TWI560794B - Semiconductor element carrier, method for attaching a semiconductor element to a carrier, and semiconductor process - Google Patents

Semiconductor element carrier, method for attaching a semiconductor element to a carrier, and semiconductor process

Info

Publication number
TWI560794B
TWI560794B TW104113102A TW104113102A TWI560794B TW I560794 B TWI560794 B TW I560794B TW 104113102 A TW104113102 A TW 104113102A TW 104113102 A TW104113102 A TW 104113102A TW I560794 B TWI560794 B TW I560794B
Authority
TW
Taiwan
Prior art keywords
carrier
semiconductor element
semiconductor
attaching
semiconductor process
Prior art date
Application number
TW104113102A
Other languages
Chinese (zh)
Other versions
TW201639058A (en
Inventor
Ya Pei Tseng
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW104113102A priority Critical patent/TWI560794B/en
Priority to CN201610255376.6A priority patent/CN106067438B/en
Publication of TW201639058A publication Critical patent/TW201639058A/en
Application granted granted Critical
Publication of TWI560794B publication Critical patent/TWI560794B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW104113102A 2015-04-23 2015-04-23 Semiconductor element carrier, method for attaching a semiconductor element to a carrier, and semiconductor process TWI560794B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW104113102A TWI560794B (en) 2015-04-23 2015-04-23 Semiconductor element carrier, method for attaching a semiconductor element to a carrier, and semiconductor process
CN201610255376.6A CN106067438B (en) 2015-04-23 2016-04-22 Carrier, method for attaching semiconductor element to carrier and semiconductor method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104113102A TWI560794B (en) 2015-04-23 2015-04-23 Semiconductor element carrier, method for attaching a semiconductor element to a carrier, and semiconductor process

Publications (2)

Publication Number Publication Date
TW201639058A TW201639058A (en) 2016-11-01
TWI560794B true TWI560794B (en) 2016-12-01

Family

ID=57420016

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104113102A TWI560794B (en) 2015-04-23 2015-04-23 Semiconductor element carrier, method for attaching a semiconductor element to a carrier, and semiconductor process

Country Status (2)

Country Link
CN (1) CN106067438B (en)
TW (1) TWI560794B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105921894B (en) * 2016-05-17 2017-10-10 京东方科技集团股份有限公司 Microscope carrier and cutting method
TWI623381B (en) * 2017-03-09 2018-05-11 台灣積體電路製造股份有限公司 Support carrier, system and method for leakage test
TWI847894B (en) * 2023-10-19 2024-07-01 日月光半導體製造股份有限公司 Semiconductor manufacturing method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200828492A (en) * 2006-10-18 2008-07-01 Lintec Corp Fixing jig, and pickup method of chip and pickup apparatus

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG102690A1 (en) * 1998-03-13 2004-03-26 Towa Corp Nest for dicing, and method and apparatus for cutting tapeless substrate using the same
US6202292B1 (en) * 1998-08-26 2001-03-20 Micron Technology, Inc. Apparatus for removing carrier film from a semiconductor die
JP4266106B2 (en) * 2001-09-27 2009-05-20 株式会社東芝 Adhesive tape peeling device, adhesive tape peeling method, semiconductor chip pickup device, semiconductor chip pickup method, and semiconductor device manufacturing method
JP2003229469A (en) * 2002-02-04 2003-08-15 Disco Abrasive Syst Ltd Semiconductor chip pickup device
DE60316575T2 (en) * 2002-07-17 2008-01-17 Matsushita Electric Industrial Co., Ltd., Kadoma METHOD AND DEVICE FOR RECEIVING SEMICONDUCTOR CHIPS AND USE VACUUM CLEANING TOOL
DE10256692A1 (en) * 2002-12-04 2004-06-24 Infineon Technologies Ag Testing method for testing connection between semiconductor element and carrier with testing effected immediately after loading semiconductor element on carrier
JP4791787B2 (en) * 2005-09-22 2011-10-12 Ｔｏｗａ株式会社 Cutting device using abrasive water jet
KR100861019B1 (en) * 2006-08-21 2008-09-30 양용찬 vacuum chuck's make use of packing and cylinder
CN102339780B (en) * 2011-09-30 2013-07-17 格科微电子（上海）有限公司 Adsorbing and supporting device of wafer and substrate and semiconductor processing equipment of wafer
US8629043B2 (en) * 2011-11-16 2014-01-14 Taiwan Semiconductor Manufacturing Company, Ltd. Methods for de-bonding carriers
JP2013198944A (en) * 2012-03-23 2013-10-03 Toshiba Corp Dicing apparatus and dicing method
US9293926B2 (en) * 2012-11-21 2016-03-22 Lam Research Corporation Plasma processing systems having multi-layer segmented electrodes and methods therefor
CN103065957B (en) * 2012-12-27 2016-04-20 日月光半导体制造股份有限公司 The device of semiconductor substrate cutting and the manufacture method of semiconductor crystal wafer cutting
CN203300619U (en) * 2013-05-02 2013-11-20 苏州日月新半导体有限公司 Mobile carry tool for semiconductor elements

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200828492A (en) * 2006-10-18 2008-07-01 Lintec Corp Fixing jig, and pickup method of chip and pickup apparatus

Also Published As

Publication number Publication date
TW201639058A (en) 2016-11-01
CN106067438B (en) 2020-09-25
CN106067438A (en) 2016-11-02

Similar Documents

Publication Publication Date Title
GB2538459B (en) Coil component, coil module, and method for manufacturing coil component
HK1247205A1 (en) Allyl-phenoxy-cyclophosphazene compound, and production method therefor
PL3191284T3 (en) Method for manufacturing encapsulated photovoltaic modules
EP3152163A4 (en) Urea to ammonia process
GB201421182D0 (en) Method for manufacturing a semiconducor structure, semiconductor structure, andelectronic device
SG11201709671YA (en) Semiconductor device manufacturing method
EP3007237A4 (en) Led pattern wafer, led epitaxial wafer, and production method for led epitaxial wafer
EP3142142C0 (en) Method for processing wide-bandgap semiconductor substrate
IL253723B (en) Encapsulation method
HUE044577T2 (en) Method for preparing urea
SG11201605542RA (en) Semiconductor substrate, semiconductor device and manufacturing method for semiconductor substrate
GB2525585B (en) Leadless chip carrier
HUE047589T2 (en) Method for producing a substrate adapter, substrate adapter and method for contacting a semiconductor element
SG11201609433VA (en) A method for bonding a chip to a wafer
ZA201802179B (en) Plant carrier
TWI560794B (en) Semiconductor element carrier, method for attaching a semiconductor element to a carrier, and semiconductor process
IL251714A0 (en) Semiconductor device, and production method therefor
EP2983199A4 (en) Carrier for semiconductor process
GB201719387D0 (en) Semiconductor device, and method for manufacturing same
SI3242764T1 (en) Carrier tool
IL250223A0 (en) Method for producing pyrimidine-1-ol compound, and intermediate thereof
TWI560813B (en) Method for manufacturing package on package
SG11201704945YA (en) Method for producing multicrystalline silicon
PL3169663T3 (en) Method for revamping a urea production complex
PL3006400T3 (en) Process for producing ammonia