DE60216291T8 - Oberflächenbehandlungsmittel und verfahren zum entfernen der beim ätzen von druckgussteilen aus aluminium anfallenden si komponente und reduzierten metallsalze - Google Patents

Oberflächenbehandlungsmittel und verfahren zum entfernen der beim ätzen von druckgussteilen aus aluminium anfallenden si komponente und reduzierten metallsalze Download PDF

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Publication number
DE60216291T8
DE60216291T8 DE60216291T DE60216291T DE60216291T8 DE 60216291 T8 DE60216291 T8 DE 60216291T8 DE 60216291 T DE60216291 T DE 60216291T DE 60216291 T DE60216291 T DE 60216291T DE 60216291 T8 DE60216291 T8 DE 60216291T8
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DE
Germany
Prior art keywords
surface treatment
reduced metal
aldc
metal salt
aldc material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE60216291T
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English (en)
Other versions
DE60216291T2 (de
DE60216291D1 (de
Inventor
Eul-Kyu Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jeonyoung Co Ltd Ansan Kyounggi Kr
Original Assignee
Jeonyoung Co Ltd Ansan
Jeon Young Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR10-2002-0007084A external-priority patent/KR100453804B1/ko
Application filed by Jeonyoung Co Ltd Ansan, Jeon Young Chemical Co Ltd filed Critical Jeonyoung Co Ltd Ansan
Application granted granted Critical
Publication of DE60216291D1 publication Critical patent/DE60216291D1/de
Publication of DE60216291T2 publication Critical patent/DE60216291T2/de
Publication of DE60216291T8 publication Critical patent/DE60216291T8/de
Active legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
    • C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
    • C23G1/12—Light metals
    • C23G1/125—Light metals aluminium
DE60216291T 2001-07-25 2002-07-25 Oberflächenbehandlungsmittel und verfahren zum entfernen der beim ätzen von druckgussteilen aus aluminium anfallenden si komponente und reduzierten metallsalze Active DE60216291T8 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR2001044780 2001-07-25
KR20010044780 2001-07-25
KR2002007084 2002-02-07
KR10-2002-0007084A KR100453804B1 (ko) 2001-07-25 2002-02-07 알루미늄 다이캐스팅 소재의 에칭시 발생하는 규소성분 및환원성 금속염 제거를 위한 표면처리 조성물 및 처리방법
PCT/KR2002/001398 WO2003010271A1 (en) 2001-07-25 2002-07-25 Surface treatment composition and method for removing si component and reduced metal salt produced on the aluminum dicast material in etching process

Publications (3)

Publication Number Publication Date
DE60216291D1 DE60216291D1 (de) 2007-01-04
DE60216291T2 DE60216291T2 (de) 2007-06-21
DE60216291T8 true DE60216291T8 (de) 2007-10-18

Family

ID=26639258

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60216291T Active DE60216291T8 (de) 2001-07-25 2002-07-25 Oberflächenbehandlungsmittel und verfahren zum entfernen der beim ätzen von druckgussteilen aus aluminium anfallenden si komponente und reduzierten metallsalze

Country Status (6)

Country Link
US (1) US7405189B2 (de)
EP (1) EP1421164B1 (de)
JP (1) JP4285649B2 (de)
AT (1) ATE346132T1 (de)
DE (1) DE60216291T8 (de)
WO (1) WO2003010271A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101232340B (zh) * 2007-01-23 2012-10-03 华为技术有限公司 通信系统、方法、发送装置以及接收装置
US8226840B2 (en) 2008-05-02 2012-07-24 Micron Technology, Inc. Methods of removing silicon dioxide
CN102234513A (zh) * 2010-04-20 2011-11-09 深圳富泰宏精密工业有限公司 含钛膜层的退镀液及其使用方法
JP6367606B2 (ja) * 2013-09-09 2018-08-01 上村工業株式会社 無電解めっき用前処理剤、並びに前記無電解めっき用前処理剤を用いたプリント配線基板の前処理方法およびその製造方法
CN105551953B (zh) * 2016-02-01 2018-03-06 江苏辉伦太阳能科技有限公司 一种湿法化学刻蚀制备黑硅的方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3979241A (en) 1968-12-28 1976-09-07 Fujitsu Ltd. Method of etching films of silicon nitride and silicon dioxide
US3841905A (en) * 1970-11-19 1974-10-15 Rbp Chem Corp Method of preparing printed circuit boards with terminal tabs
US3990982A (en) * 1974-12-18 1976-11-09 Rbp Chemical Corporation Composition for stripping lead-tin solder
USRE29181E (en) * 1974-12-18 1977-04-12 Rbp Chemical Corporation Method of preparing printed circuit boards with terminal tabs
JPS55109498A (en) 1979-02-15 1980-08-22 Ichiro Kudo Silicic acid scale removing agent
CA1196560A (en) * 1981-11-24 1985-11-12 Gerardus A. Somers Metal stripping composition and process
JPS592748B2 (ja) * 1981-12-21 1984-01-20 三菱瓦斯化学株式会社 ニツケルおよびニツケル合金の化学的溶解処理方法
US4510018A (en) * 1984-02-21 1985-04-09 The Lea Manufacturing Company Solution and process for treating copper and copper alloys
JP3301662B2 (ja) * 1993-11-30 2002-07-15 ホーヤ株式会社 被覆層除去剤、基材の回収方法、及び被覆層を有する物品の製造方法
JPH09511262A (ja) * 1993-12-10 1997-11-11 アーマー オール プロダクツ コーポレイション 酸フッ化物塩を含むホイール洗浄組成物
JP3046208B2 (ja) * 1994-08-05 2000-05-29 新日本製鐵株式会社 シリコンウェハおよびシリコン酸化物の洗浄液
JP3689871B2 (ja) 1995-03-09 2005-08-31 関東化学株式会社 半導体基板用アルカリ性洗浄液
US5669980A (en) * 1995-03-24 1997-09-23 Atotech Usa, Inc. Aluminum desmut composition and process
JP4157185B2 (ja) 1997-02-26 2008-09-24 財団法人国際科学振興財団 洗浄液及び洗浄方法
US6551972B1 (en) 1997-07-10 2003-04-22 Merck Patent Gesellschaft Solutions for cleaning silicon semiconductors or silicon oxides
JP4224652B2 (ja) * 1999-03-08 2009-02-18 三菱瓦斯化学株式会社 レジスト剥離液およびそれを用いたレジストの剥離方法
KR100338764B1 (ko) 1999-09-20 2002-05-30 윤종용 반도체 기판의 오염 물질을 제거하기 위한 세정액 및 이를 이용한 세정방법
JP2002113431A (ja) * 2000-10-10 2002-04-16 Tokyo Electron Ltd 洗浄方法

Also Published As

Publication number Publication date
US7405189B2 (en) 2008-07-29
JP2004536963A (ja) 2004-12-09
JP4285649B2 (ja) 2009-06-24
ATE346132T1 (de) 2006-12-15
EP1421164B1 (de) 2006-11-22
US20040242445A1 (en) 2004-12-02
WO2003010271A1 (en) 2003-02-06
DE60216291T2 (de) 2007-06-21
DE60216291D1 (de) 2007-01-04
EP1421164A1 (de) 2004-05-26

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Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: JEONYOUNG CO., LTD., ANSAN, KYOUNGGI, KR

8381 Inventor (new situation)

Inventor name: LEE, EUL-KYU, KYOUNGGI, KR

8364 No opposition during term of opposition