DE60217359D1 - Verfahren zur herstellung aufgehängter poröser siliziummikrostrukturen und anwendung in gassensoren - Google Patents
Verfahren zur herstellung aufgehängter poröser siliziummikrostrukturen und anwendung in gassensorenInfo
- Publication number
- DE60217359D1 DE60217359D1 DE60217359T DE60217359T DE60217359D1 DE 60217359 D1 DE60217359 D1 DE 60217359D1 DE 60217359 T DE60217359 T DE 60217359T DE 60217359 T DE60217359 T DE 60217359T DE 60217359 D1 DE60217359 D1 DE 60217359D1
- Authority
- DE
- Germany
- Prior art keywords
- porous silicon
- membranes
- fabrication
- gas sensors
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
- B81C1/0065—Mechanical properties
- B81C1/00682—Treatments for improving mechanical properties, not provided for in B81C1/00658 - B81C1/0065
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
- B81C1/0069—Thermal properties, e.g. improve thermal insulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
- G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
- G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
- G01F1/6845—Micromachined devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0278—Temperature sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0109—Bridges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0118—Cantilevers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0111—Bulk micromachining
- B81C2201/0115—Porous silicon
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/14—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature
- G01N27/16—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature caused by burning or catalytic oxidation of surrounding material to be tested, e.g. of gas
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/14—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature
- G01N27/18—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of an electrically-heated body in dependence upon change of temperature caused by changes in the thermal conductivity of a surrounding material to be tested
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Fluid Mechanics (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
- Ceramic Products (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GR20010100378A GR1004040B (el) | 2001-07-31 | 2001-07-31 | Μεθοδος για την κατασκευη αιωρουμενων μεμβρανων πορωδους πυριτιου και εφαρμογης της σε αισθητηρες αεριων |
PCT/GR2002/000008 WO2003011747A1 (en) | 2001-07-31 | 2002-02-18 | Method for the fabrication of suspended porous silicon microstructures and application in gas sensors |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60217359D1 true DE60217359D1 (de) | 2007-02-15 |
Family
ID=10944796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60217359T Expired - Lifetime DE60217359D1 (de) | 2001-07-31 | 2002-02-18 | Verfahren zur herstellung aufgehängter poröser siliziummikrostrukturen und anwendung in gassensoren |
Country Status (8)
Country | Link |
---|---|
US (1) | US20040195096A1 (de) |
EP (1) | EP1417151B9 (de) |
JP (1) | JP2005502480A (de) |
CN (1) | CN1538934A (de) |
AT (1) | ATE350333T1 (de) |
DE (1) | DE60217359D1 (de) |
GR (1) | GR1004040B (de) |
WO (1) | WO2003011747A1 (de) |
Families Citing this family (74)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10032579B4 (de) * | 2000-07-05 | 2020-07-02 | Robert Bosch Gmbh | Verfahren zur Herstellung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement |
GR1004106B (el) * | 2002-01-24 | 2003-01-13 | Εκεφε "Δημοκριτος" Ινστιτουτο Μικροηλεκτρονικης | Ολοκληρωμενοι θερμικοι αισθητηρες πυριτιου χαμηλης ισχυος και διαταξεις μικρο-ροης βασισμενοι στην χρηση τεχνολογιας κοιλοτητας αερα σφραγισμενης με μεμβρανη πορωδους πυριτιου ή τεχνολογιας μικρο-καναλιων |
US20080044939A1 (en) * | 2002-01-24 | 2008-02-21 | Nassiopoulou Androula G | Low power silicon thermal sensors and microfluidic devices based on the use of porous sealed air cavity technology or microchannel technology |
DE10260859B4 (de) * | 2002-12-23 | 2008-12-04 | Robert Bosch Gmbh | Strukturkörper mit einem porösen Bereich und dessen Verwendung sowie Verfahren zur Einstellung der Wärmeleitfähigkeit eines porösen Bereiches |
US20040231420A1 (en) * | 2003-02-24 | 2004-11-25 | Huikai Xie | Integrated monolithic tri-axial micromachined accelerometer |
US7026184B2 (en) * | 2003-02-26 | 2006-04-11 | Carnegie Mellon University | Method of fabricating microstructures and devices made therefrom |
FR2854277B1 (fr) * | 2003-04-24 | 2005-08-05 | Commissariat Energie Atomique | Detecteur thermique de rayonnement electromagnetique a structure alveolee |
US7762719B2 (en) * | 2004-04-20 | 2010-07-27 | California Institute Of Technology | Microscale calorimeter |
CN1294074C (zh) * | 2004-04-29 | 2007-01-10 | 上海交通大学 | 金属薄膜微桥的制造方法及其力学特性测试方法 |
JP4899715B2 (ja) * | 2005-08-17 | 2012-03-21 | パナソニック電工株式会社 | 赤外線センサユニットの製造方法 |
US7709795B2 (en) * | 2005-08-17 | 2010-05-04 | Panasonic Electric Works Co., Ltd. | Infrared sensor unit and process of fabricating the same |
JP4801396B2 (ja) * | 2005-09-01 | 2011-10-26 | 敏嗣 植田 | ガスセンサ及びガスセンサの製造方法 |
EP1772717B1 (de) * | 2005-10-04 | 2011-05-11 | Sensirion Holding AG | Drucksensor oder Gassensor und Messmethode basiert auf Nanohohlräumen |
CN100348953C (zh) * | 2005-12-19 | 2007-11-14 | 浙江大学 | 一种测热式微型流量传感器 |
DE102006028435A1 (de) * | 2006-06-21 | 2007-12-27 | Robert Bosch Gmbh | Sensor und Verfahren zu seiner Herstellung |
JP4997039B2 (ja) * | 2007-09-20 | 2012-08-08 | アズビル株式会社 | フローセンサ |
US7928343B2 (en) * | 2007-12-04 | 2011-04-19 | The Board Of Trustees Of The University Of Illinois | Microcantilever heater-thermometer with integrated temperature-compensated strain sensor |
WO2009097487A1 (en) | 2008-01-31 | 2009-08-06 | The Board Of Trustees Of The University Of Illinois | Temperature-dependent nanoscale contact potential measurement technique and device |
JP5138404B2 (ja) * | 2008-02-05 | 2013-02-06 | アズビル株式会社 | ガスセンサチップ及びこれを備えたガスセンサ |
WO2010022285A1 (en) | 2008-08-20 | 2010-02-25 | The Board Of Trustees Of The University Of Illinois | Device for calorimetric measurement |
CN101811657B (zh) * | 2009-02-20 | 2012-09-26 | 原相科技股份有限公司 | 微机电传感器与制作方法 |
US8387443B2 (en) * | 2009-09-11 | 2013-03-05 | The Board Of Trustees Of The University Of Illinois | Microcantilever with reduced second harmonic while in contact with a surface and nano scale infrared spectrometer |
WO2011055605A1 (ja) * | 2009-11-06 | 2011-05-12 | 株式会社日立製作所 | ガスセンサ |
CN101795505B (zh) * | 2010-02-11 | 2013-04-17 | 中国科学院上海微系统与信息技术研究所 | 一种具有网孔结构加热膜的低功耗微型加热器及制作方法 |
CN101932146B (zh) * | 2010-09-10 | 2012-10-17 | 中国科学院上海微系统与信息技术研究所 | 具有圆弧形凹槽加热膜区的三维微型加热器及制作方法 |
CN102175287A (zh) * | 2010-12-30 | 2011-09-07 | 国家纳米技术与工程研究院 | 一种基于mems技术的流量计芯片的测量部件及其制作方法 |
US9601234B2 (en) | 2011-01-06 | 2017-03-21 | The Board Of Trustees Of The University Of Illinois | Three-dimensional (3D) porous device and method of making a 3D porous device |
CN102730622B (zh) * | 2011-04-01 | 2015-06-17 | 中国科学院电子学研究所 | 一种微型热导检测器集成芯片及制造方法 |
US9559349B2 (en) | 2011-07-29 | 2017-01-31 | The Board Of Trustees Of The University Of Illinois | Method of fabricating a three-dimensional (3D) porous electrode architecture for a microbattery |
US8533861B2 (en) | 2011-08-15 | 2013-09-10 | The Board Of Trustees Of The University Of Illinois | Magnetic actuation and thermal cantilevers for temperature and frequency dependent atomic force microscopy |
US8914911B2 (en) | 2011-08-15 | 2014-12-16 | The Board Of Trustees Of The University Of Illinois | Magnetic actuation and thermal cantilevers for temperature and frequency dependent atomic force microscopy |
ITRM20120311A1 (it) * | 2012-07-04 | 2014-01-05 | Consiglio Nazionale Ricerche | Rilevatore di conducibilità termica (tcd) per applicazioni di gas-cromatografia veloce (gc). |
FR2995692B1 (fr) | 2012-09-19 | 2014-10-10 | Commissariat Energie Atomique | Capteur de flux thermique a resolution augmentee |
AT513634B1 (de) * | 2012-12-05 | 2015-02-15 | Tech Universität Wien | MEMS-Sensor zur Detektion von Umgebungsparametern |
FR3002219B1 (fr) | 2013-02-19 | 2015-04-10 | Commissariat Energie Atomique | Procede de fabrication d'une structure micromecanique et/ou nanomecanique comportant une surface poreuse |
DE102013220908B4 (de) * | 2013-10-15 | 2015-09-24 | Continental Automotive Gmbh | Sensorelement |
FR3011835B1 (fr) | 2013-10-16 | 2015-12-25 | Commissariat Energie Atomique | Procede de realisation par voie electrochimique d'au moins une zone poreuse d'une structure micro et/ou nanoelectronique |
US9863901B2 (en) * | 2013-12-06 | 2018-01-09 | Robert Bosch Gmbh | Semiconductor sensor having a suspended structure and method of forming a semiconductor sensor having a suspended structure |
CN104176699A (zh) * | 2014-07-18 | 2014-12-03 | 苏州能斯达电子科技有限公司 | 一种具有绝热沟槽的mems硅基微热板及其加工方法 |
CN104142359B (zh) * | 2014-07-18 | 2016-08-31 | 苏州能斯达电子科技有限公司 | 一种mems气体传感器及其加工方法 |
CN104108677A (zh) * | 2014-07-18 | 2014-10-22 | 苏州能斯达电子科技有限公司 | 一种mems硅基微热板及其加工方法 |
CN104155472A (zh) * | 2014-07-18 | 2014-11-19 | 苏州能斯达电子科技有限公司 | 一种热膜风速风向传感器及其制备方法 |
CN104165902B (zh) * | 2014-07-18 | 2017-01-18 | 苏州能斯达电子科技有限公司 | 一种具有绝热沟槽的mems气体传感器及其加工方法 |
CN104181203B (zh) * | 2014-08-13 | 2017-12-22 | 苏州能斯达电子科技有限公司 | 一种mems气体传感器及其制作方法 |
JP6467173B2 (ja) * | 2014-09-16 | 2019-02-06 | ヤマハファインテック株式会社 | 接触燃焼式ガスセンサ |
JP6467172B2 (ja) * | 2014-09-16 | 2019-02-06 | ヤマハファインテック株式会社 | 接触燃焼式ガスセンサ |
KR102210634B1 (ko) * | 2014-09-24 | 2021-02-02 | 엘지전자 주식회사 | 마이크로 히터 및 마이크로 센서 |
CN105445420B (zh) * | 2014-09-24 | 2019-12-06 | 普因特工程有限公司 | 微加热器和微传感器及其制造方法 |
KR102190862B1 (ko) * | 2014-09-24 | 2020-12-14 | (주)포인트엔지니어링 | 마이크로 히터 제조방법 및 마이크로 센서 및 마이크로 센서 제조방법 |
CN104401931B (zh) * | 2014-11-24 | 2016-06-29 | 苏州诺联芯电子科技有限公司 | 微型加热器及其制造方法 |
WO2016109430A1 (en) * | 2014-12-29 | 2016-07-07 | Robert Bosch Gmbh | Nanostructured gas sensor |
CN104501983B (zh) * | 2015-01-08 | 2017-03-22 | 上海新微技术研发中心有限公司 | 一种褶皱膜温度传感器及其制作方法 |
US10062904B2 (en) | 2015-05-26 | 2018-08-28 | The Board Of Trustees Of The University Of Illinois | Scaffold-free 3D porous electrode and method of making a scaffold-free 3D porous electrode |
CN105136871A (zh) * | 2015-06-19 | 2015-12-09 | 上海集成电路研发中心有限公司 | 一种微型热导池结构及其加工制造方法 |
KR101808239B1 (ko) | 2015-09-04 | 2017-12-13 | (주)포인트엔지니어링 | 마이크로 히터 및 마이크로 센서 |
KR101805784B1 (ko) | 2015-11-11 | 2017-12-07 | (주)포인트엔지니어링 | 마이크로 히터 및 마이크로 센서 및 마이크로 센서 제조방법 |
JP6359049B2 (ja) * | 2016-05-09 | 2018-07-18 | Nissha株式会社 | ガスセンサデバイス及びその製造方法 |
CN107421994B (zh) * | 2016-05-24 | 2019-11-15 | 上海新昇半导体科技有限公司 | 基于二维电子气的低功耗氢气传感器及其制造方法 |
CN107782767B (zh) * | 2016-08-26 | 2022-01-07 | 深迪半导体(绍兴)有限公司 | 一种气体传感器加热盘及加工方法 |
US10800649B2 (en) | 2016-11-28 | 2020-10-13 | Analog Devices International Unlimited Company | Planar processing of suspended microelectromechanical systems (MEMS) devices |
CN106922042A (zh) * | 2017-03-06 | 2017-07-04 | 武汉微纳传感技术有限公司 | 一种微热盘及其制造方法 |
RU2661611C1 (ru) * | 2017-12-06 | 2018-07-17 | федеральное государственное автономное образовательное учреждение высшего образования "Национальный исследовательский ядерный университет МИФИ" (НИЯУ МИФИ) | Способ создания сенсорного элемента на основе микрорезонатора из пористого кремния для детекции паров взрывчатых веществ |
CN112074729B (zh) * | 2018-01-05 | 2024-05-07 | 汉席克卡德应用研究协会 | 气体传感器以及用于运行气体传感器的方法 |
KR102558160B1 (ko) | 2018-01-05 | 2023-07-21 | 한-식카드-게셀쉐프트 퓨어 안게반테 포슝 이.브이. | 열 가스 센서에 대한 평가 배열, 방법들 및 컴퓨터 프로그램들 |
CN108318547B (zh) * | 2018-05-11 | 2024-01-23 | 微纳感知(合肥)技术有限公司 | 一种具有卷曲结构的单悬梁式气体传感器及传感器阵列 |
CN108519408B (zh) * | 2018-05-11 | 2024-04-02 | 微纳感知(合肥)技术有限公司 | 一种气体传感器、传感器的制备方法及传感器阵列 |
CN108318548B (zh) * | 2018-05-11 | 2024-03-15 | 微纳感知(合肥)技术有限公司 | 一种单悬梁气体传感器、传感器阵列及传感器的制备方法 |
CN108519409B (zh) * | 2018-05-11 | 2024-05-07 | 微纳感知(合肥)技术有限公司 | 一种翘曲的单悬梁式气体传感器、制备方法及传感器阵列 |
CN109211342B (zh) * | 2018-09-05 | 2020-03-20 | 四方光电股份有限公司 | 一种气流流量计、mems硅基温敏芯片及其制备方法 |
CN110963458B (zh) * | 2018-09-30 | 2023-09-15 | 上海新微技术研发中心有限公司 | 一种在基板中形成微细结构的方法及微细结构 |
US10843920B2 (en) | 2019-03-08 | 2020-11-24 | Analog Devices International Unlimited Company | Suspended microelectromechanical system (MEMS) devices |
CN110182754B (zh) * | 2019-05-17 | 2021-10-29 | 中国科学院上海微系统与信息技术研究所 | 一种具有微纳结构增强的微加热器及其制备方法 |
CN114965625B (zh) * | 2022-05-24 | 2023-07-14 | 广东芯阅科技有限公司 | 一种基于悬浮工作电极的电化学敏感芯片及加工方法 |
CN116730277B (zh) * | 2023-08-14 | 2023-11-03 | 启思半导体(杭州)有限责任公司 | Mems气体传感器及其制作方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5345213A (en) * | 1992-10-26 | 1994-09-06 | The United States Of America, As Represented By The Secretary Of Commerce | Temperature-controlled, micromachined arrays for chemical sensor fabrication and operation |
US5464966A (en) * | 1992-10-26 | 1995-11-07 | The United States Of America As Represented By The Secretary Of Commerce | Micro-hotplate devices and methods for their fabrication |
DE4433102A1 (de) * | 1994-09-16 | 1996-03-21 | Fraunhofer Ges Forschung | Elektrodenanordnung zur Signalerfassung gassensitiver Schichten |
DE69601930T2 (de) * | 1996-07-19 | 1999-10-07 | Fraunhofer Ges Forschung | Katalytisches Gassensorelement |
GR1003010B (el) * | 1997-05-07 | 1998-11-20 | "����������" | Ολοκληρωμενος αισθητηρας ροης αεριων χρησιμοποιωντας τεχνολογια πορωδους πυριτιου |
JP2003532876A (ja) * | 2000-05-08 | 2003-11-05 | アンテルユニヴェルシテール・ミクロ−エレクトロニカ・サントリュム・ヴェー・ゼッド・ドゥブルヴェ | マイクロフィジオメーター |
DE10030352A1 (de) * | 2000-06-21 | 2002-01-10 | Bosch Gmbh Robert | Mikromechanisches Bauelement, insbesondere Sensorelement, mit einer stabilisierten Membran und Verfahren zur Herstellung eines derartigen Bauelements |
-
2001
- 2001-07-31 GR GR20010100378A patent/GR1004040B/el not_active IP Right Cessation
-
2002
- 2002-02-18 WO PCT/GR2002/000008 patent/WO2003011747A1/en active IP Right Grant
- 2002-02-18 DE DE60217359T patent/DE60217359D1/de not_active Expired - Lifetime
- 2002-02-18 CN CNA028152123A patent/CN1538934A/zh active Pending
- 2002-02-18 US US10/485,940 patent/US20040195096A1/en not_active Abandoned
- 2002-02-18 AT AT02712117T patent/ATE350333T1/de not_active IP Right Cessation
- 2002-02-18 JP JP2003516946A patent/JP2005502480A/ja active Pending
- 2002-02-18 EP EP02712117A patent/EP1417151B9/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE350333T1 (de) | 2007-01-15 |
EP1417151B9 (de) | 2007-08-08 |
EP1417151B1 (de) | 2007-01-03 |
GR1004040B (el) | 2002-10-31 |
CN1538934A (zh) | 2004-10-20 |
EP1417151A1 (de) | 2004-05-12 |
JP2005502480A (ja) | 2005-01-27 |
WO2003011747A1 (en) | 2003-02-13 |
US20040195096A1 (en) | 2004-10-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE60217359D1 (de) | Verfahren zur herstellung aufgehängter poröser siliziummikrostrukturen und anwendung in gassensoren | |
WO2003042721A3 (en) | Trilayered beam mems device and related methods | |
WO2004079056A8 (en) | Process to make nano-structurated components | |
ATE366136T1 (de) | Wasserstoff-durchlässige metallmembran und verfahren zu ihrer herstellung | |
ATE367570T1 (de) | Vibrationskreisels und sein herstellungsverfahren | |
WO2003016203A3 (de) | Verfahren zur herstellung eines halbleiterbauelements sowie halbleiterbauelement, insbesondere membransensor | |
ATE447538T1 (de) | Soi/glas-verfahren zur herstellung von dünnen mikrobearbeiteten strukturen | |
NO20024768L (no) | FremgangsmÕte for fremstilling av gassbobler i oljeaktige visker | |
WO2003068373A3 (en) | Micro-fluidic anti-microbial filter | |
ATE493368T1 (de) | Ein verfahren zum erzeugen einer hohlen struktur aus einer silizium-struktur | |
PL361860A1 (en) | Cation-conducting or proton-conducting ceramic membrane based on a hydroxysilylic acid, method for the production thereof and use of the same | |
WO2003014009A3 (en) | A microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in mems | |
WO2005081931A3 (en) | Nickel-coated free-standing silicon carbide structure for sensing fluoro or halogen species in semiconductor processing systems, and processes of making and using same | |
IS5884A (is) | Aðferð til framleiðslu á hreinu sítalóprami | |
TW366417B (en) | Integrated high-performance gas sensor and the manufacturing method | |
WO2007040752A3 (en) | Process and system for etching doped silicon using sf6-based chemistry | |
DE50207120D1 (de) | Halbleiterbauelement als kapazitiver feuchtesensor, sowie ein verfahren zur herstellung des halbleiterbauelements | |
EP1493711B1 (de) | Herstellungsverfahren für eine Halbleitervorrichtung mit einem hängenden Mikrosystem und entsprechende Vorrichtung | |
ATE397566T1 (de) | Strahlungssensor, wafer, sensormodul und verfahren zur herstellung eines strahlungssensors | |
WO2002051742A3 (de) | Mikromechanisches bauelement und entsprechendes herstellungsverfahren | |
Chen et al. | Fabrication of SiO $ _ {2} $ Microcantilever Using Isotropic Etching With ICP | |
DE60133369D1 (de) | VERFAHREN ZUR HERSTELLUNG EINES HALBLEITERBAUELEMENTS AUS SiC | |
DE69922028D1 (de) | Verfahren zur herstellung von expandierbaren poly(vinylaren)teilchen | |
WO2003050852A3 (en) | Complex microdevices and appparatus and methods for fabricating such devices | |
WO2004097907A3 (de) | Verfahren zur herstellung von durchgängigen membranen aus halbleitermaterialien unter nutzung von makro- und mikroporenätzung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |