DE68909395T2 - Verfahren zur Ablagerung eines dünnen Oxydfilms. - Google Patents

Verfahren zur Ablagerung eines dünnen Oxydfilms.

Info

Publication number
DE68909395T2
DE68909395T2 DE89313578T DE68909395T DE68909395T2 DE 68909395 T2 DE68909395 T2 DE 68909395T2 DE 89313578 T DE89313578 T DE 89313578T DE 68909395 T DE68909395 T DE 68909395T DE 68909395 T2 DE68909395 T2 DE 68909395T2
Authority
DE
Germany
Prior art keywords
deposition
oxide film
thin oxide
thin
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE89313578T
Other languages
English (en)
Other versions
DE68909395D1 (de
Inventor
Kazuhiro Eguchi
Takatosi Nakanisi
Rie Satoh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP1031329A external-priority patent/JPH02210718A/ja
Priority claimed from JP3132889A external-priority patent/JPH02210822A/ja
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of DE68909395D1 publication Critical patent/DE68909395D1/de
Application granted granted Critical
Publication of DE68909395T2 publication Critical patent/DE68909395T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523—Pulsed gas flow or change of composition over time
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40—Oxides
    • C23C16/408—Oxides of copper or solid solutions thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45561—Gas plumbing upstream of the reaction chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N60/00—Superconducting devices
    • H10N60/01—Manufacture or treatment
    • H10N60/0268—Manufacture or treatment of devices comprising copper oxide
    • H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
    • H10N60/0436—Processes for depositing or forming copper oxide superconductor layers by chemical vapour deposition [CVD]
    • H10N60/0464—Processes for depositing or forming copper oxide superconductor layers by chemical vapour deposition [CVD] by metalloorganic chemical vapour deposition [MOCVD]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/725—Process of making or treating high tc, above 30 k, superconducting shaped material, article, or device
    • Y10S505/73—Vacuum treating or coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S505/00—Superconductor technology: apparatus, material, process
    • Y10S505/725—Process of making or treating high tc, above 30 k, superconducting shaped material, article, or device
    • Y10S505/734—From organometallic precursors, e.g. acetylacetonates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Vapour Deposition (AREA)
DE89313578T 1989-02-10 1989-12-22 Verfahren zur Ablagerung eines dünnen Oxydfilms. Expired - Fee Related DE68909395T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1031329A JPH02210718A (ja) 1989-02-10 1989-02-10 酸化物超伝導体の気相成長方法
JP3132889A JPH02210822A (ja) 1989-02-10 1989-02-10 気相成長装置

Publications (2)

Publication Number Publication Date
DE68909395D1 DE68909395D1 (de) 1993-10-28
DE68909395T2 true DE68909395T2 (de) 1994-02-17

Family

ID=26369777

Family Applications (1)

Application Number Title Priority Date Filing Date
DE89313578T Expired - Fee Related DE68909395T2 (de) 1989-02-10 1989-12-22 Verfahren zur Ablagerung eines dünnen Oxydfilms.

Country Status (3)

Country Link
US (1) US5164363A (de)
EP (1) EP0387456B1 (de)
DE (1) DE68909395T2 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3124376B2 (ja) * 1992-06-17 2001-01-15 株式会社東芝 化合物半導体の気相成長装置
US5458086A (en) * 1993-10-13 1995-10-17 Superconductor Technologies, Inc. Apparatus for growing metal oxides using organometallic vapor phase epitaxy
JP3152859B2 (ja) * 1994-09-16 2001-04-03 株式会社東芝 半導体装置の製造方法
US6071572A (en) * 1996-10-15 2000-06-06 Applied Materials, Inc. Forming tin thin films using remote activated specie generation
NL1004867C2 (nl) * 1996-12-20 1998-06-23 Tno Met vezels versterkt bio-keramisch composietmateriaal.
US6248392B1 (en) 1996-12-20 2001-06-19 Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Ondersoek Tno Method for manufacturing a fiber-reinforced bioactive ceramic implant
DE19730119A1 (de) * 1997-07-14 1999-01-21 Siemens Ag Verfahren zur Herstellung von Dünnfilmen aus oxidischer Keramik
US6943392B2 (en) * 1999-08-30 2005-09-13 Micron Technology, Inc. Capacitors having a capacitor dielectric layer comprising a metal oxide having multiple different metals bonded with oxygen
US6558517B2 (en) * 2000-05-26 2003-05-06 Micron Technology, Inc. Physical vapor deposition methods
US6838122B2 (en) * 2001-07-13 2005-01-04 Micron Technology, Inc. Chemical vapor deposition methods of forming barium strontium titanate comprising dielectric layers
US20030017266A1 (en) * 2001-07-13 2003-01-23 Cem Basceri Chemical vapor deposition methods of forming barium strontium titanate comprising dielectric layers, including such layers having a varied concentration of barium and strontium within the layer
US7011978B2 (en) 2001-08-17 2006-03-14 Micron Technology, Inc. Methods of forming capacitor constructions comprising perovskite-type dielectric materials with different amount of crystallinity regions
TWI236505B (en) * 2002-01-14 2005-07-21 Nat Science Council Thermal cracking chemical vapor deposition process for nanocarbonaceous material
JP4690246B2 (ja) * 2006-05-19 2011-06-01 住友電気工業株式会社 超電導薄膜材料およびその製造方法
US7879401B2 (en) * 2006-12-22 2011-02-01 The Regents Of The University Of Michigan Organic vapor jet deposition using an exhaust
US8741158B2 (en) 2010-10-08 2014-06-03 Ut-Battelle, Llc Superhydrophobic transparent glass (STG) thin film articles
US20110034338A1 (en) * 2009-08-04 2011-02-10 Amit Goyal CRITICAL CURRENT DENSITY ENHANCEMENT VIA INCORPORATION OF NANOSCALE Ba2(Y,RE)TaO6 IN REBCO FILMS
WO2011017439A1 (en) * 2009-08-04 2011-02-10 Ut-Battelle, Llc Critical current density enhancement via incorporation of nanoscale ba2renbo6 in rebco films
US8685549B2 (en) 2010-08-04 2014-04-01 Ut-Battelle, Llc Nanocomposites for ultra high density information storage, devices including the same, and methods of making the same
US11292919B2 (en) 2010-10-08 2022-04-05 Ut-Battelle, Llc Anti-fingerprint coatings
US9221076B2 (en) 2010-11-02 2015-12-29 Ut-Battelle, Llc Composition for forming an optically transparent, superhydrophobic coating
US8748350B2 (en) 2011-04-15 2014-06-10 Ut-Battelle Chemical solution seed layer for rabits tapes
US8748349B2 (en) 2011-04-15 2014-06-10 Ut-Battelle, Llc Buffer layers for REBCO films for use in superconducting devices
US20150239773A1 (en) 2014-02-21 2015-08-27 Ut-Battelle, Llc Transparent omniphobic thin film articles
FR3018825B1 (fr) * 2014-03-21 2017-09-01 Altatech Semiconductor Procede de depot en phase gazeuse

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2162862B (en) * 1984-07-26 1988-10-19 Japan Res Dev Corp A method of growing a thin film single crystalline semiconductor
JPH0651909B2 (ja) * 1985-12-28 1994-07-06 キヤノン株式会社 薄膜多層構造の形成方法
US4761269A (en) * 1986-06-12 1988-08-02 Crystal Specialties, Inc. Apparatus for depositing material on a substrate
JPS63292524A (ja) * 1987-05-25 1988-11-29 Matsushita Electric Ind Co Ltd 超電導薄膜の製造方法
JPS63307275A (ja) * 1987-06-05 1988-12-14 Kawasaki Steel Corp 高温超伝導体薄膜作製用のｍｏｃｖｄ装置
KR910007382B1 (ko) * 1987-08-07 1991-09-25 가부시기가이샤 히다찌세이사꾸쇼 초전도 재료 및 초전도 박막의 제조방법

Also Published As

Publication number Publication date
EP0387456A2 (de) 1990-09-19
US5164363A (en) 1992-11-17
EP0387456B1 (de) 1993-09-22
EP0387456A3 (en) 1990-11-28
DE68909395D1 (de) 1993-10-28

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee