DE68920080D1 - Polyimide und Polyimidfilme und Herstellungsverfahren. - Google Patents

Polyimide und Polyimidfilme und Herstellungsverfahren.

Info

Publication number
DE68920080D1
DE68920080D1 DE68920080T DE68920080T DE68920080D1 DE 68920080 D1 DE68920080 D1 DE 68920080D1 DE 68920080 T DE68920080 T DE 68920080T DE 68920080 T DE68920080 T DE 68920080T DE 68920080 D1 DE68920080 D1 DE 68920080D1
Authority
DE
Germany
Prior art keywords
polyimides
manufacturing processes
polyimide films
polyimide
films
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68920080T
Other languages
English (en)
Other versions
DE68920080T2 (de
Inventor
Haruhiko Maki
Hirosaku Nagano
Yoshiaki Inaba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Publication of DE68920080D1 publication Critical patent/DE68920080D1/de
Application granted granted Critical
Publication of DE68920080T2 publication Critical patent/DE68920080T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
DE68920080T 1988-07-15 1989-07-14 Polyimide und Polyimidfilme und Herstellungsverfahren. Expired - Fee Related DE68920080T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63177526A JP2673547B2 (ja) 1988-07-15 1988-07-15 改良されたポリイミドフィルム及び該製造方法

Publications (2)

Publication Number Publication Date
DE68920080D1 true DE68920080D1 (de) 1995-02-02
DE68920080T2 DE68920080T2 (de) 1995-05-04

Family

ID=16032464

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68920080T Expired - Fee Related DE68920080T2 (de) 1988-07-15 1989-07-14 Polyimide und Polyimidfilme und Herstellungsverfahren.

Country Status (5)

Country Link
US (1) US5665802A (de)
EP (1) EP0350958B1 (de)
JP (1) JP2673547B2 (de)
CA (1) CA1340176C (de)
DE (1) DE68920080T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109720016A (zh) * 2017-05-24 2019-05-07 中国建筑材料科学研究总院有限公司 发动机用抗振动隔热层及其制备方法

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SG55276A1 (en) * 1996-02-13 1998-12-21 Nitto Denko Corp Circuit substrate circuit-formed suspension substrate and production method thereof
US5969087A (en) * 1997-04-04 1999-10-19 Nitto Denko Corporation Polyimide, a method for manufacturing the same, a gas separation membrane using the polyimide and a method for manufacturing the same
JPH1187867A (ja) 1997-09-01 1999-03-30 Nitto Denko Corp 回路基板、回路付きサスペンション基板及びそれらの製造方法
JP2000187403A (ja) * 1998-12-21 2000-07-04 Nitto Denko Corp 半導電性ベルト
US20060019102A1 (en) * 2004-07-26 2006-01-26 Kuppsuamy Kanakarajan Flame-retardant halogen-free polyimide films useful as thermal insulation in aircraft applications and methods relating thereto
WO2009008499A1 (ja) * 2007-07-11 2009-01-15 Ube Industries, Ltd. ポリイミド発泡体の製造方法及びポリイミド発泡体
US8221089B2 (en) * 2008-09-12 2012-07-17 Rockwell Collins, Inc. Thin, solid-state mechanism for pumping electrically conductive liquids in a flexible thermal spreader
US8616266B2 (en) 2008-09-12 2013-12-31 Rockwell Collins, Inc. Mechanically compliant thermal spreader with an embedded cooling loop for containing and circulating electrically-conductive liquid
US8650886B2 (en) 2008-09-12 2014-02-18 Rockwell Collins, Inc. Thermal spreader assembly with flexible liquid cooling loop having rigid tubing sections and flexible tubing sections
KR20110119836A (ko) * 2009-02-27 2011-11-02 이 아이 듀폰 디 네모아 앤드 캄파니 고온 마모 용도를 위한 폴리이미드 수지
US8414815B2 (en) 2010-08-25 2013-04-09 Xerox Corporation Seamless fuser member process
US8886106B2 (en) * 2011-03-02 2014-11-11 Konica Minolta Business Technologies, Inc. Intermediate transfer belt and method for producing the same
WO2012173204A1 (ja) 2011-06-14 2012-12-20 宇部興産株式会社 ポリイミド積層体の製造方法、およびポリイミド積層体
WO2012173202A1 (ja) 2011-06-14 2012-12-20 宇部興産株式会社 ポリイミド積層体の製造方法、およびポリイミド積層体
JP6152688B2 (ja) * 2013-04-22 2017-06-28 宇部興産株式会社 ポリアミック酸溶液組成物、及びそれを用いたポリイミド膜の製造方法
KR20140139367A (ko) * 2013-05-27 2014-12-05 삼성전자주식회사 광학 필름의 제조 방법, 및 상기 제조 방법에 의해 제조되는 광학 필름
KR102115561B1 (ko) 2013-09-16 2020-05-27 삼성디스플레이 주식회사 폴리이미드 기판의 제조 방법 및 이를 이용하는 표시장치의 제조 방법
KR102276288B1 (ko) 2013-11-25 2021-07-12 삼성전자주식회사 폴리이미드 제조용 조성물, 폴리이미드, 상기 폴리이미드를 포함하는 성형품, 및 상기 성형품을 포함하는 디스플레이 장치
KR102188483B1 (ko) * 2013-11-27 2020-12-08 우베 고산 가부시키가이샤 폴리이미드 전구체 조성물, 폴리이미드의 제조 방법, 폴리이미드, 폴리이미드 필름, 및 기판
KR102180089B1 (ko) * 2013-12-30 2020-11-18 삼성디스플레이 주식회사 플렉서블 기판의 제조 방법 및 이를 이용하는 표시장치의 제조 방법
KR102167315B1 (ko) 2014-04-30 2020-10-20 삼성디스플레이 주식회사 유기전계발광 표시장치
US9975997B2 (en) 2015-03-27 2018-05-22 Samsung Electronics Co., Ltd. Compositions, composites prepared therefrom, and films and electronic devices including the same
KR102442188B1 (ko) 2015-06-19 2022-09-13 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR102415326B1 (ko) 2015-10-29 2022-06-30 삼성디스플레이 주식회사 플렉서블 표시 장치 및 플렉서블 표시 장치의 제조 방법
KR102317327B1 (ko) * 2019-08-29 2021-10-27 피아이첨단소재 주식회사 폴리이미드 필름 및 그 제조방법

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DE1902875C3 (de) * 1968-01-23 1974-01-31 Toray Industries, Inc., Tokio Verfahren zur Herstellung von Imidreste enthaltenden Polykondensaten
US3565847A (en) * 1968-06-05 1971-02-23 American Cyanamid Co Composition of matter comprising a thermoplastic polyimide of 3,4-dicarboxy-1,2,3,4 - tetrahydro - 1 - naphthalene succinic dianhydride and a piprimary diamine containing certain quantities of triaryl phosphates
US3551200A (en) * 1968-09-18 1970-12-29 Raychem Corp Electrical component insulated by poly(1,12 dodecamethylene pyromellitimide) or poly(1,13 tridecamethylene pyromellitimide)
US3607387A (en) * 1968-09-18 1971-09-21 Raychem Corp Flame resistant polyimide-coated conductor having a linear polyimide layer covered by an aromatic polyamide
US3714116A (en) * 1970-04-08 1973-01-30 Raychem Corp Polyimide compositions
JPS4719615U (de) * 1971-01-18 1972-11-06
US3691136A (en) * 1971-03-29 1972-09-12 Standard Oil Co Use of phosphorus compounds as stripping agents for polyamide-imide films
JPS4822990U (de) * 1971-07-22 1973-03-15
BE792330A (fr) * 1971-12-07 1973-06-06 Westinghouse Electric Corp Procede pour empecher des resines d'adherer a un
JPS5739926A (en) * 1980-08-25 1982-03-05 Nippon Carbide Ind Co Ltd Polyimide film and its manufacture
JPS58145419A (ja) * 1982-02-23 1983-08-30 Toray Ind Inc 芳香族ポリイミドフイルムの製造方法
JPS58180532A (ja) * 1982-04-16 1983-10-22 Sumitomo Chem Co Ltd 芳香族ポリアミドイミドの製造方法
US4508861A (en) * 1983-12-29 1985-04-02 General Electric Company Thermally stabilized polyetherimides
JPS60244507A (ja) * 1984-05-18 1985-12-04 Ube Ind Ltd 芳香族ポリイミドフイルムの製造法
JPH0665708B2 (ja) * 1985-11-29 1994-08-24 鐘淵化学工業株式会社 新規ポリイミドフィルム及びその製造法
JPS63199264A (ja) * 1987-02-13 1988-08-17 Sumitomo Bakelite Co Ltd 耐熱性樹脂の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109720016A (zh) * 2017-05-24 2019-05-07 中国建筑材料科学研究总院有限公司 发动机用抗振动隔热层及其制备方法
CN109720016B (zh) * 2017-05-24 2020-10-13 中国建筑材料科学研究总院有限公司 发动机用抗振动隔热层及其制备方法

Also Published As

Publication number Publication date
JP2673547B2 (ja) 1997-11-05
EP0350958A3 (en) 1990-11-14
US5665802A (en) 1997-09-09
JPH0228257A (ja) 1990-01-30
EP0350958B1 (de) 1994-12-21
CA1340176C (en) 1998-12-08
EP0350958A2 (de) 1990-01-17
DE68920080T2 (de) 1995-05-04

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee