DE60204848D1 - Anbringung eines optischen bauelements an einem kühlkörper - Google Patents
Anbringung eines optischen bauelements an einem kühlkörperInfo
- Publication number
- DE60204848D1 DE60204848D1 DE60204848T DE60204848T DE60204848D1 DE 60204848 D1 DE60204848 D1 DE 60204848D1 DE 60204848 T DE60204848 T DE 60204848T DE 60204848 T DE60204848 T DE 60204848T DE 60204848 D1 DE60204848 D1 DE 60204848D1
- Authority
- DE
- Germany
- Prior art keywords
- heatsink
- optically
- region
- active
- refrigerator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/16—Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface
- H01S5/162—Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface with window regions made by diffusion or disordening of the active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
- H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/16—Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface
- H01S5/164—Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface with window regions comprising semiconductor material with a wider bandgap than the active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Glass Compositions (AREA)
- Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
- Prostheses (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0101640A GB2371404B (en) | 2001-01-23 | 2001-01-23 | Improvements in or relating to optical devices |
GB0101640 | 2001-01-23 | ||
PCT/GB2002/000293 WO2002061898A1 (en) | 2001-01-23 | 2002-01-23 | Mounting of optical device on heat sink |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60204848D1 true DE60204848D1 (de) | 2005-08-04 |
DE60204848T2 DE60204848T2 (de) | 2006-05-11 |
Family
ID=9907274
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60204848T Expired - Lifetime DE60204848T2 (de) | 2001-01-23 | 2002-01-23 | Anbringung eines optischen bauelements an einem kühlkörper |
Country Status (9)
Country | Link |
---|---|
US (1) | US6671300B2 (de) |
EP (1) | EP1354381B1 (de) |
JP (1) | JP4027801B2 (de) |
CN (1) | CN1236534C (de) |
AT (1) | ATE298941T1 (de) |
DE (1) | DE60204848T2 (de) |
ES (1) | ES2246392T3 (de) |
GB (1) | GB2371404B (de) |
WO (1) | WO2002061898A1 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7333689B2 (en) * | 2005-09-30 | 2008-02-19 | The Trustees Of Princeton University | Photonic integrated devices having reduced absorption loss |
US20070218454A1 (en) * | 2006-03-16 | 2007-09-20 | Brennen Reid A | Optical detection cell for micro-fluidics |
US8647590B2 (en) * | 2006-03-16 | 2014-02-11 | Agilent Technologies, Inc. | Optical detection cell with micro-fluidic chip |
JP4697879B2 (ja) * | 2006-05-09 | 2011-06-08 | 東京エレクトロン株式会社 | サーバ装置、およびプログラム |
US7826693B2 (en) | 2006-10-26 | 2010-11-02 | The Trustees Of Princeton University | Monolithically integrated reconfigurable optical add-drop multiplexer |
US10203461B2 (en) * | 2015-09-04 | 2019-02-12 | Raytheon Company | Techniques for forming waveguides for use in laser systems or other systems and associated devices |
JP7458134B2 (ja) * | 2019-04-02 | 2024-03-29 | ヌヴォトンテクノロジージャパン株式会社 | 半導体レーザ素子 |
US11588302B2 (en) * | 2019-06-21 | 2023-02-21 | Seagate Technology Llc | Optical switches |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54115088A (en) | 1978-02-28 | 1979-09-07 | Nec Corp | Double hetero junction laser element of stripe type |
JPS6054794B2 (ja) * | 1979-11-01 | 1985-12-02 | 富士通株式会社 | 光半導体装置 |
US4511408A (en) | 1982-04-22 | 1985-04-16 | The Board Of Trustees Of The University Of Illinois | Semiconductor device fabrication with disordering elements introduced into active region |
US4594603A (en) | 1982-04-22 | 1986-06-10 | Board Of Trustees Of The University Of Illinois | Semiconductor device with disordered active region |
US4639275A (en) | 1982-04-22 | 1987-01-27 | The Board Of Trustees Of The University Of Illinois | Forming disordered layer by controlled diffusion in heterojunction III-V semiconductor |
US4585491A (en) | 1983-09-02 | 1986-04-29 | Xerox Corporation | Wavelength tuning of quantum well lasers by thermal annealing |
US4684653A (en) | 1985-03-08 | 1987-08-04 | The Trustees Of Princeton University | Pyrido(2,3-d)pyrimidine derivatives |
US4727556A (en) | 1985-12-30 | 1988-02-23 | Xerox Corporation | Semiconductor lasers fabricated from impurity induced disordering |
US4871690A (en) | 1986-01-21 | 1989-10-03 | Xerox Corporation | Semiconductor structures utilizing semiconductor support means selectively pretreated with migratory defects |
GB2198603A (en) | 1986-12-05 | 1988-06-15 | Philips Electronic Associated | Divider circuit |
US4857971A (en) | 1987-03-23 | 1989-08-15 | Xerox Corporation | (IV)x (III-V)1-x alloys formed in situ in III-V heterostructures |
DE3737191A1 (de) * | 1987-11-03 | 1989-05-24 | Fraunhofer Ges Forschung | Halbleiterdiodenlaser |
US5327444A (en) * | 1989-04-20 | 1994-07-05 | Massachusetts Institute Of Technology | Solid state waveguide lasers |
DE3925201A1 (de) * | 1989-07-29 | 1991-02-07 | Messerschmitt Boelkow Blohm | Optische bank zur halterung optischer, elektrischer u.a. komponenten |
JP2869279B2 (ja) * | 1992-09-16 | 1999-03-10 | 三菱電機株式会社 | 半導体レーザダイオード及びその製造方法並びに半導体レーザダイオードアレイ |
US5384797A (en) | 1992-09-21 | 1995-01-24 | Sdl, Inc. | Monolithic multi-wavelength laser diode array |
JPH07162086A (ja) * | 1993-12-10 | 1995-06-23 | Mitsubishi Electric Corp | 半導体レーザの製造方法 |
US5521406A (en) * | 1994-08-31 | 1996-05-28 | Texas Instruments Incorporated | Integrated circuit with improved thermal impedance |
JPH08330672A (ja) * | 1995-05-31 | 1996-12-13 | Nec Corp | 半導体レーザ装置 |
US5680412A (en) * | 1995-07-26 | 1997-10-21 | Demaria Electrooptics Systems, Inc. | Apparatus for improving the optical intensity induced damage limit of optical quality crystals |
EP0757393A3 (de) * | 1995-08-02 | 1999-11-03 | Matsushita Electric Industrial Co., Ltd. | Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren |
US6326646B1 (en) * | 1999-11-24 | 2001-12-04 | Lucent Technologies, Inc. | Mounting technology for intersubband light emitters |
-
2001
- 2001-01-23 GB GB0101640A patent/GB2371404B/en not_active Revoked
- 2001-02-20 US US09/789,046 patent/US6671300B2/en not_active Expired - Lifetime
-
2002
- 2002-01-23 CN CNB028040236A patent/CN1236534C/zh not_active Expired - Fee Related
- 2002-01-23 JP JP2002561333A patent/JP4027801B2/ja not_active Expired - Fee Related
- 2002-01-23 EP EP02716152A patent/EP1354381B1/de not_active Expired - Lifetime
- 2002-01-23 ES ES02716152T patent/ES2246392T3/es not_active Expired - Lifetime
- 2002-01-23 WO PCT/GB2002/000293 patent/WO2002061898A1/en active IP Right Grant
- 2002-01-23 AT AT02716152T patent/ATE298941T1/de not_active IP Right Cessation
- 2002-01-23 DE DE60204848T patent/DE60204848T2/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
CN1236534C (zh) | 2006-01-11 |
US20020097763A1 (en) | 2002-07-25 |
EP1354381B1 (de) | 2005-06-29 |
GB0101640D0 (en) | 2001-03-07 |
JP4027801B2 (ja) | 2007-12-26 |
JP2004523117A (ja) | 2004-07-29 |
ATE298941T1 (de) | 2005-07-15 |
GB2371404A (en) | 2002-07-24 |
EP1354381A1 (de) | 2003-10-22 |
CN1488182A (zh) | 2004-04-07 |
GB2371404B (en) | 2003-07-09 |
WO2002061898A1 (en) | 2002-08-08 |
ES2246392T3 (es) | 2006-02-16 |
US6671300B2 (en) | 2003-12-30 |
DE60204848T2 (de) | 2006-05-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
R082 | Change of representative |
Ref document number: 1354381 Country of ref document: EP Representative=s name: ANDRAE FLACH HAUG, 83022 ROSENHEIM, DE |