DE68907209D1 - Verfahren zur herstellung eines supraleitfaehigen duennfilmes. - Google Patents
Verfahren zur herstellung eines supraleitfaehigen duennfilmes.Info
- Publication number
- DE68907209D1 DE68907209D1 DE8989910178T DE68907209T DE68907209D1 DE 68907209 D1 DE68907209 D1 DE 68907209D1 DE 8989910178 T DE8989910178 T DE 8989910178T DE 68907209 T DE68907209 T DE 68907209T DE 68907209 D1 DE68907209 D1 DE 68907209D1
- Authority
- DE
- Germany
- Prior art keywords
- supral
- producing
- thin film
- conductive thin
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
- C23C16/0281—Deposition of sub-layers, e.g. to promote the adhesion of the main coating of metallic sub-layers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/408—Oxides of copper or solid solutions thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
- H10N60/0436—Processes for depositing or forming copper oxide superconductor layers by chemical vapour deposition [CVD]
- H10N60/0464—Processes for depositing or forming copper oxide superconductor layers by chemical vapour deposition [CVD] by metalloorganic chemical vapour deposition [MOCVD]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/725—Process of making or treating high tc, above 30 k, superconducting shaped material, article, or device
- Y10S505/734—From organometallic precursors, e.g. acetylacetonates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Inorganic Compounds Of Heavy Metals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP24269688 | 1988-09-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE68907209D1 true DE68907209D1 (de) | 1993-07-22 |
DE68907209T2 DE68907209T2 (de) | 1994-02-03 |
Family
ID=17092883
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE89910178T Expired - Fee Related DE68907209T2 (de) | 1988-09-28 | 1989-09-14 | Verfahren zur herstellung eines supraleitfähigen dünnfilmes. |
Country Status (4)
Country | Link |
---|---|
US (1) | US5116811A (de) |
EP (1) | EP0408753B1 (de) |
DE (1) | DE68907209T2 (de) |
WO (1) | WO1990003453A1 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5260267A (en) * | 1989-07-24 | 1993-11-09 | Sumitomo Electric Industries, Ltd. | Method for forming a Bi-containing superconducting oxide film on a substrate with a buffer layer of Bi2 O3 |
JPH04295089A (ja) * | 1991-03-26 | 1992-10-20 | Kokusai Chodendo Sangyo Gijutsu Kenkyu Center | 酸化物超電導膜製造装置 |
JP3144104B2 (ja) * | 1992-11-17 | 2001-03-12 | 住友電気工業株式会社 | 高品質な酸化物超電導薄膜の作製方法 |
KR970006723B1 (ko) * | 1993-09-07 | 1997-04-29 | 한국과학기술원 | 입자 크기가 큰 다결정 규소 박막의 제조방법 |
JP2907111B2 (ja) * | 1996-04-22 | 1999-06-21 | 日本電気株式会社 | 気相成長方法及びその装置 |
US6986705B2 (en) * | 2004-04-05 | 2006-01-17 | Rimpad Tech Ltd. | Polishing pad and method of making same |
US7615385B2 (en) | 2006-09-20 | 2009-11-10 | Hypres, Inc | Double-masking technique for increasing fabrication yield in superconducting electronics |
CN104513970B (zh) * | 2014-12-25 | 2017-02-22 | 贵州大学 | 一种制备硼化镁超导薄膜的方法 |
US11495724B2 (en) | 2020-07-21 | 2022-11-08 | International Business Machines Corporation | Superconducting structure and device surface termination with alloy |
CN115233302A (zh) * | 2022-06-14 | 2022-10-25 | 沈阳大学 | 一种半金属Bi超薄薄膜表面具有透明导电性和疏水性的制备方法 |
CN115787094A (zh) * | 2022-08-10 | 2023-03-14 | 哈尔滨工业大学 | 一种辅助生长硒氧化铋薄膜的方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59139688A (ja) * | 1983-01-31 | 1984-08-10 | Nippon Telegr & Teleph Corp <Ntt> | 酸化物薄膜の熱処理方法 |
JPS6424319A (en) * | 1987-07-21 | 1989-01-26 | Oki Electric Ind Co Ltd | Formation of superconductor thin film |
JPH01208327A (ja) * | 1988-02-15 | 1989-08-22 | Matsushita Electric Ind Co Ltd | 薄膜超電導体の製造方法 |
-
1989
- 1989-09-14 WO PCT/JP1989/000939 patent/WO1990003453A1/ja active IP Right Grant
- 1989-09-14 DE DE89910178T patent/DE68907209T2/de not_active Expired - Fee Related
- 1989-09-14 US US07/474,099 patent/US5116811A/en not_active Expired - Lifetime
- 1989-09-14 EP EP89910178A patent/EP0408753B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US5116811A (en) | 1992-05-26 |
EP0408753A1 (de) | 1991-01-23 |
EP0408753A4 (en) | 1991-08-28 |
EP0408753B1 (de) | 1993-06-16 |
WO1990003453A1 (en) | 1990-04-05 |
DE68907209T2 (de) | 1994-02-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |