DE602009000570D1 - Bildaufnahmevorrichtung - Google Patents

Bildaufnahmevorrichtung

Info

Publication number
DE602009000570D1
DE602009000570D1 DE200960000570 DE602009000570T DE602009000570D1 DE 602009000570 D1 DE602009000570 D1 DE 602009000570D1 DE 200960000570 DE200960000570 DE 200960000570 DE 602009000570 T DE602009000570 T DE 602009000570T DE 602009000570 D1 DE602009000570 D1 DE 602009000570D1
Authority
DE
Germany
Prior art keywords
image pickup
pixels
pickup device
obtaining
microlens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200960000570
Other languages
English (en)
Inventor
Kengo Hayasaka
Kenji Yamamoto
Isao Ichimura
Isao Hirota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of DE602009000570D1 publication Critical patent/DE602009000570D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G02B3/0056—Arrays characterized by the distribution or form of lenses arranged along two different directions in a plane, e.g. honeycomb arrangement of lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/0075—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 with means for altering, e.g. increasing, the depth of field or depth of focus
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/20—Filters
    • G02B5/201—Filters in the form of arrays
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B35/00—Stereoscopic photography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
DE200960000570 2008-11-21 2009-11-05 Bildaufnahmevorrichtung Active DE602009000570D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008298339 2008-11-21
JP2009113942A JP5472584B2 (ja) 2008-11-21 2009-05-08 撮像装置

Publications (1)

Publication Number Publication Date
DE602009000570D1 true DE602009000570D1 (de) 2011-02-24

Family

ID=41490351

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200960000570 Active DE602009000570D1 (de) 2008-11-21 2009-11-05 Bildaufnahmevorrichtung

Country Status (6)

Country Link
US (1) US8451352B2 (de)
EP (1) EP2190019B1 (de)
JP (1) JP5472584B2 (de)
CN (1) CN101738840B (de)
AT (1) ATE495550T1 (de)
DE (1) DE602009000570D1 (de)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422020B (zh) * 2008-12-08 2014-01-01 Sony Corp 固態成像裝置
KR20110040402A (ko) * 2009-10-14 2011-04-20 삼성전자주식회사 필터 어레이, 이를 포함하는 이미지 센서, 및 신호 보간 방법
JP2011223562A (ja) * 2010-03-23 2011-11-04 Fujifilm Corp 撮像装置
JP5461343B2 (ja) * 2010-08-24 2014-04-02 富士フイルム株式会社 撮像素子及び撮像装置
KR101590146B1 (ko) * 2010-08-24 2016-02-01 후지필름 가부시키가이샤 고체 촬상 장치
JP5406151B2 (ja) * 2010-09-24 2014-02-05 パナソニック株式会社 ３次元撮像装置
JP5406163B2 (ja) 2010-10-21 2014-02-05 パナソニック株式会社 ３次元撮像装置および画像処理装置
US20120147247A1 (en) * 2010-12-14 2012-06-14 Samsung Electronics Co., Ltd. Optical system and imaging apparatus including the same
JP5728928B2 (ja) * 2010-12-17 2015-06-03 株式会社ニコン 受光装置
CN103354997A (zh) 2011-02-18 2013-10-16 索尼公司 图像处理设备和图像处理方法
JP5954964B2 (ja) * 2011-02-18 2016-07-20 キヤノン株式会社 撮像装置およびその制御方法
CN103416067B (zh) * 2011-03-11 2014-10-29 富士胶片株式会社 摄像装置
EP2690875A4 (de) 2011-03-24 2014-11-05 Fujifilm Corp Farbbildsensor, bildgebungsvorrichtung und steuerprogramm für die bildgebungsvorrichtung
JP6041495B2 (ja) 2011-03-24 2016-12-07 キヤノン株式会社 撮像装置及び欠陥画素の判定方法
JP5490313B2 (ja) 2011-03-24 2014-05-14 富士フイルム株式会社 カラー撮像素子、撮像装置、及び撮像装置の制御プログラム
JP6259492B2 (ja) * 2011-03-24 2018-01-10 キヤノン株式会社 画像処理装置及び画像処理方法
TW201245768A (en) 2011-03-29 2012-11-16 Sony Corp Image pickup apparatus, image pickup device, image processing method, aperture control method, and program
CN103548335A (zh) * 2011-03-31 2014-01-29 富士胶片株式会社 固态成像元件、其驱动方法和成像装置
JP5903670B2 (ja) * 2011-04-07 2016-04-13 パナソニックＩｐマネジメント株式会社 ３次元撮像装置、画像処理装置、画像処理方法および画像処理プログラム
US8988512B2 (en) 2011-04-14 2015-03-24 Mediatek Inc. Method for adjusting playback of multimedia content according to detection result of user status and related apparatus thereof
JPWO2012161225A1 (ja) 2011-05-24 2014-07-31 ソニー株式会社 固体撮像素子およびカメラシステム
CN102209254B (zh) * 2011-05-30 2012-12-05 四川大学 一种一维集成成像方法和装置
JP2013055500A (ja) * 2011-09-02 2013-03-21 Sony Corp 固体撮像素子およびカメラシステム
JP5950520B2 (ja) * 2011-09-05 2016-07-13 キヤノン株式会社 光源装置
JP5864990B2 (ja) * 2011-10-03 2016-02-17 キヤノン株式会社 固体撮像装置およびカメラ
JP6019568B2 (ja) 2011-11-28 2016-11-02 ソニー株式会社 画像処理装置および方法、記録媒体、並びに、プログラム
US8854724B2 (en) 2012-03-27 2014-10-07 Ostendo Technologies, Inc. Spatio-temporal directional light modulator
US8928969B2 (en) 2011-12-06 2015-01-06 Ostendo Technologies, Inc. Spatio-optical directional light modulator
JP5917125B2 (ja) * 2011-12-16 2016-05-11 キヤノン株式会社 画像処理装置、画像処理方法、撮像装置および表示装置
EP2797312B1 (de) * 2011-12-21 2019-05-29 Sharp Kabushiki Kaisha Bildgebungsvorrichtung und elektronische informationsvorrichtung
WO2013100036A1 (ja) * 2011-12-27 2013-07-04 富士フイルム株式会社 カラー撮像素子
CN104025579B (zh) * 2011-12-27 2016-05-04 富士胶片株式会社 固体摄像装置
JP5589146B2 (ja) * 2011-12-28 2014-09-10 富士フイルム株式会社 撮像素子及び撮像装置
EP2806643A1 (de) 2012-01-16 2014-11-26 Sony Corporation Festkörperbildsensor und kamerasystem
WO2013114888A1 (ja) 2012-02-02 2013-08-08 パナソニック株式会社 撮像装置
JP5932626B2 (ja) * 2012-03-16 2016-06-08 本田技研工業株式会社 ３次元空間の粒子画像流速測定装置
WO2013145888A1 (ja) * 2012-03-28 2013-10-03 富士フイルム株式会社 固体撮像素子、撮像装置、及び固体撮像素子の駆動方法
KR20130112541A (ko) * 2012-04-04 2013-10-14 삼성전자주식회사 플레놉틱 카메라 장치
US9179126B2 (en) 2012-06-01 2015-11-03 Ostendo Technologies, Inc. Spatio-temporal light field cameras
JP5702894B2 (ja) 2012-07-06 2015-04-15 富士フイルム株式会社 カラー撮像素子および撮像装置
JP6071333B2 (ja) 2012-08-27 2017-02-01 キヤノン株式会社 画像処理装置、方法およびプログラム、並びに画像処理装置を有する撮像装置
JP6222908B2 (ja) * 2012-09-11 2017-11-01 キヤノン株式会社 画像処理装置、方法およびプログラム、並びに画像処理装置を有する撮像装置
JP6231741B2 (ja) 2012-12-10 2017-11-15 キヤノン株式会社 固体撮像装置およびその製造方法
KR20140094395A (ko) * 2013-01-22 2014-07-30 삼성전자주식회사 복수 개의 마이크로렌즈를 사용하여 촬영하는 촬영 장치 및 그 촬영 방법
DE112014000874T5 (de) 2013-02-18 2015-11-26 Sony Corporation Elektronische Vorrichtung, Verfahren zum Erzeugen eines Bildes und Filteranordnung
MY182329A (en) * 2013-05-17 2021-01-19 Panasonic Ip Corp America Thermal image sensor and user interface
JP6137941B2 (ja) * 2013-05-23 2017-05-31 キヤノン株式会社 画像処理システム、画像処理方法およびプログラム、並びに撮像装置
CN109120823B (zh) * 2013-08-01 2020-07-14 核心光电有限公司 具有自动聚焦的纤薄多孔径成像系统及其使用方法
EP2871830A1 (de) * 2013-11-08 2015-05-13 Thomson Licensing Optische Anordnung für plenoptische Kamera
US20150185308A1 (en) * 2014-01-02 2015-07-02 Katsuhiro Wada Image processing apparatus and image processing method, image pickup apparatus and control method thereof, and program
JP2015207815A (ja) * 2014-04-17 2015-11-19 キヤノン株式会社 撮像素子および撮像素子を備えた撮像装置
JP6545997B2 (ja) * 2015-04-24 2019-07-17 日立オートモティブシステムズ株式会社 画像処理装置
JP6579859B2 (ja) * 2015-08-11 2019-09-25 キヤノン株式会社 撮像装置、画像処理装置、画像処理方法およびプログラム
JP6746301B2 (ja) 2015-11-30 2020-08-26 キヤノン株式会社 撮像装置の駆動方法、撮像装置、撮像システム
WO2018170918A1 (en) * 2017-03-24 2018-09-27 Huawei Technologies Co., Ltd. Multi-camera system for low light
JP6526115B2 (ja) * 2017-07-13 2019-06-05 キヤノン株式会社 固体撮像装置
JP2019096988A (ja) * 2017-11-21 2019-06-20 日本放送協会 撮像デバイス、撮像装置、画像処理方法、およびプログラム
WO2020133193A1 (zh) * 2018-12-28 2020-07-02 合刃科技（深圳）有限公司 Hdr图像成像方法、装置及系统
CN114647092A (zh) * 2020-12-18 2022-06-21 深圳光峰科技股份有限公司 一种立体显示装置与立体投影显示系统
US11665330B2 (en) 2021-01-27 2023-05-30 Dell Products L.P. Dynamic-baseline imaging array with real-time spatial data capture and fusion

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3971065A (en) * 1975-03-05 1976-07-20 Eastman Kodak Company Color imaging array
US5076687A (en) * 1990-08-28 1991-12-31 Massachusetts Institute Of Technology Optical ranging apparatus
US5805217A (en) * 1996-06-14 1998-09-08 Iterated Systems, Inc. Method and system for interpolating missing picture elements in a single color component array obtained from a single color sensor
US20080079748A1 (en) * 1997-09-13 2008-04-03 Phan Gia C Image sensor and image data processing system
NO305728B1 (no) * 1997-11-14 1999-07-12 Reidar E Tangen Optoelektronisk kamera og fremgangsmÕte ved bildeformatering i samme
JPH11168688A (ja) * 1997-12-02 1999-06-22 Fuji Photo Film Co Ltd ディジタルカメラ装置ならびにその記録および／または再生処理方法
US6396873B1 (en) * 1999-02-25 2002-05-28 Envision Advanced Medical Systems Optical device
US7834927B2 (en) * 2001-08-22 2010-11-16 Florida Atlantic University Apparatus and method for producing video signals
US7593597B2 (en) * 2003-08-06 2009-09-22 Eastman Kodak Company Alignment of lens array images using autocorrelation
US7405761B2 (en) * 2003-10-01 2008-07-29 Tessera North America, Inc. Thin camera having sub-pixel resolution
US7911516B2 (en) * 2004-09-27 2011-03-22 Panasonic Corporation Camera module and electronic apparatus provided with it
CN100546345C (zh) * 2004-09-27 2009-09-30 松下电器产业株式会社 摄像机模组以及具有其的电子设备
KR101134208B1 (ko) 2004-10-01 2012-04-09 더 보드 어브 트러스티스 어브 더 리랜드 스탠포드 주니어 유니버시티 촬상 장치 및 그 방법
CN101426085B (zh) * 2004-10-01 2012-10-03 小利兰·斯坦福大学托管委员会 成像装置及其方法
JP2006211631A (ja) * 2004-12-27 2006-08-10 Sony Corp 固体撮像装置および撮像装置
JP4826152B2 (ja) * 2005-06-23 2011-11-30 株式会社ニコン 画像合成方法及び撮像装置
US7522341B2 (en) * 2005-07-12 2009-04-21 Micron Technology, Inc. Sharing of microlenses among pixels in image sensors
US7718940B2 (en) 2005-07-26 2010-05-18 Panasonic Corporation Compound-eye imaging apparatus
JP2007065330A (ja) * 2005-08-31 2007-03-15 Canon Inc カメラ
US7723662B2 (en) * 2005-10-07 2010-05-25 The Board Of Trustees Of The Leland Stanford Junior University Microscopy arrangements and approaches
JP4449936B2 (ja) * 2006-03-31 2010-04-14 ソニー株式会社 撮像装置、カメラシステムおよびその駆動方法
JP4915126B2 (ja) * 2006-04-10 2012-04-11 株式会社ニコン 固体撮像装置、および電子カメラ
JP5011814B2 (ja) * 2006-05-15 2012-08-29 ソニー株式会社 撮像装置、および画像処理方法、並びにコンピュータ・プログラム
JP5106870B2 (ja) * 2006-06-14 2012-12-26 株式会社東芝 固体撮像素子
JP5066851B2 (ja) * 2006-07-05 2012-11-07 株式会社ニコン 撮像装置
JP4826507B2 (ja) * 2007-02-27 2011-11-30 株式会社ニコン 焦点検出装置および撮像装置
JP5380782B2 (ja) * 2007-03-26 2014-01-08 株式会社ニコン 撮像装置
JP4715811B2 (ja) 2007-05-30 2011-07-06 パナソニック電工株式会社 加熱装置付きミスト発生装置
JP4967873B2 (ja) * 2007-07-13 2012-07-04 ソニー株式会社 撮像装置
JP2009113942A (ja) 2007-11-07 2009-05-28 Hokusho Co Ltd 垂直搬送機
US7962033B2 (en) * 2008-01-23 2011-06-14 Adobe Systems Incorporated Methods and apparatus for full-resolution light-field capture and rendering
JP5272565B2 (ja) * 2008-08-05 2013-08-28 株式会社ニコン 焦点検出装置および撮像装置

Also Published As

Publication number Publication date
JP2010154493A (ja) 2010-07-08
EP2190019A1 (de) 2010-05-26
ATE495550T1 (de) 2011-01-15
CN101738840B (zh) 2012-10-03
EP2190019B1 (de) 2011-01-12
US20100128152A1 (en) 2010-05-27
CN101738840A (zh) 2010-06-16
JP5472584B2 (ja) 2014-04-16
US8451352B2 (en) 2013-05-28

Similar Documents

Publication Publication Date Title
DE602009000570D1 (de) Bildaufnahmevorrichtung
EA201491372A1 (ru) Оптическая система формирования изображений и трехмерное дисплейное устройство
JP2009177727A5 (de)
JP2012191376A5 (de)
TW200710552A (en) Wide angle camera with prism array
RU2011149224A (ru) Устройство захвата изображения
EP1936955A3 (de) Bildsensor, Fokuserkennungsvorrichtung und Bildgebungsvorrichtung
JP2016521480A5 (ja) 装着型表示装置
WO2007092545A3 (en) Variable imaging arrangements and methods therefor
EP2083446A3 (de) Bildaufnahmevorrichtung
BRPI0925051A2 (pt) Sistema de geração de imagem digital , dispositivo óptico plenóptico e método de processamento de dados de imagem
EP2157801A3 (de) Bildaufnahmevorrichtung, Anzeige und Bildverarbeitungsvorrichtung
JP2015510586A5 (de)
JP2014048459A5 (de)
WO2006078537A3 (en) Apparatus and method for capturing still images and video using coded lens imaging techniques
EP2590400A3 (de) Vorrichtung eine Bildsensormatrix mit von mehreren Bildelementen geteilten globalen Verschluss beinhaltend
WO2008057278A3 (en) An integrated display having multiple capture devices
GB2497818B (en) Image reading apparatus
ATE530022T1 (de) Anzeigevorrichtung
EP2618554A3 (de) Bildsensoreinheit, Bildlesevorrichtung, Bilderzeugungsvorrichtung und Herstellungsverfahren
JP2012100204A5 (de)
JP2008071972A5 (de)
MY180913A (en) Imaging method, imaging device, and electronic device
JP2015152739A5 (de)
JP2008040087A5 (de)