DE60316575D1 - Verfahren und vorrichtung zum aufnehmen von halbleiterchips sowie dazu verwendbares saugung ablöswerkzeug - Google Patents

Verfahren und vorrichtung zum aufnehmen von halbleiterchips sowie dazu verwendbares saugung ablöswerkzeug

Info

Publication number
DE60316575D1
DE60316575D1 DE60316575T DE60316575T DE60316575D1 DE 60316575 D1 DE60316575 D1 DE 60316575D1 DE 60316575 T DE60316575 T DE 60316575T DE 60316575 T DE60316575 T DE 60316575T DE 60316575 D1 DE60316575 D1 DE 60316575D1
Authority
DE
Germany
Prior art keywords
semiconductor chips
tool used
suction tool
receiving semiconductor
used therefrom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60316575T
Other languages
English (en)
Other versions
DE60316575T2 (de
Inventor
Mitsuru Ozono
Teruaki Kasai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002208382A external-priority patent/JP3945331B2/ja
Priority claimed from JP2002254310A external-priority patent/JP4180329B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE60316575D1 publication Critical patent/DE60316575D1/de
Publication of DE60316575T2 publication Critical patent/DE60316575T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/976—Temporary protective layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1126—Using direct fluid current against work during delaminating
    • Y10T156/1132—Using vacuum directly against work during delaminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1928—Differential fluid pressure delaminating means
    • Y10T156/1944—Vacuum delaminating means [e.g., vacuum chamber, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE60316575T 2002-07-17 2003-07-09 Verfahren und vorrichtung zum aufnehmen von halbleiterchips sowie dazu verwendbares saugung ablöswerkzeug Expired - Lifetime DE60316575T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002208382A JP3945331B2 (ja) 2002-07-17 2002-07-17 半導体チップのピックアップ装置および吸着剥離ツール
JP2002208382 2002-07-17
JP2002254310A JP4180329B2 (ja) 2002-08-30 2002-08-30 半導体チップのピックアップ方法
JP2002254310 2002-08-30
PCT/JP2003/008733 WO2004008499A1 (en) 2002-07-17 2003-07-09 Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor

Publications (2)

Publication Number Publication Date
DE60316575D1 true DE60316575D1 (de) 2007-11-08
DE60316575T2 DE60316575T2 (de) 2008-01-17

Family

ID=30117479

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60316575T Expired - Lifetime DE60316575T2 (de) 2002-07-17 2003-07-09 Verfahren und vorrichtung zum aufnehmen von halbleiterchips sowie dazu verwendbares saugung ablöswerkzeug

Country Status (7)

Country Link
US (1) US7632374B2 (de)
EP (1) EP1535312B1 (de)
CN (1) CN1669119A (de)
AU (1) AU2003249592A1 (de)
DE (1) DE60316575T2 (de)
TW (1) TWI277166B (de)
WO (1) WO2004008499A1 (de)

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US6602726B1 (en) * 2002-01-30 2003-08-05 Texas Instruments Incorporated Bond surface conditioning system for improved bondability
US7306695B2 (en) 2003-04-10 2007-12-11 Matsushita Electric Industrial Co., Ltd. Apparatus and method for picking up semiconductor chip
JP4093930B2 (ja) * 2003-07-17 2008-06-04 株式会社東京精密 フレーム搬送プローバ
JP2005223244A (ja) * 2004-02-09 2005-08-18 Tokyo Seimitsu Co Ltd チップの飛び出し位置検出方法
CN103558737A (zh) * 2004-06-09 2014-02-05 尼康股份有限公司 基板保持装置、具备其之曝光装置、方法
JP4165467B2 (ja) * 2004-07-12 2008-10-15 セイコーエプソン株式会社 ダイシングシート、半導体装置の製造方法
US7238258B2 (en) * 2005-04-22 2007-07-03 Stats Chippac Ltd. System for peeling semiconductor chips from tape
JP4721828B2 (ja) * 2005-08-31 2011-07-13 東京応化工業株式会社 サポートプレートの剥離方法
DE102006026331B4 (de) * 2006-06-02 2019-09-26 Erich Thallner Transportable Einheit zum Transport von Wafern und Verwendung einer Gelfolie in einer transportablen Einheit
DE102006031434B4 (de) * 2006-07-07 2019-11-14 Erich Thallner Handhabungsvorrichtung sowie Handhabungsverfahren für Wafer
DE102006035644A1 (de) * 2006-07-31 2008-02-14 Advanced Micro Devices, Inc., Sunnyvale Verfahren zum Reduzieren der Kontamination durch Vorsehen einer zu entfernenden Polymerschutzschicht während der Bearbeitung von Mikrostrukturen
JP2008103494A (ja) * 2006-10-18 2008-05-01 Lintec Corp 固定ジグおよびチップのピックアップ方法並びにピックアップ装置
KR100817068B1 (ko) 2006-10-24 2008-03-27 삼성전자주식회사 박형의 반도체 칩 픽업 장치 및 방법
JP5196838B2 (ja) * 2007-04-17 2013-05-15 リンテック株式会社 接着剤付きチップの製造方法
JP5074125B2 (ja) * 2007-08-09 2012-11-14 リンテック株式会社 固定治具並びにワークの処理方法
WO2009109447A2 (de) * 2008-02-29 2009-09-11 Oerlikon Assembly Equipment Ag, Steinhausen Chip-auswerfer
US8715457B2 (en) * 2008-11-12 2014-05-06 Esec Ag Method for detaching and removing a semiconductor chip from a foil
JP2010141208A (ja) * 2008-12-12 2010-06-24 Sumitomo Electric Ind Ltd 半導体レーザチップ又は半導体レーザバーの外観検査装置及び外観検査方法
US9038264B2 (en) 2011-02-28 2015-05-26 Sandisk Semiconductor (Shanghai) Co., Ltd. Non-uniform vacuum profile die attach tip
JP5805411B2 (ja) * 2011-03-23 2015-11-04 ファスフォードテクノロジ株式会社 ダイボンダのピックアップ方法およびダイボンダ
JP5705052B2 (ja) * 2011-07-26 2015-04-22 株式会社新川 ダイボンディング装置
SG194239A1 (en) 2012-04-09 2013-11-29 Semiconductor Tech & Instr Inc End handler
US8752751B2 (en) * 2012-07-13 2014-06-17 Asm Technology Singapore Pte Ltd Lead frame support plate and window clamp for wire bonding machines
US9902092B2 (en) * 2013-11-26 2018-02-27 Taiwan Semiconductor Manufacturing Company, Ltd. Vacuum carrier module, method of using and process of making the same
US9196520B1 (en) * 2014-08-01 2015-11-24 Freescale Semiconductor, Inc. Tape release systems and methods for semiconductor dies
TWI560794B (en) * 2015-04-23 2016-12-01 Advanced Semiconductor Eng Semiconductor element carrier, method for attaching a semiconductor element to a carrier, and semiconductor process
US9917000B2 (en) * 2015-10-01 2018-03-13 Infineon Technologies Ag Wafer carrier, method for manufacturing the same and method for carrying a wafer
US10699934B2 (en) 2015-10-01 2020-06-30 Infineon Technologies Ag Substrate carrier, a processing arrangement and a method
US20180015618A1 (en) * 2016-07-15 2018-01-18 Georgia Tech Research Corporation Topologically and mechanically adaptive reversible attachment systems and methods
JP6626027B2 (ja) * 2017-03-16 2019-12-25 Ｔｏｗａ株式会社 製造装置および電子部品の製造方法
US10529600B2 (en) * 2017-03-30 2020-01-07 Intel Corporation Decoupling systems
CN109037124B (zh) * 2018-09-30 2023-10-20 汕头大学 一种大尺寸超薄芯片阶段化高速剥离装置及其方法
KR102594542B1 (ko) * 2018-10-31 2023-10-26 세메스 주식회사 다이 이젝팅 장치
US11764098B2 (en) * 2021-04-16 2023-09-19 Asmpt Singapore Pte. Ltd. Detaching a die from an adhesive tape by air ejection
CN114056933B (zh) * 2021-12-17 2023-10-20 广东海拓创新精密设备科技有限公司 一种高分子量改性硅化聚氨酯橡胶物理粘附吸盘

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US4778326A (en) * 1983-05-24 1988-10-18 Vichem Corporation Method and means for handling semiconductor and similar electronic devices
US4798645A (en) * 1984-09-10 1989-01-17 Pak Chong Il Wafer segment separator and method
JPH01235247A (ja) * 1988-03-15 1989-09-20 Fujitsu Ltd チップの剥離方法
US5454051A (en) 1991-08-05 1995-09-26 Eastman Kodak Company Method of reducing block artifacts created by block transform compression algorithms
JPH05335405A (ja) 1992-05-29 1993-12-17 Toshiba Corp ウエハ載置台および半導体装置製造装置
JPH0661347A (ja) 1992-08-11 1994-03-04 Fujitsu Ltd チップ剥離の方法及び装置
JP3611962B2 (ja) 1998-03-26 2005-01-19 松下電器産業株式会社 チップの突き上げ装置
US6032997A (en) * 1998-04-16 2000-03-07 Excimer Laser Systems Vacuum chuck
JP2000195877A (ja) 1998-12-25 2000-07-14 Matsushita Electric Ind Co Ltd ダイシングシ―ト上のチップの分離方法及び分離装置
JP3504543B2 (ja) * 1999-03-03 2004-03-08 株式会社日立製作所 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法
JP2000299297A (ja) * 1999-04-16 2000-10-24 Disco Abrasive Syst Ltd ペレットのピックアップ用テーブル及びペレットの移し替え装置
JP2000353710A (ja) * 1999-06-14 2000-12-19 Toshiba Corp ペレットピックアップ装置および半導体装置の製造方法
JP3209736B2 (ja) * 1999-11-09 2001-09-17 エヌイーシーマシナリー株式会社 ペレットピックアップ装置
JP3748375B2 (ja) 2000-11-24 2006-02-22 シャープ株式会社 半導体チップのピックアップ装置
JP4021614B2 (ja) * 2000-12-11 2007-12-12 株式会社東芝 半導体素子のピックアップ用治具、半導体素子のピックアップ装置、半導体素子のピックアップ方法、半導体装置の製造方法及び半導体装置の製造装置
JP2003124146A (ja) * 2001-10-11 2003-04-25 Lintec Corp 保護シート剥離方法及び装置

Also Published As

Publication number Publication date
AU2003249592A8 (en) 2004-02-02
WO2004008499A8 (en) 2004-11-11
EP1535312A1 (de) 2005-06-01
CN1669119A (zh) 2005-09-14
TW200402828A (en) 2004-02-16
US20040038498A1 (en) 2004-02-26
EP1535312B1 (de) 2007-09-26
DE60316575T2 (de) 2008-01-17
TWI277166B (en) 2007-03-21
US7632374B2 (en) 2009-12-15
WO2004008499A1 (en) 2004-01-22
AU2003249592A1 (en) 2004-02-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)