DE60216291D1 - Oberflächenbehandlungsmittel und verfahren zum entfernen der beim ätzen von druckgussteilen aus aluminium anfallenden si komponente und reduzierten metallsalze - Google Patents
Oberflächenbehandlungsmittel und verfahren zum entfernen der beim ätzen von druckgussteilen aus aluminium anfallenden si komponente und reduzierten metallsalzeInfo
- Publication number
- DE60216291D1 DE60216291D1 DE60216291T DE60216291T DE60216291D1 DE 60216291 D1 DE60216291 D1 DE 60216291D1 DE 60216291 T DE60216291 T DE 60216291T DE 60216291 T DE60216291 T DE 60216291T DE 60216291 D1 DE60216291 D1 DE 60216291D1
- Authority
- DE
- Germany
- Prior art keywords
- surface treatment
- reduced metal
- aldc
- metal salt
- aldc material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G1/00—Cleaning or pickling metallic material with solutions or molten salts
- C23G1/02—Cleaning or pickling metallic material with solutions or molten salts with acid solutions
- C23G1/12—Light metals
- C23G1/125—Light metals aluminium
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Mold Materials And Core Materials (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2001044780 | 2001-07-25 | ||
KR20010044780 | 2001-07-25 | ||
KR2002007084 | 2002-02-07 | ||
KR10-2002-0007084A KR100453804B1 (ko) | 2001-07-25 | 2002-02-07 | 알루미늄 다이캐스팅 소재의 에칭시 발생하는 규소성분 및환원성 금속염 제거를 위한 표면처리 조성물 및 처리방법 |
PCT/KR2002/001398 WO2003010271A1 (en) | 2001-07-25 | 2002-07-25 | Surface treatment composition and method for removing si component and reduced metal salt produced on the aluminum dicast material in etching process |
Publications (3)
Publication Number | Publication Date |
---|---|
DE60216291D1 true DE60216291D1 (de) | 2007-01-04 |
DE60216291T2 DE60216291T2 (de) | 2007-06-21 |
DE60216291T8 DE60216291T8 (de) | 2007-10-18 |
Family
ID=26639258
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60216291T Active DE60216291T8 (de) | 2001-07-25 | 2002-07-25 | Oberflächenbehandlungsmittel und verfahren zum entfernen der beim ätzen von druckgussteilen aus aluminium anfallenden si komponente und reduzierten metallsalze |
Country Status (6)
Country | Link |
---|---|
US (1) | US7405189B2 (de) |
EP (1) | EP1421164B1 (de) |
JP (1) | JP4285649B2 (de) |
AT (1) | ATE346132T1 (de) |
DE (1) | DE60216291T8 (de) |
WO (1) | WO2003010271A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101232340B (zh) * | 2007-01-23 | 2012-10-03 | 华为技术有限公司 | 通信系统、方法、发送装置以及接收装置 |
US8226840B2 (en) | 2008-05-02 | 2012-07-24 | Micron Technology, Inc. | Methods of removing silicon dioxide |
CN102234513A (zh) * | 2010-04-20 | 2011-11-09 | 深圳富泰宏精密工业有限公司 | 含钛膜层的退镀液及其使用方法 |
JP6367606B2 (ja) * | 2013-09-09 | 2018-08-01 | 上村工業株式会社 | 無電解めっき用前処理剤、並びに前記無電解めっき用前処理剤を用いたプリント配線基板の前処理方法およびその製造方法 |
CN105551953B (zh) * | 2016-02-01 | 2018-03-06 | 江苏辉伦太阳能科技有限公司 | 一种湿法化学刻蚀制备黑硅的方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3979241A (en) | 1968-12-28 | 1976-09-07 | Fujitsu Ltd. | Method of etching films of silicon nitride and silicon dioxide |
US3841905A (en) * | 1970-11-19 | 1974-10-15 | Rbp Chem Corp | Method of preparing printed circuit boards with terminal tabs |
US3990982A (en) * | 1974-12-18 | 1976-11-09 | Rbp Chemical Corporation | Composition for stripping lead-tin solder |
USRE29181E (en) * | 1974-12-18 | 1977-04-12 | Rbp Chemical Corporation | Method of preparing printed circuit boards with terminal tabs |
JPS55109498A (en) | 1979-02-15 | 1980-08-22 | Ichiro Kudo | Silicic acid scale removing agent |
CA1196560A (en) * | 1981-11-24 | 1985-11-12 | Gerardus A. Somers | Metal stripping composition and process |
JPS592748B2 (ja) * | 1981-12-21 | 1984-01-20 | 三菱瓦斯化学株式会社 | ニツケルおよびニツケル合金の化学的溶解処理方法 |
US4510018A (en) * | 1984-02-21 | 1985-04-09 | The Lea Manufacturing Company | Solution and process for treating copper and copper alloys |
JP3301662B2 (ja) * | 1993-11-30 | 2002-07-15 | ホーヤ株式会社 | 被覆層除去剤、基材の回収方法、及び被覆層を有する物品の製造方法 |
JPH09511262A (ja) * | 1993-12-10 | 1997-11-11 | アーマー オール プロダクツ コーポレイション | 酸フッ化物塩を含むホイール洗浄組成物 |
JP3046208B2 (ja) * | 1994-08-05 | 2000-05-29 | 新日本製鐵株式会社 | シリコンウェハおよびシリコン酸化物の洗浄液 |
JP3689871B2 (ja) | 1995-03-09 | 2005-08-31 | 関東化学株式会社 | 半導体基板用アルカリ性洗浄液 |
US5669980A (en) * | 1995-03-24 | 1997-09-23 | Atotech Usa, Inc. | Aluminum desmut composition and process |
JP4157185B2 (ja) | 1997-02-26 | 2008-09-24 | 財団法人国際科学振興財団 | 洗浄液及び洗浄方法 |
US6551972B1 (en) | 1997-07-10 | 2003-04-22 | Merck Patent Gesellschaft | Solutions for cleaning silicon semiconductors or silicon oxides |
JP4224652B2 (ja) * | 1999-03-08 | 2009-02-18 | 三菱瓦斯化学株式会社 | レジスト剥離液およびそれを用いたレジストの剥離方法 |
KR100338764B1 (ko) | 1999-09-20 | 2002-05-30 | 윤종용 | 반도체 기판의 오염 물질을 제거하기 위한 세정액 및 이를 이용한 세정방법 |
JP2002113431A (ja) * | 2000-10-10 | 2002-04-16 | Tokyo Electron Ltd | 洗浄方法 |
-
2002
- 2002-07-25 EP EP02755927A patent/EP1421164B1/de not_active Expired - Lifetime
- 2002-07-25 WO PCT/KR2002/001398 patent/WO2003010271A1/en active IP Right Grant
- 2002-07-25 AT AT02755927T patent/ATE346132T1/de not_active IP Right Cessation
- 2002-07-25 US US10/484,868 patent/US7405189B2/en not_active Expired - Fee Related
- 2002-07-25 JP JP2003515624A patent/JP4285649B2/ja not_active Expired - Fee Related
- 2002-07-25 DE DE60216291T patent/DE60216291T8/de active Active
Also Published As
Publication number | Publication date |
---|---|
US7405189B2 (en) | 2008-07-29 |
DE60216291T8 (de) | 2007-10-18 |
JP2004536963A (ja) | 2004-12-09 |
JP4285649B2 (ja) | 2009-06-24 |
ATE346132T1 (de) | 2006-12-15 |
EP1421164B1 (de) | 2006-11-22 |
US20040242445A1 (en) | 2004-12-02 |
WO2003010271A1 (en) | 2003-02-06 |
DE60216291T2 (de) | 2007-06-21 |
EP1421164A1 (de) | 2004-05-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: JEONYOUNG CO., LTD., ANSAN, KYOUNGGI, KR |
|
8381 | Inventor (new situation) |
Inventor name: LEE, EUL-KYU, KYOUNGGI, KR |
|
8364 | No opposition during term of opposition |