DE602008002009D1 - Elektrostatische Klammer - Google Patents

Elektrostatische Klammer

Info

Publication number
DE602008002009D1
DE602008002009D1 DE602008002009T DE602008002009T DE602008002009D1 DE 602008002009 D1 DE602008002009 D1 DE 602008002009D1 DE 602008002009 T DE602008002009 T DE 602008002009T DE 602008002009 T DE602008002009 T DE 602008002009T DE 602008002009 D1 DE602008002009 D1 DE 602008002009D1
Authority
DE
Germany
Prior art keywords
electrostatic clamp
electrostatic
clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008002009T
Other languages
English (en)
Inventor
Ryuichi Handa
Akio Nakano
Ikuo Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of DE602008002009D1 publication Critical patent/DE602008002009D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE602008002009T 2007-04-26 2008-04-22 Elektrostatische Klammer Active DE602008002009D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007117411A JP5053696B2 (ja) 2007-04-26 2007-04-26 静電チャック

Publications (1)

Publication Number Publication Date
DE602008002009D1 true DE602008002009D1 (de) 2010-09-16

Family

ID=39739432

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008002009T Active DE602008002009D1 (de) 2007-04-26 2008-04-22 Elektrostatische Klammer

Country Status (4)

Country Link
US (1) US7940512B2 (de)
EP (1) EP1986228B1 (de)
JP (1) JP5053696B2 (de)
DE (1) DE602008002009D1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102132209B (zh) * 2008-08-21 2014-07-16 Asml控股股份有限公司 具有高热传导率的euv掩模版基底
US9520314B2 (en) * 2008-12-19 2016-12-13 Applied Materials, Inc. High temperature electrostatic chuck bonding adhesive
EP2434619B1 (de) * 2010-09-22 2018-11-14 General Electric Technology GmbH Anordnung von leiterstabenden
BR112013007656B1 (pt) * 2010-09-30 2020-08-25 Abb Schweiz Ag composição iniciadora de silicone, seus usos e seu método de produção
WO2012132691A1 (ja) * 2011-03-28 2012-10-04 日立化成工業株式会社 多層樹脂シート、樹脂シート積層体、多層樹脂シート硬化物及びその製造方法、金属箔付き多層樹脂シート、並びに半導体装置
WO2012147931A1 (ja) * 2011-04-27 2012-11-01 住友大阪セメント株式会社 静電チャック装置
US9916998B2 (en) 2012-12-04 2018-03-13 Applied Materials, Inc. Substrate support assembly having a plasma resistant protective layer
US9685356B2 (en) * 2012-12-11 2017-06-20 Applied Materials, Inc. Substrate support assembly having metal bonded protective layer
JP6140457B2 (ja) * 2013-01-21 2017-05-31 東京エレクトロン株式会社 接着方法、載置台及び基板処理装置
JP5890795B2 (ja) * 2013-03-18 2016-03-22 日本碍子株式会社 半導体製造装置用部材
JP6616607B2 (ja) 2015-07-14 2019-12-04 国立大学法人東京工業大学 静電アクチュエータおよび静電アクチュエータの製造方法
US10570257B2 (en) 2015-11-16 2020-02-25 Applied Materials, Inc. Copolymerized high temperature bonding component
US10020218B2 (en) 2015-11-17 2018-07-10 Applied Materials, Inc. Substrate support assembly with deposited surface features
EP3530709B1 (de) * 2016-10-14 2022-11-02 Shin-Etsu Chemical Co., Ltd. Wärmeleitende verbundsilikongummischicht und verfahren zur herstellung davon
US20190115241A1 (en) * 2017-10-12 2019-04-18 Applied Materials, Inc. Hydrophobic electrostatic chuck
JP7090481B2 (ja) * 2018-06-15 2022-06-24 新光電気工業株式会社 静電チャック及びその製造方法
US11373890B2 (en) * 2018-12-17 2022-06-28 Applied Materials, Inc. Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5964245A (ja) 1982-09-30 1984-04-12 Fujitsu Ltd 静電チヤツク
JP2634343B2 (ja) * 1991-10-28 1997-07-23 信越化学工業株式会社 半導体ウェーハの保持方法
JP3386831B2 (ja) * 1992-10-27 2003-03-17 ジーイー東芝シリコーン株式会社 フルオロシリコーンゴム組成物
JP3789586B2 (ja) * 1996-03-04 2006-06-28 信越化学工業株式会社 静電チャック
JP3172671B2 (ja) * 1996-03-19 2001-06-04 信越化学工業株式会社 静電チャック
JP2004031938A (ja) * 1996-03-04 2004-01-29 Shin Etsu Chem Co Ltd 静電チャック
JP3428836B2 (ja) * 1996-11-19 2003-07-22 信越化学工業株式会社 静電チャック
JPH10209256A (ja) * 1997-01-22 1998-08-07 Tomoegawa Paper Co Ltd 静電チャック装置およびその製造方法
US6166897A (en) 1997-01-22 2000-12-26 Tomoegawa Paper Co., Ltd. Static chuck apparatus and its manufacture
JPH11297804A (ja) * 1998-04-10 1999-10-29 Shin Etsu Chem Co Ltd 静電チャック
JP3611018B2 (ja) * 1999-06-23 2005-01-19 信越化学工業株式会社 フロロシリコーンゴム組成物
JP3599634B2 (ja) * 2000-04-10 2004-12-08 信越化学工業株式会社 イオン注入機用静電チャック
JP2002324834A (ja) * 2002-04-03 2002-11-08 Tomoegawa Paper Co Ltd 静電チャック装置、静電チャック用積層シート、および静電チャック用接着剤
JP2004269757A (ja) 2003-03-11 2004-09-30 Uchiyama Mfg Corp ガスケット用ゴム部材
EP1615972B1 (de) 2003-04-15 2009-11-11 Dow Corning Toray Co., Ltd. Wärmeleitende, additionsvernetzende, flüssige silikonkautschukmischung und beschichtete fixierwalze
JP4565491B2 (ja) * 2003-04-15 2010-10-20 東レ・ダウコーニング株式会社 熱伝導性付加硬化型液状シリコーンゴム組成物
JP2004352947A (ja) 2003-05-30 2004-12-16 Shin Etsu Chem Co Ltd 室温硬化型熱伝導性シリコーンゴム組成物
US20060079634A1 (en) 2003-05-30 2006-04-13 Shin-Etsu Chemical Co., Ltd. RTV heat conductive silicone rubber compositions
JP4386360B2 (ja) * 2004-12-06 2009-12-16 信越化学工業株式会社 静電チャック
JP4381393B2 (ja) * 2006-04-28 2009-12-09 信越化学工業株式会社 静電チャック

Also Published As

Publication number Publication date
JP5053696B2 (ja) 2012-10-17
JP2008277446A (ja) 2008-11-13
US7940512B2 (en) 2011-05-10
EP1986228A1 (de) 2008-10-29
EP1986228B1 (de) 2010-08-04
US20080266746A1 (en) 2008-10-30

Similar Documents

Publication Publication Date Title
DE602008002009D1 (de) Elektrostatische Klammer
BRPI0821573A2 (pt) benzofuropirimidonas
ATE501136T1 (de) Imidazopyridinone
ATE514696T1 (de) Diphenyl-dihydro-imidazopyridinone
DE602008002772D1 (de) Polyvinylpyrrolidonpulverzusammensetzungen
DE502007001207D1 (de) Elektrosaugkopf
DK2048424T3 (da) Klemme
BRPI0811451A2 (pt) Exopolissacarídeo
BRPI0814519A2 (pt) Organopolissiloxano
BRPI0812840A2 (pt) 2-imidazolinas
BRPI0815547A2 (pt) Depsipeptídeos cícliocos
AT505058A3 (de) Türschliesssystem
BRPI0812994A2 (pt) Microbiocidas
DE112008001216A5 (de) Magnetronplasmaanlage
DE502008001694D1 (de) Mitfahrhubwagen
BRPI0808929A2 (pt) Grampo de fixação
DE112008003094A5 (de) Geomatte
DE502008003063D1 (de) Magnetventilinjektor
DE112008002200A5 (de) Sperrsynchronisiervorrichtung
CU20090155A7 (es) Macrolidos
NO20071696L (no) Klemme
BRPI0907620A2 (pt) Abraçadeira
DE102007038931A8 (de) Fadenlagennähwirkstoffe
DE112008002909A5 (de) Verwahrbehältnis
DE502008000815D1 (de) Kraftfahrzeugsitzverstellantrieb