DE68914939D1 - Verfahren zum Untereinanderverbinden von elektrischen Dünnschichtkreisen. - Google Patents
Verfahren zum Untereinanderverbinden von elektrischen Dünnschichtkreisen.Info
- Publication number
- DE68914939D1 DE68914939D1 DE68914939T DE68914939T DE68914939D1 DE 68914939 D1 DE68914939 D1 DE 68914939D1 DE 68914939 T DE68914939 T DE 68914939T DE 68914939 T DE68914939 T DE 68914939T DE 68914939 D1 DE68914939 D1 DE 68914939D1
- Authority
- DE
- Germany
- Prior art keywords
- electrical circuits
- film electrical
- interconnecting thin
- interconnecting
- thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/707—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/467—Adding a circuit layer by thin film methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1333—Deposition techniques, e.g. coating
- H05K2203/1338—Chemical vapour deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/173—Adding connections between adjacent pads or conductors, e.g. for modifying or repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/263,103 US4880959A (en) | 1988-10-26 | 1988-10-26 | Process for interconnecting thin-film electrical circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68914939D1 true DE68914939D1 (de) | 1994-06-01 |
DE68914939T2 DE68914939T2 (de) | 1994-11-10 |
Family
ID=23000376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE68914939T Expired - Fee Related DE68914939T2 (de) | 1988-10-26 | 1989-09-21 | Verfahren zum Untereinanderverbinden von elektrischen Dünnschichtkreisen. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4880959A (de) |
EP (1) | EP0366259B1 (de) |
JP (1) | JPH07112106B2 (de) |
DE (1) | DE68914939T2 (de) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5079070A (en) * | 1990-10-11 | 1992-01-07 | International Business Machines Corporation | Repair of open defects in thin film conductors |
US5153408A (en) * | 1990-10-31 | 1992-10-06 | International Business Machines Corporation | Method and structure for repairing electrical lines |
US5243140A (en) * | 1991-10-04 | 1993-09-07 | International Business Machines Corporation | Direct distribution repair and engineering change system |
US5221426A (en) * | 1991-11-29 | 1993-06-22 | Motorola Inc. | Laser etch-back process for forming a metal feature on a non-metal substrate |
US5246745A (en) * | 1991-12-23 | 1993-09-21 | International Business Machines Corporation | Laser-induced chemical vapor deposition of thin-film conductors |
JPH0799791B2 (ja) * | 1992-04-15 | 1995-10-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 透明基板上の回路ライン接続方法 |
JP2718893B2 (ja) * | 1993-06-04 | 1998-02-25 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 移相マスクの移相欠陥を修復する方法 |
US5384953A (en) * | 1993-07-21 | 1995-01-31 | International Business Machines Corporation | Structure and a method for repairing electrical lines |
US5446961A (en) * | 1993-10-15 | 1995-09-05 | International Business Machines Corporation | Method for repairing semiconductor substrates |
US5643476A (en) * | 1994-09-21 | 1997-07-01 | University Of Southern California | Laser system for removal of graffiti |
JP3417751B2 (ja) * | 1995-02-13 | 2003-06-16 | 株式会社東芝 | 半導体装置の製造方法 |
US6211080B1 (en) | 1996-10-30 | 2001-04-03 | Matsushita Electric Industrial Co., Ltd. | Repair of dielectric-coated electrode or circuit defects |
US6159832A (en) * | 1998-03-18 | 2000-12-12 | Mayer; Frederick J. | Precision laser metallization |
WO2002074027A1 (en) * | 2001-03-12 | 2002-09-19 | Agency For Science, Technology And Research | Improved laser metallisation circuit formation and circuits formed thereby |
US7800014B2 (en) | 2004-01-09 | 2010-09-21 | General Lasertronics Corporation | Color sensing for laser decoating |
US7633033B2 (en) * | 2004-01-09 | 2009-12-15 | General Lasertronics Corporation | Color sensing for laser decoating |
TWI431380B (zh) * | 2006-05-12 | 2014-03-21 | Photon Dynamics Inc | 沉積修復設備及方法 |
US8536483B2 (en) | 2007-03-22 | 2013-09-17 | General Lasertronics Corporation | Methods for stripping and modifying surfaces with laser-induced ablation |
US20090008827A1 (en) * | 2007-07-05 | 2009-01-08 | General Lasertronics Corporation, A Corporation Of The State Of California | Aperture adapters for laser-based coating removal end-effector |
US8728589B2 (en) * | 2007-09-14 | 2014-05-20 | Photon Dynamics, Inc. | Laser decal transfer of electronic materials |
US10112257B1 (en) | 2010-07-09 | 2018-10-30 | General Lasertronics Corporation | Coating ablating apparatus with coating removal detection |
US9895771B2 (en) | 2012-02-28 | 2018-02-20 | General Lasertronics Corporation | Laser ablation for the environmentally beneficial removal of surface coatings |
JP6665386B2 (ja) * | 2013-12-15 | 2020-03-13 | オーボテック リミテッド | プリント回路配線の修復 |
US10086597B2 (en) | 2014-01-21 | 2018-10-02 | General Lasertronics Corporation | Laser film debonding method |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2704728A (en) * | 1951-10-08 | 1955-03-22 | Ohio Commw Eng Co | Gas plating metal objects with copper acetylacetonate |
US3229361A (en) * | 1964-08-07 | 1966-01-18 | Valacich Walter Barry | Metal repairing |
JPS5221229A (en) * | 1975-08-13 | 1977-02-17 | Kogyo Gijutsuin | Partial plating method by gaseous phase plating method |
JPS5235596A (en) * | 1975-09-12 | 1977-03-18 | Hitachi Ltd | Burglar watch system |
US4044222A (en) * | 1976-01-16 | 1977-08-23 | Western Electric Company, Inc. | Method of forming tapered apertures in thin films with an energy beam |
US4272775A (en) * | 1978-07-03 | 1981-06-09 | National Semiconductor Corporation | Laser trim protection process and structure |
US4259367A (en) * | 1979-07-30 | 1981-03-31 | International Business Machines Corporation | Fine line repair technique |
US4381441A (en) * | 1980-10-30 | 1983-04-26 | Western Electric Company, Inc. | Methods of and apparatus for trimming film resistors |
US4439754A (en) * | 1981-04-03 | 1984-03-27 | Electro-Films, Inc. | Apertured electronic circuit package |
US4358659A (en) * | 1981-07-13 | 1982-11-09 | Mostek Corporation | Method and apparatus for focusing a laser beam on an integrated circuit |
US4374314A (en) * | 1981-08-17 | 1983-02-15 | Analog Devices, Inc. | Laser template trimming of circuit elements |
JPS58170037A (ja) * | 1982-03-31 | 1983-10-06 | Toshiba Corp | 配線の切断方法及び切断装置 |
EP0130398B1 (de) * | 1983-06-29 | 1991-01-23 | Siemens Aktiengesellschaft | Verfahren zur Herstellung einer elektrisch leitfähigen Verbindung und Vorrichtung zur Durchführung eines solchen Verfahrens |
EP0233755B1 (de) * | 1986-02-14 | 1991-02-06 | Amoco Corporation | Behandlung von geformten Oberflächen mit Ultraviolettlaser |
JP2590856B2 (ja) * | 1987-01-27 | 1997-03-12 | 三菱電機株式会社 | 回路基板およびその修復方法 |
US5182230A (en) * | 1988-07-25 | 1993-01-26 | International Business Machines Corporation | Laser methods for circuit repair on integrated circuits and substrates |
-
1988
- 1988-10-26 US US07/263,103 patent/US4880959A/en not_active Expired - Lifetime
-
1989
- 1989-09-21 EP EP89309601A patent/EP0366259B1/de not_active Expired - Lifetime
- 1989-09-21 DE DE68914939T patent/DE68914939T2/de not_active Expired - Fee Related
- 1989-10-13 JP JP1265311A patent/JPH07112106B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH02183592A (ja) | 1990-07-18 |
JPH07112106B2 (ja) | 1995-11-29 |
US4880959A (en) | 1989-11-14 |
EP0366259A2 (de) | 1990-05-02 |
DE68914939T2 (de) | 1994-11-10 |
EP0366259B1 (de) | 1994-04-27 |
EP0366259A3 (en) | 1990-11-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |