273A (en) * | 1984-02-21 | 1990-02-20 | Choy Daniel S J | Heart assist device |
JPS61208856A (ja) * | 1985-03-14 | 1986-09-17 | Nitto Electric Ind Co Ltd | 半導体装置 |
US4720515A (en) * | 1985-05-17 | 1988-01-19 | Denki Kagaku Kogyo Kabushiki Kaisha | Epoxy resin composition for encapsulating semiconductor |
JPS6222825A (ja) * | 1985-07-23 | 1987-01-31 | Toshiba Chem Corp | 封止用樹脂組成物 |
JPS62270617A (ja) * | 1986-05-20 | 1987-11-25 | Mitsui Toatsu Chem Inc | 半導体封止用樹脂組成物 |
JPH0725867B2 (ja) * | 1986-07-15 | 1995-03-22 | 株式会社東芝 | 樹脂封止型半導体装置 |
JPS63179924A (ja) * | 1987-01-21 | 1988-07-23 | Toshiba Corp | 半導体封止用エポキシ樹脂組成物 |
JPS63186724A (ja) * | 1987-01-28 | 1988-08-02 | Toshiba Corp | エポキシ樹脂組成物およびそれを用いた樹脂封止型半導体装置 |
JPH0791446B2 (ja) * | 1987-03-31 | 1995-10-04 | 株式会社東芝 | 樹脂封止半導体装置 |
JP2877309B2 (ja) * | 1988-01-06 | 1999-03-31 | 株式会社東芝 | ゴム変性フェノール樹脂の製造方法 |
JPH01236226A (ja) * | 1988-03-17 | 1989-09-21 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JPH0319856A (ja) * | 1989-06-15 | 1991-01-29 | Nec Corp | 熱転写印字装置 |
-
1988
- 1988-09-13 JP JP63229012A patent/JP2660012B2/ja not_active Expired - Fee Related
-
1989
- 1989-09-12 US US07/405,533 patent/US5068267A/en not_active Expired - Lifetime
- 1989-09-12 KR KR1019890013178A patent/KR930003800B1/ko not_active IP Right Cessation
- 1989-09-13 DE DE68926420T patent/DE68926420T2/de not_active Expired - Fee Related
- 1989-09-13 EP EP89309315A patent/EP0359558B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0359558B1 (de) | 1996-05-08 |
DE68926420T2 (de) | 1996-10-31 |
JPH0284458A (ja) | 1990-03-26 |
EP0359558A2 (de) | 1990-03-21 |
EP0359558A3 (de) | 1991-11-06 |
KR900004844A (ko) | 1990-04-13 |
US5068267A (en) | 1991-11-26 |
JP2660012B2 (ja) | 1997-10-08 |
KR930003800B1 (ko) | 1993-05-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8320 | Willingness to grant licences declared (paragraph 23) | ||
8339 | Ceased/non-payment of the annual fee |