DE60330843D1 - Lichtempfindliche zusammensetzung, lichtempfindliche flachdruckplatte und verfahren zur herstellung einer flachdruckplatte damit - Google Patents

Lichtempfindliche zusammensetzung, lichtempfindliche flachdruckplatte und verfahren zur herstellung einer flachdruckplatte damit

Info

Publication number
DE60330843D1
DE60330843D1 DE60330843T DE60330843T DE60330843D1 DE 60330843 D1 DE60330843 D1 DE 60330843D1 DE 60330843 T DE60330843 T DE 60330843T DE 60330843 T DE60330843 T DE 60330843T DE 60330843 D1 DE60330843 D1 DE 60330843D1
Authority
DE
Germany
Prior art keywords
light
pressure plate
flat pressure
sensitive
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60330843T
Other languages
German (de)
English (en)
Inventor
Yasuhiro Ishizuka
Yasuhiko Kojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kodak Graphic Communications Japan Ltd
Original Assignee
Kodak Graphic Communications Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kodak Graphic Communications Japan Ltd filed Critical Kodak Graphic Communications Japan Ltd
Application granted granted Critical
Publication of DE60330843D1 publication Critical patent/DE60330843D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08L61/14—Modified phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18 and C08L61/20
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/016—Diazonium salts or compounds
    • G03F7/021—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders
    • G03F7/0212—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders characterised by the polymeric binder or the macromolecular additives other than the diazo resins or the polymeric diazonium compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/016—Diazonium salts or compounds
    • G03F7/021—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders
    • G03F7/0212—Macromolecular diazonium compounds; Macromolecular additives, e.g. binders characterised by the polymeric binder or the macromolecular additives other than the diazo resins or the polymeric diazonium compounds
    • G03F7/0217—Polyurethanes; Epoxy resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
DE60330843T 2002-02-19 2003-02-18 Lichtempfindliche zusammensetzung, lichtempfindliche flachdruckplatte und verfahren zur herstellung einer flachdruckplatte damit Expired - Lifetime DE60330843D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002042116 2002-02-19
JP2003008326A JP4184813B2 (ja) 2002-02-19 2003-01-16 感光性組成物、感光性平版印刷版およびこれを用いた平版印刷版の作製方法
PCT/JP2003/001720 WO2003071355A2 (en) 2002-02-19 2003-02-18 Photosensitive composition, photosensitive planographic printing plate, and method for manufacturing planographic printing plate using the same

Publications (1)

Publication Number Publication Date
DE60330843D1 true DE60330843D1 (de) 2010-02-25

Family

ID=27759642

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60330843T Expired - Lifetime DE60330843D1 (de) 2002-02-19 2003-02-18 Lichtempfindliche zusammensetzung, lichtempfindliche flachdruckplatte und verfahren zur herstellung einer flachdruckplatte damit

Country Status (5)

Country Link
US (1) US6824947B2 (enExample)
EP (1) EP1476786B1 (enExample)
JP (1) JP4184813B2 (enExample)
DE (1) DE60330843D1 (enExample)
WO (1) WO2003071355A2 (enExample)

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US7358032B2 (en) * 2002-11-08 2008-04-15 Fujifilm Corporation Planographic printing plate precursor
JP2004226472A (ja) * 2003-01-20 2004-08-12 Fuji Photo Film Co Ltd 平版印刷版原版
US7910223B2 (en) 2003-07-17 2011-03-22 Honeywell International Inc. Planarization films for advanced microelectronic applications and devices and methods of production thereof
DE602005007070D1 (de) * 2004-01-09 2008-07-10 Fujifilm Corp Blindplattenvorläufer für Flachdruck
US7005227B2 (en) * 2004-01-21 2006-02-28 Intel Corporation One component EUV photoresist
JPWO2005070691A1 (ja) * 2004-01-27 2007-09-06 旭化成ケミカルズ株式会社 レーザー彫刻可能な印刷基材用感光性樹脂組成物
JP4308687B2 (ja) * 2004-03-11 2009-08-05 富士フイルム株式会社 平版印刷版原版
EP1584485B1 (en) * 2004-04-09 2007-12-05 FUJIFILM Corporation Lithographic printing plate precursor and lithographic printing method
KR101232249B1 (ko) * 2004-08-10 2013-02-12 간또 가가꾸 가부시끼가이샤 반도체 기판 세정액 및 반도체 기판 세정방법
JP2006096838A (ja) * 2004-09-29 2006-04-13 Air Water Chemical Inc エポキシ樹脂の硬化剤、その組成物及びその用途
US6969579B1 (en) 2004-12-21 2005-11-29 Eastman Kodak Company Solvent resistant imageable element
JP4738827B2 (ja) * 2005-02-08 2011-08-03 富士フイルム株式会社 インク組成物、インクジェット記録方法、印刷物、平版印刷版の作製方法及び平版印刷版
US7601482B2 (en) * 2006-03-28 2009-10-13 Az Electronic Materials Usa Corp. Negative photoresist compositions
US7704670B2 (en) * 2006-06-22 2010-04-27 Az Electronic Materials Usa Corp. High silicon-content thin film thermosets
US20080131812A1 (en) * 2006-11-30 2008-06-05 Konica Minolta Medical & Graphic, Inc. Resin for printing plate material and lithographic printing plate material by use thereof
US8026040B2 (en) 2007-02-20 2011-09-27 Az Electronic Materials Usa Corp. Silicone coating composition
KR101523393B1 (ko) 2007-02-27 2015-05-27 이엠디 퍼포먼스 머티리얼스 코프. 규소를 주성분으로 하는 반사 방지 코팅 조성물
JP5002399B2 (ja) * 2007-09-28 2012-08-15 富士フイルム株式会社 平版印刷版原版の処理方法
JP5444933B2 (ja) * 2008-08-29 2014-03-19 富士フイルム株式会社 ネガ型平版印刷版原版及びそれを用いる平版印刷方法
TWI497200B (zh) * 2008-09-19 2015-08-21 Jsr Corp 光阻圖型塗佈劑及光阻圖型之形成方法
CN101762982B (zh) * 2008-12-24 2013-03-13 成都新图新材料股份有限公司 一种红外阳图热敏平版印刷版
EP2233288A1 (en) 2009-03-23 2010-09-29 Founder Fine Chemical Industry Co., Ltd. Radiation sensitive composition and method for preparing radiation sensitive composition
KR20120066924A (ko) * 2010-12-15 2012-06-25 제일모직주식회사 오르토-니트로벤질 에스테르 화합물 및 이를 포함하는 포지티브형 감광성 수지 조성물
US9012126B2 (en) 2012-06-15 2015-04-21 Az Electronic Materials (Luxembourg) S.A.R.L. Positive photosensitive material
US8906594B2 (en) 2012-06-15 2014-12-09 Az Electronic Materials (Luxembourg) S.A.R.L. Negative-working thick film photoresist
JP6116954B2 (ja) * 2013-03-22 2017-04-19 旭化成株式会社 感光性樹脂組成物及び硬化レリーフパターンの製造方法
US11479627B2 (en) * 2014-02-12 2022-10-25 Nissan Chemical Industries, Ltd. Film forming composition containing fluorine-containing surfactant
KR101654463B1 (ko) * 2014-03-06 2016-09-05 주식회사 엘지화학 오프셋 인쇄 조성물, 이를 이용한 인쇄방법 및 오프셋 인쇄 조성물을 포함하는 패턴
CN106164772B (zh) * 2014-03-31 2019-09-03 富士胶片株式会社 感光性树脂组合物、平版印刷版原版及平版印刷版的制作方法
EP3346331A1 (en) 2015-08-31 2018-07-11 FUJIFILM Corporation Photosensitive resin composition, lithographic printing original plate and plate making method for lithographic printing plate
TWI731961B (zh) 2016-04-19 2021-07-01 德商馬克專利公司 正向感光材料及形成正向凸紋影像之方法
KR102275345B1 (ko) * 2018-05-16 2021-07-09 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용한 감광성 수지막 및 전자 소자
SG11202100517VA (en) 2018-09-05 2021-02-25 Merck Patent Gmbh Positive working photosensitive material
US20200096865A1 (en) * 2018-09-21 2020-03-26 Eastman Kodak Company Lithographic printing plate precursor and color-forming composition

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Also Published As

Publication number Publication date
JP4184813B2 (ja) 2008-11-19
US20030224281A1 (en) 2003-12-04
WO2003071355A2 (en) 2003-08-28
JP2003315995A (ja) 2003-11-06
EP1476786B1 (en) 2010-01-06
US6824947B2 (en) 2004-11-30
WO2003071355A3 (en) 2004-04-22
EP1476786A2 (en) 2004-11-17

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