ATE298941T1 - Anbringung eines optischen bauelements an einem kühlkörper - Google Patents

Anbringung eines optischen bauelements an einem kühlkörper

Info

Publication number
ATE298941T1
ATE298941T1 AT02716152T AT02716152T ATE298941T1 AT E298941 T1 ATE298941 T1 AT E298941T1 AT 02716152 T AT02716152 T AT 02716152T AT 02716152 T AT02716152 T AT 02716152T AT E298941 T1 ATE298941 T1 AT E298941T1
Authority
AT
Austria
Prior art keywords
heatsink
optically
region
attaching
heat sink
Prior art date
Application number
AT02716152T
Other languages
English (en)
Inventor
Craig James Hamilton
John Haig Marsh
Original Assignee
Univ Glasgow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Univ Glasgow filed Critical Univ Glasgow
Application granted granted Critical
Publication of ATE298941T1 publication Critical patent/ATE298941T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/024Arrangements for thermal management
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/16Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface
    • H01S5/162Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface with window regions made by diffusion or disordening of the active layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0233Mounting configuration of laser chips
    • H01S5/0234Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/02Structural details or components not essential to laser action
    • H01S5/022Mountings; Housings
    • H01S5/0235Method for mounting laser chips
    • H01S5/02355Fixing laser chips on mounts
    • H01S5/0237Fixing laser chips on mounts by soldering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/10Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/16Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface
    • H01S5/164Window-type lasers, i.e. with a region of non-absorbing material between the active region and the reflecting surface with window regions comprising semiconductor material with a wider bandgap than the active layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/20Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
    • H01S5/22Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
  • Prostheses (AREA)
  • Glass Compositions (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)
AT02716152T 2001-01-23 2002-01-23 Anbringung eines optischen bauelements an einem kühlkörper ATE298941T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0101640A GB2371404B (en) 2001-01-23 2001-01-23 Improvements in or relating to optical devices
PCT/GB2002/000293 WO2002061898A1 (en) 2001-01-23 2002-01-23 Mounting of optical device on heat sink

Publications (1)

Publication Number Publication Date
ATE298941T1 true ATE298941T1 (de) 2005-07-15

Family

ID=9907274

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02716152T ATE298941T1 (de) 2001-01-23 2002-01-23 Anbringung eines optischen bauelements an einem kühlkörper

Country Status (9)

Country Link
US (1) US6671300B2 (de)
EP (1) EP1354381B1 (de)
JP (1) JP4027801B2 (de)
CN (1) CN1236534C (de)
AT (1) ATE298941T1 (de)
DE (1) DE60204848T2 (de)
ES (1) ES2246392T3 (de)
GB (1) GB2371404B (de)
WO (1) WO2002061898A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7333689B2 (en) * 2005-09-30 2008-02-19 The Trustees Of Princeton University Photonic integrated devices having reduced absorption loss
US20070218454A1 (en) * 2006-03-16 2007-09-20 Brennen Reid A Optical detection cell for micro-fluidics
US8647590B2 (en) * 2006-03-16 2014-02-11 Agilent Technologies, Inc. Optical detection cell with micro-fluidic chip
JP4697879B2 (ja) * 2006-05-09 2011-06-08 東京エレクトロン株式会社 サーバ装置、およびプログラム
US7826693B2 (en) 2006-10-26 2010-11-02 The Trustees Of Princeton University Monolithically integrated reconfigurable optical add-drop multiplexer
US10203461B2 (en) 2015-09-04 2019-02-12 Raytheon Company Techniques for forming waveguides for use in laser systems or other systems and associated devices
US11588302B2 (en) * 2019-06-21 2023-02-21 Seagate Technology Llc Optical switches

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54115088A (en) 1978-02-28 1979-09-07 Nec Corp Double hetero junction laser element of stripe type
JPS6054794B2 (ja) * 1979-11-01 1985-12-02 富士通株式会社 光半導体装置
US4511408A (en) 1982-04-22 1985-04-16 The Board Of Trustees Of The University Of Illinois Semiconductor device fabrication with disordering elements introduced into active region
US4594603A (en) 1982-04-22 1986-06-10 Board Of Trustees Of The University Of Illinois Semiconductor device with disordered active region
US4639275A (en) 1982-04-22 1987-01-27 The Board Of Trustees Of The University Of Illinois Forming disordered layer by controlled diffusion in heterojunction III-V semiconductor
US4585491A (en) 1983-09-02 1986-04-29 Xerox Corporation Wavelength tuning of quantum well lasers by thermal annealing
US4684653A (en) 1985-03-08 1987-08-04 The Trustees Of Princeton University Pyrido(2,3-d)pyrimidine derivatives
US4727556A (en) 1985-12-30 1988-02-23 Xerox Corporation Semiconductor lasers fabricated from impurity induced disordering
US4871690A (en) 1986-01-21 1989-10-03 Xerox Corporation Semiconductor structures utilizing semiconductor support means selectively pretreated with migratory defects
GB2198603A (en) 1986-12-05 1988-06-15 Philips Electronic Associated Divider circuit
US4857971A (en) 1987-03-23 1989-08-15 Xerox Corporation (IV)x (III-V)1-x alloys formed in situ in III-V heterostructures
DE3737191A1 (de) * 1987-11-03 1989-05-24 Fraunhofer Ges Forschung Halbleiterdiodenlaser
US5327444A (en) * 1989-04-20 1994-07-05 Massachusetts Institute Of Technology Solid state waveguide lasers
DE3925201A1 (de) * 1989-07-29 1991-02-07 Messerschmitt Boelkow Blohm Optische bank zur halterung optischer, elektrischer u.a. komponenten
JP2869279B2 (ja) * 1992-09-16 1999-03-10 三菱電機株式会社 半導体レーザダイオード及びその製造方法並びに半導体レーザダイオードアレイ
US5384797A (en) 1992-09-21 1995-01-24 Sdl, Inc. Monolithic multi-wavelength laser diode array
JPH07162086A (ja) * 1993-12-10 1995-06-23 Mitsubishi Electric Corp 半導体レーザの製造方法
US5521406A (en) * 1994-08-31 1996-05-28 Texas Instruments Incorporated Integrated circuit with improved thermal impedance
JPH08330672A (ja) * 1995-05-31 1996-12-13 Nec Corp 半導体レーザ装置
US5680412A (en) * 1995-07-26 1997-10-21 Demaria Electrooptics Systems, Inc. Apparatus for improving the optical intensity induced damage limit of optical quality crystals
EP0757393A3 (de) * 1995-08-02 1999-11-03 Matsushita Electric Industrial Co., Ltd. Lichtemittierende Halbleitervorrichtung und Herstellungsverfahren
US6326646B1 (en) * 1999-11-24 2001-12-04 Lucent Technologies, Inc. Mounting technology for intersubband light emitters

Also Published As

Publication number Publication date
ES2246392T3 (es) 2006-02-16
US6671300B2 (en) 2003-12-30
DE60204848T2 (de) 2006-05-11
CN1236534C (zh) 2006-01-11
GB2371404A (en) 2002-07-24
WO2002061898A1 (en) 2002-08-08
EP1354381A1 (de) 2003-10-22
GB0101640D0 (en) 2001-03-07
US20020097763A1 (en) 2002-07-25
GB2371404B (en) 2003-07-09
JP2004523117A (ja) 2004-07-29
JP4027801B2 (ja) 2007-12-26
EP1354381B1 (de) 2005-06-29
DE60204848D1 (de) 2005-08-04
CN1488182A (zh) 2004-04-07

Similar Documents

Publication Publication Date Title
ATE323296T1 (de) Optoelektronische erfassungseinrichtung
ATE316701T1 (de) Diodenlaserchip mit wellenleiter
WO2002005397A3 (en) Vcsel and vcsel array having integrated microlenses for use in a semiconductor laser pumped solid state laser system
DE60232350D1 (de) Halbleiternanokristall-verbundstoff
DE60232857D1 (de) Befestigen von schutzkappen auf wafer-ebene
DE69021237D1 (de) Laserdiode und optischer Kopf mit mehreren Strahlen, welcher die Laserdiode verwendet.
DE60116438D1 (de) Halbleiterlaservorrichtung und diese verwendende optische Abtastvorrichtung
ITMI20020963A1 (it) Procedimento e dispostivo per la marcatura di vetro con un laser
ATE300795T1 (de) Verbesserungen für laser
DE69432345T2 (de) Halbleiterdiodenlaser
DE60226803D1 (de) Laserstrahlhärtevorrichtung
ATE298941T1 (de) Anbringung eines optischen bauelements an einem kühlkörper
DE60234805D1 (de) Halbleiterlaser Vorrichtung und Faseroptischer Verstärker
DE60134911D1 (de) Halbleiterlaser mit verteilter Rückkopplung
EP1215776A3 (de) Lichtquelle mit einem Halbleiterasermodul
ATE280961T1 (de) Hochleistungs-superleuchtdiode mit einem gekrümmten mehrfachdurchgangs-wellenleiter
SE0100367D0 (sv) Method and device for passive alignment
ITTO20010321A0 (it) Procedimento per la trasmissione di messaggi sms con identita' protetta.
WO2003016963A3 (de) Anordnung und vorrichtung zur optischen strahlhomogenisierung
DE60212902D1 (de) Hochleistungshalbleiterdiodenlaser
ATE443334T1 (de) Optoelektronische pinzetten
AU2002243061A1 (en) Semiconductor quantum dot optical amplifier, and optical amplifier module and optical transmission system using the same
FR2784243B1 (fr) Amplificateur optique en semi-conducteur
DE69519286D1 (de) Halbleitervorrichtung
GB0101642D0 (en) Improvements in or relating to optical devices

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1354381

Country of ref document: EP

REN Ceased due to non-payment of the annual fee