DE602008002009D1 - Elektrostatische Klammer - Google Patents
Elektrostatische KlammerInfo
- Publication number
- DE602008002009D1 DE602008002009D1 DE602008002009T DE602008002009T DE602008002009D1 DE 602008002009 D1 DE602008002009 D1 DE 602008002009D1 DE 602008002009 T DE602008002009 T DE 602008002009T DE 602008002009 T DE602008002009 T DE 602008002009T DE 602008002009 D1 DE602008002009 D1 DE 602008002009D1
- Authority
- DE
- Germany
- Prior art keywords
- electrostatic clamp
- electrostatic
- clamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007117411A JP5053696B2 (ja) | 2007-04-26 | 2007-04-26 | 静電チャック |
Publications (1)
Publication Number | Publication Date |
---|---|
DE602008002009D1 true DE602008002009D1 (de) | 2010-09-16 |
Family
ID=39739432
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602008002009T Active DE602008002009D1 (de) | 2007-04-26 | 2008-04-22 | Elektrostatische Klammer |
Country Status (4)
Country | Link |
---|---|
US (1) | US7940512B2 (de) |
EP (1) | EP1986228B1 (de) |
JP (1) | JP5053696B2 (de) |
DE (1) | DE602008002009D1 (de) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102132209B (zh) * | 2008-08-21 | 2014-07-16 | Asml控股股份有限公司 | 具有高热传导率的euv掩模版基底 |
US9520314B2 (en) * | 2008-12-19 | 2016-12-13 | Applied Materials, Inc. | High temperature electrostatic chuck bonding adhesive |
EP2434619B1 (de) * | 2010-09-22 | 2018-11-14 | General Electric Technology GmbH | Anordnung von leiterstabenden |
BR112013007656B1 (pt) * | 2010-09-30 | 2020-08-25 | Abb Schweiz Ag | composição iniciadora de silicone, seus usos e seu método de produção |
WO2012132691A1 (ja) * | 2011-03-28 | 2012-10-04 | 日立化成工業株式会社 | 多層樹脂シート、樹脂シート積層体、多層樹脂シート硬化物及びその製造方法、金属箔付き多層樹脂シート、並びに半導体装置 |
WO2012147931A1 (ja) * | 2011-04-27 | 2012-11-01 | 住友大阪セメント株式会社 | 静電チャック装置 |
US9916998B2 (en) | 2012-12-04 | 2018-03-13 | Applied Materials, Inc. | Substrate support assembly having a plasma resistant protective layer |
US9685356B2 (en) * | 2012-12-11 | 2017-06-20 | Applied Materials, Inc. | Substrate support assembly having metal bonded protective layer |
JP6140457B2 (ja) * | 2013-01-21 | 2017-05-31 | 東京エレクトロン株式会社 | 接着方法、載置台及び基板処理装置 |
JP5890795B2 (ja) * | 2013-03-18 | 2016-03-22 | 日本碍子株式会社 | 半導体製造装置用部材 |
JP6616607B2 (ja) | 2015-07-14 | 2019-12-04 | 国立大学法人東京工業大学 | 静電アクチュエータおよび静電アクチュエータの製造方法 |
US10570257B2 (en) | 2015-11-16 | 2020-02-25 | Applied Materials, Inc. | Copolymerized high temperature bonding component |
US10020218B2 (en) | 2015-11-17 | 2018-07-10 | Applied Materials, Inc. | Substrate support assembly with deposited surface features |
EP3530709B1 (de) * | 2016-10-14 | 2022-11-02 | Shin-Etsu Chemical Co., Ltd. | Wärmeleitende verbundsilikongummischicht und verfahren zur herstellung davon |
US20190115241A1 (en) * | 2017-10-12 | 2019-04-18 | Applied Materials, Inc. | Hydrophobic electrostatic chuck |
JP7090481B2 (ja) * | 2018-06-15 | 2022-06-24 | 新光電気工業株式会社 | 静電チャック及びその製造方法 |
US11373890B2 (en) * | 2018-12-17 | 2022-06-28 | Applied Materials, Inc. | Wireless in-situ real-time measurement of electrostatic chucking force in semiconductor wafer processing |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5964245A (ja) | 1982-09-30 | 1984-04-12 | Fujitsu Ltd | 静電チヤツク |
JP2634343B2 (ja) * | 1991-10-28 | 1997-07-23 | 信越化学工業株式会社 | 半導体ウェーハの保持方法 |
JP3386831B2 (ja) * | 1992-10-27 | 2003-03-17 | ジーイー東芝シリコーン株式会社 | フルオロシリコーンゴム組成物 |
JP3789586B2 (ja) * | 1996-03-04 | 2006-06-28 | 信越化学工業株式会社 | 静電チャック |
JP3172671B2 (ja) * | 1996-03-19 | 2001-06-04 | 信越化学工業株式会社 | 静電チャック |
JP2004031938A (ja) * | 1996-03-04 | 2004-01-29 | Shin Etsu Chem Co Ltd | 静電チャック |
JP3428836B2 (ja) * | 1996-11-19 | 2003-07-22 | 信越化学工業株式会社 | 静電チャック |
JPH10209256A (ja) * | 1997-01-22 | 1998-08-07 | Tomoegawa Paper Co Ltd | 静電チャック装置およびその製造方法 |
US6166897A (en) | 1997-01-22 | 2000-12-26 | Tomoegawa Paper Co., Ltd. | Static chuck apparatus and its manufacture |
JPH11297804A (ja) * | 1998-04-10 | 1999-10-29 | Shin Etsu Chem Co Ltd | 静電チャック |
JP3611018B2 (ja) * | 1999-06-23 | 2005-01-19 | 信越化学工業株式会社 | フロロシリコーンゴム組成物 |
JP3599634B2 (ja) * | 2000-04-10 | 2004-12-08 | 信越化学工業株式会社 | イオン注入機用静電チャック |
JP2002324834A (ja) * | 2002-04-03 | 2002-11-08 | Tomoegawa Paper Co Ltd | 静電チャック装置、静電チャック用積層シート、および静電チャック用接着剤 |
JP2004269757A (ja) | 2003-03-11 | 2004-09-30 | Uchiyama Mfg Corp | ガスケット用ゴム部材 |
EP1615972B1 (de) | 2003-04-15 | 2009-11-11 | Dow Corning Toray Co., Ltd. | Wärmeleitende, additionsvernetzende, flüssige silikonkautschukmischung und beschichtete fixierwalze |
JP4565491B2 (ja) * | 2003-04-15 | 2010-10-20 | 東レ・ダウコーニング株式会社 | 熱伝導性付加硬化型液状シリコーンゴム組成物 |
JP2004352947A (ja) | 2003-05-30 | 2004-12-16 | Shin Etsu Chem Co Ltd | 室温硬化型熱伝導性シリコーンゴム組成物 |
US20060079634A1 (en) | 2003-05-30 | 2006-04-13 | Shin-Etsu Chemical Co., Ltd. | RTV heat conductive silicone rubber compositions |
JP4386360B2 (ja) * | 2004-12-06 | 2009-12-16 | 信越化学工業株式会社 | 静電チャック |
JP4381393B2 (ja) * | 2006-04-28 | 2009-12-09 | 信越化学工業株式会社 | 静電チャック |
-
2007
- 2007-04-26 JP JP2007117411A patent/JP5053696B2/ja not_active Expired - Fee Related
-
2008
- 2008-04-22 DE DE602008002009T patent/DE602008002009D1/de active Active
- 2008-04-22 EP EP08251479A patent/EP1986228B1/de not_active Expired - Fee Related
- 2008-04-24 US US12/108,650 patent/US7940512B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP5053696B2 (ja) | 2012-10-17 |
JP2008277446A (ja) | 2008-11-13 |
US7940512B2 (en) | 2011-05-10 |
EP1986228A1 (de) | 2008-10-29 |
EP1986228B1 (de) | 2010-08-04 |
US20080266746A1 (en) | 2008-10-30 |
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