DE60239723D1 - MEMS Gyroskop mit einer in bezug zum Substrat vertikal schwingenden Masse - Google Patents

MEMS Gyroskop mit einer in bezug zum Substrat vertikal schwingenden Masse

Info

Publication number
DE60239723D1
DE60239723D1 DE60239723T DE60239723T DE60239723D1 DE 60239723 D1 DE60239723 D1 DE 60239723D1 DE 60239723 T DE60239723 T DE 60239723T DE 60239723 T DE60239723 T DE 60239723T DE 60239723 D1 DE60239723 D1 DE 60239723D1
Authority
DE
Germany
Prior art keywords
substrate
respect
mems gyroscope
mass vibrating
vibrating vertically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60239723T
Other languages
English (en)
Inventor
Jun-O Kim
Sang-Woo Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Application granted granted Critical
Publication of DE60239723D1 publication Critical patent/DE60239723D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G01C19/5733Structural details or topology
    • G01C19/5755Structural details or topology the devices having a single sensing mass
    • G01C19/5762Structural details or topology the devices having a single sensing mass the sensing mass being connected to a driving mass, e.g. driving frames

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Gyroscopes (AREA)
DE60239723T 2001-12-14 2002-12-06 MEMS Gyroskop mit einer in bezug zum Substrat vertikal schwingenden Masse Expired - Lifetime DE60239723D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR10-2001-0079496A KR100436367B1 (ko) 2001-12-14 2001-12-14 수직 진동 질량체를 갖는 멤스 자이로스코프

Publications (1)

Publication Number Publication Date
DE60239723D1 true DE60239723D1 (de) 2011-05-26

Family

ID=19717057

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60239723T Expired - Lifetime DE60239723D1 (de) 2001-12-14 2002-12-06 MEMS Gyroskop mit einer in bezug zum Substrat vertikal schwingenden Masse

Country Status (5)

Country Link
US (1) US6915693B2 (de)
EP (1) EP1319927B1 (de)
JP (1) JP3811444B2 (de)
KR (1) KR100436367B1 (de)
DE (1) DE60239723D1 (de)

Families Citing this family (80)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000061839A (ja) * 1998-08-19 2000-02-29 Rikagaku Kenkyusho マイクロ放電ツルーイング装置とこれを用いた微細加工方法
KR100492105B1 (ko) * 2002-12-24 2005-06-01 삼성전자주식회사 수평 가진 수직형 mems 자이로스코프 및 그 제작 방법
KR100476562B1 (ko) * 2002-12-24 2005-03-17 삼성전기주식회사 수평형 및 튜닝 포크형 진동식 마이크로 자이로스코프
US7458263B2 (en) 2003-10-20 2008-12-02 Invensense Inc. Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
US6939473B2 (en) * 2003-10-20 2005-09-06 Invensense Inc. Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
US6892575B2 (en) 2003-10-20 2005-05-17 Invensense Inc. X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
KR100880212B1 (ko) * 2004-03-12 2009-01-28 파나소닉 덴코 가부시키가이샤 자이로 센서 및 이를 이용하는 센서 장치
JP4654668B2 (ja) * 2004-03-12 2011-03-23 パナソニック電工株式会社 ジャイロセンサおよびそれを用いたセンサ装置
JP4514509B2 (ja) * 2004-05-14 2010-07-28 アップサイド株式会社 力センサー、力検出システム及び力検出プログラム
JP4556515B2 (ja) * 2004-07-02 2010-10-06 株式会社デンソー 角速度センサ
JP4654667B2 (ja) * 2004-11-25 2011-03-23 パナソニック電工株式会社 ジャイロセンサおよび角速度検出方法
KR100616641B1 (ko) * 2004-12-03 2006-08-28 삼성전기주식회사 튜닝포크형 진동식 mems 자이로스코프
US7258010B2 (en) * 2005-03-09 2007-08-21 Honeywell International Inc. MEMS device with thinned comb fingers
US7442570B2 (en) 2005-03-18 2008-10-28 Invensence Inc. Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom
US7621183B2 (en) * 2005-11-18 2009-11-24 Invensense Inc. X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging
JP4974340B2 (ja) * 2006-05-15 2012-07-11 住友精密工業株式会社 角速度センサ
JP4310325B2 (ja) * 2006-05-24 2009-08-05 日立金属株式会社 角速度センサ
WO2008029654A1 (en) 2006-09-06 2008-03-13 Hitachi Metals, Ltd. Semiconductor sensor device and method for manufacturing same
US8508039B1 (en) 2008-05-08 2013-08-13 Invensense, Inc. Wafer scale chip scale packaging of vertically integrated MEMS sensors with electronics
US8047075B2 (en) 2007-06-21 2011-11-01 Invensense, Inc. Vertically integrated 3-axis MEMS accelerometer with electronics
US7796872B2 (en) * 2007-01-05 2010-09-14 Invensense, Inc. Method and apparatus for producing a sharp image from a handheld device containing a gyroscope
US8020441B2 (en) 2008-02-05 2011-09-20 Invensense, Inc. Dual mode sensing for vibratory gyroscope
US8462109B2 (en) * 2007-01-05 2013-06-11 Invensense, Inc. Controlling and accessing content using motion processing on mobile devices
US8250921B2 (en) 2007-07-06 2012-08-28 Invensense, Inc. Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics
US7934423B2 (en) 2007-12-10 2011-05-03 Invensense, Inc. Vertically integrated 3-axis MEMS angular accelerometer with integrated electronics
US8952832B2 (en) 2008-01-18 2015-02-10 Invensense, Inc. Interfacing application programs and motion sensors of a device
US20090262074A1 (en) * 2007-01-05 2009-10-22 Invensense Inc. Controlling and accessing content using motion processing on mobile devices
US8141424B2 (en) * 2008-09-12 2012-03-27 Invensense, Inc. Low inertia frame for detecting coriolis acceleration
KR100895037B1 (ko) * 2007-02-05 2009-05-04 (주)에스엠엘전자 고감도 3축 가속도 센서
TWI335903B (en) * 2007-10-05 2011-01-11 Pixart Imaging Inc Out-of-plane sensing device
MY147014A (en) * 2007-10-31 2012-10-15 Mimos Berhad Capacitive area-changed mems gyroscope with adjustable resonance frequencies
JP5247182B2 (ja) * 2008-02-19 2013-07-24 キヤノン株式会社 角速度センサ
US8187902B2 (en) 2008-07-09 2012-05-29 The Charles Stark Draper Laboratory, Inc. High performance sensors and methods for forming the same
WO2010021242A1 (ja) 2008-08-18 2010-02-25 株式会社日立製作所 微小電気機械システム
DE102008043796B4 (de) 2008-11-17 2023-12-21 Robert Bosch Gmbh Drehratensensor
JP5206709B2 (ja) 2009-03-18 2013-06-12 株式会社豊田中央研究所 可動体を備えている装置
EP2435789B1 (de) * 2009-05-27 2015-04-08 King Abdullah University Of Science And Technology Mems-masse-feder-dämpfersysteme mit federungsschema ausserhalb der ebene
US8534127B2 (en) 2009-09-11 2013-09-17 Invensense, Inc. Extension-mode angular velocity sensor
US9097524B2 (en) 2009-09-11 2015-08-04 Invensense, Inc. MEMS device with improved spring system
US8549915B2 (en) * 2009-10-23 2013-10-08 The Regents Of The University Of California Micromachined gyroscopes with 2-DOF sense modes allowing interchangeable robust and precision operation
JP4905574B2 (ja) * 2010-03-25 2012-03-28 株式会社豊田中央研究所 可動部分を備えている積層構造体
JP5423577B2 (ja) * 2010-05-13 2014-02-19 株式会社豊田中央研究所 可動体、2軸角速度センサおよび3軸加速度センサ
US8567246B2 (en) 2010-10-12 2013-10-29 Invensense, Inc. Integrated MEMS device and method of use
TWI434802B (zh) 2010-12-23 2014-04-21 Ind Tech Res Inst 具電性絕緣結構之微機電裝置及其製造方法
US8860409B2 (en) 2011-01-11 2014-10-14 Invensense, Inc. Micromachined resonant magnetic field sensors
US9664750B2 (en) 2011-01-11 2017-05-30 Invensense, Inc. In-plane sensing Lorentz force magnetometer
US8947081B2 (en) 2011-01-11 2015-02-03 Invensense, Inc. Micromachined resonant magnetic field sensors
JP2012225851A (ja) * 2011-04-21 2012-11-15 Denso Corp 静電容量式センサ、及び、その製造方法
US8739627B2 (en) 2011-10-26 2014-06-03 Freescale Semiconductor, Inc. Inertial sensor with off-axis spring system
GB201120198D0 (en) 2011-11-23 2012-01-04 Cambridge Entpr Ltd MEMS inertial sensor and method of inertial sensing
DE102012200929B4 (de) * 2012-01-23 2020-10-01 Robert Bosch Gmbh Mikromechanische Struktur und Verfahren zur Herstellung einer mikromechanischen Struktur
DE102012200943B4 (de) 2012-01-24 2024-05-29 Robert Bosch Gmbh Gelenkvorrichtung für einen Sensor und Sensor
JP5708535B2 (ja) * 2012-03-13 2015-04-30 株式会社デンソー 角速度センサ
DE102012218906A1 (de) 2012-10-17 2014-04-30 Robert Bosch Gmbh Beschleunigungssensor und Verfahren zum Herstellen eines Beschleunigungssensors
US10036635B2 (en) * 2013-01-25 2018-07-31 MCube Inc. Multi-axis MEMS rate sensor device
US10132630B2 (en) * 2013-01-25 2018-11-20 MCube Inc. Multi-axis integrated MEMS inertial sensing device on single packaged chip
FR3005160B1 (fr) * 2013-04-29 2016-02-12 Sagem Defense Securite Capteur angulaire inertiel de type mems equilibre et procede d'equilibrage d'un tel capteur
JP6323034B2 (ja) * 2014-01-28 2018-05-16 セイコーエプソン株式会社 機能素子、電子デバイス、電子機器、および移動体
JP6398348B2 (ja) * 2014-06-12 2018-10-03 セイコーエプソン株式会社 機能素子、機能素子の製造方法、電子機器、および移動体
US9581447B2 (en) * 2014-07-08 2017-02-28 Honeywell International Inc. MEMS gyro motor loop filter
JP2016057073A (ja) * 2014-09-05 2016-04-21 セイコーエプソン株式会社 物理量センサー素子、物理量センサー、電子機器および移動体
JP6481294B2 (ja) * 2014-09-05 2019-03-13 セイコーエプソン株式会社 物理量センサー素子、物理量センサー、電子機器および移動体
JP6481293B2 (ja) * 2014-09-05 2019-03-13 セイコーエプソン株式会社 物理量センサー素子、物理量センサー、電子機器および移動体
US9360496B2 (en) * 2014-10-03 2016-06-07 Freescale Semiconductor, Inc. Three-axis microelectromechanical systems device with single proof mass
KR101693935B1 (ko) * 2014-11-07 2017-01-06 리치테크 테크놀로지 코포레이션 미세전자기계시스템(mems) 디바이스
WO2016130722A1 (en) 2015-02-11 2016-08-18 Invensense, Inc. 3D INTEGRATION USING Al-Ge EUTECTIC BOND INTERCONNECT
KR101754634B1 (ko) * 2015-05-12 2017-07-07 주식회사 신성씨앤티 2자유도 감지 모드를 갖는 멤스 자이로스코프
JP6485260B2 (ja) * 2015-07-10 2019-03-20 セイコーエプソン株式会社 物理量センサー、物理量センサー装置、電子機器および移動体
KR101733872B1 (ko) * 2015-08-14 2017-05-10 주식회사 스탠딩에그 성능이 개선된 멤스 자이로스코프
DE102015117094B4 (de) * 2015-10-07 2020-04-23 Tdk Electronics Ag MEMS-Drehratensensor
JP6365521B2 (ja) * 2015-12-16 2018-08-01 株式会社豊田中央研究所 Mems装置
US10126128B2 (en) 2016-05-26 2018-11-13 Nxp Usa, Inc. Angular rate sensor
US10192850B1 (en) 2016-09-19 2019-01-29 Sitime Corporation Bonding process with inhibited oxide formation
CN107192384B (zh) * 2017-07-24 2022-04-05 深迪半导体(绍兴)有限公司 一种mems三轴陀螺仪
US10760909B2 (en) 2018-06-18 2020-09-01 Nxp Usa, Inc. Angular rate sensor with in-phase drive and sense motion suppression
WO2020133096A1 (zh) * 2018-12-27 2020-07-02 瑞声声学科技(深圳)有限公司 Mems陀螺仪及包含该陀螺仪的电子设备
US11891297B2 (en) * 2019-07-05 2024-02-06 Aac Acoustic Technologies (Shenzhen) Co., Ltd. Motion control structure and actuator
FR3102240B1 (fr) * 2019-10-18 2021-10-01 Safran Electronics & Defense Capteur à compensation mécanique de l’anisotropie de fréquence
CN113970324B (zh) * 2020-07-23 2023-09-05 昇佳电子股份有限公司 陀螺仪的结构
CN115077508A (zh) * 2022-07-19 2022-09-20 苏州米洛微纳电子科技有限公司 一种mems器件及其形成方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08145683A (ja) 1994-11-16 1996-06-07 Nikon Corp 加速度・角速度検出装置
DE19641284C1 (de) * 1996-10-07 1998-05-20 Inst Mikro Und Informationstec Drehratensensor mit entkoppelten orthogonalen Primär- und Sekundärschwingungen
JP2000304547A (ja) * 1999-04-23 2000-11-02 Hitachi Ltd 角速度検出センサ
JP4729801B2 (ja) 2000-03-17 2011-07-20 アイシン精機株式会社 振動子駆動装置及び振動子駆動装置を備えた角速度センサ

Also Published As

Publication number Publication date
KR100436367B1 (ko) 2004-06-19
US6915693B2 (en) 2005-07-12
JP2003194545A (ja) 2003-07-09
EP1319927A1 (de) 2003-06-18
US20030110858A1 (en) 2003-06-19
KR20030049313A (ko) 2003-06-25
EP1319927B1 (de) 2011-04-13
JP3811444B2 (ja) 2006-08-23

Similar Documents

Publication Publication Date Title
DE60239723D1 (de) MEMS Gyroskop mit einer in bezug zum Substrat vertikal schwingenden Masse
DK1436605T3 (da) Fremgangsmåde til fremstilling af et substrat
DE60116939D1 (de) Behälter zum Verpacken von Glassubstraten
FR2844364B1 (fr) Substrat diffusant
NO20025684D0 (no) Substrat med en redusert lysspredende ultrafobisk overflate og fremgangsmåte for fremstilling av denne
DK1644296T3 (da) Gennemsigtigt substrat forsynet med en belægning med egenskaber vedrørende mekanisk styrke
DE50112776D1 (de) Polymerisierbare Flüssigkristalle
DE60216039D1 (de) Piezoelektrischer Einkristall mit kontrollierter Domänenstruktur
AT500159B8 (de) Schi, sprungschi oder snowboard mit einer strukturierten oberfläche
DE60327960D1 (de) Winkelbeschleunigungsaufnehmer mit ausbalancierter seismischer Masse
FR2869604B1 (fr) Activation d'une surface de verre
DE60123876D1 (de) Lipidzusammensetzung mit flüssigkristalliner Struktur
IT1308279B1 (it) Orditoio per campioni a controllo elettronico
DE60330884D1 (de) Optisch angesteuerter Mikro-aktuator
DE50115703D1 (de) Vorrichtung mit einer Schwingungsisoliereinrichtung
DE50106831D1 (de) Elektronisch ansteuerbares Display
DE69910149D1 (de) Beschleunigungsaufnehmer mit Pendelmasse
TW510308U (en) Improved structure for liquid-filled decorative device
DE60106536D1 (de) Schauverpackung mit einer Hängerkarte
DE50109358D1 (de) Flüssigkristall-Anzeige
DE50214211D1 (de) Einrichtung zum Aufbringen von Glaselementen auf eine Unterlage
DE602004005693D1 (de) Substrat mit flüssigkeitselektrode
DE60114082D1 (de) Vorrichtung zum Auftragen von Schaum auf ein laufendes Substrat
ITMO20020188A0 (it) Macchina per il rempimento di vassoi con tessere di mosaico o simili
ATE410197T1 (de) Implantatvorrichtung mit hohlräume enthaltende beschichtung