DE602006017214D1 - Optisches transpondermodul mit flexibler schaltung mit doppelter platte - Google Patents

Optisches transpondermodul mit flexibler schaltung mit doppelter platte

Info

Publication number
DE602006017214D1
DE602006017214D1 DE602006017214T DE602006017214T DE602006017214D1 DE 602006017214 D1 DE602006017214 D1 DE 602006017214D1 DE 602006017214 T DE602006017214 T DE 602006017214T DE 602006017214 T DE602006017214 T DE 602006017214T DE 602006017214 D1 DE602006017214 D1 DE 602006017214D1
Authority
DE
Germany
Prior art keywords
flexible circuit
transponder module
optical transponder
double plate
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602006017214T
Other languages
English (en)
Inventor
Marc Epitaux
Pete Kirkpatrick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of DE602006017214D1 publication Critical patent/DE602006017214D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
DE602006017214T 2005-06-27 2006-06-27 Optisches transpondermodul mit flexibler schaltung mit doppelter platte Active DE602006017214D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/168,179 US7309173B2 (en) 2005-06-27 2005-06-27 Optical transponder module with dual board flexible circuit
PCT/US2006/024891 WO2007002628A2 (en) 2005-06-27 2006-06-27 Optical transponder module with dual board flexible circuit

Publications (1)

Publication Number Publication Date
DE602006017214D1 true DE602006017214D1 (de) 2010-11-11

Family

ID=37067609

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602006017214T Active DE602006017214D1 (de) 2005-06-27 2006-06-27 Optisches transpondermodul mit flexibler schaltung mit doppelter platte

Country Status (7)

Country Link
US (1) US7309173B2 (de)
EP (1) EP1897255B1 (de)
JP (1) JP4700731B2 (de)
CN (1) CN1972157B (de)
AT (1) ATE483285T1 (de)
DE (1) DE602006017214D1 (de)
WO (1) WO2007002628A2 (de)

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US8083417B2 (en) * 2006-04-10 2011-12-27 Finisar Corporation Active optical cable electrical adaptor
US20080045534A1 (en) * 2006-08-18 2008-02-21 Valeant Pharmaceuticals North America Derivatives of 1,3-diamino benzene as potassium channel modulators
US8244124B2 (en) 2007-04-30 2012-08-14 Finisar Corporation Eye safety mechanism for use in optical cable with electrical interfaces
US7918611B2 (en) * 2007-07-11 2011-04-05 Emcore Corporation Reconfiguration and protocol adaptation of optoelectronic modules and network components
US8165471B2 (en) * 2008-04-14 2012-04-24 Cisco Technology, Inc. Form factor adapter module
US8459881B2 (en) * 2008-05-20 2013-06-11 Finisar Corporation Electromagnetic radiation containment in an optoelectronic module
US8057109B2 (en) * 2008-05-20 2011-11-15 Finisar Corporation Transceiver module with dual printed circuit boards
US8328435B2 (en) * 2008-05-20 2012-12-11 Finisar Corporation Printed circuit board positioning spacers in an optoelectronic module
US9112616B2 (en) * 2008-08-13 2015-08-18 Avago Technologies General Ip (Singapore) Pte. Ltd. Transceiver system on a card for simultaneously transmitting and receiving information at a rate equal to or greater than approximately one terabit per second
US8396370B2 (en) * 2008-11-26 2013-03-12 Avago Technologies Fiber Ip (Singapore) Pte. Ltd Parallel optical transceiver module that utilizes a folded flex circuit that reduces the module footprint and improves heat dissipation
US9081156B2 (en) * 2009-10-05 2015-07-14 Finisar Corporation Simplified and shortened parallel cable
EP2290860B1 (de) * 2009-08-06 2021-03-31 ADVA Optical Networking SE Steckumwandlungsmodul für eine Datentransportkarte eines Wellenlängenteilungs-Multiplexsystems
US8075199B2 (en) * 2009-09-10 2011-12-13 Cisco Technology, Inc. Form factor adapter module
US8391667B2 (en) * 2009-10-05 2013-03-05 Finisar Corporation Latching mechanism for a module
JP5839274B2 (ja) * 2011-11-11 2016-01-06 日立金属株式会社 光モジュール
US9042735B2 (en) * 2011-12-13 2015-05-26 Sumitomo Electric Industries, Ltd. Optical transceiver having an extra area in circuit board for mounting electronic circuits
JP5780148B2 (ja) * 2011-12-16 2015-09-16 富士通オプティカルコンポーネンツ株式会社 光送受信器、及び光送受信器の製造方法
JP5900133B2 (ja) * 2012-04-27 2016-04-06 日立金属株式会社 光モジュール
JP6017692B2 (ja) 2012-08-10 2016-11-02 フィニサー コーポレイション ラッチ機構用付勢アセンブリ
US9638876B2 (en) * 2013-08-02 2017-05-02 Fci Americas Technology Llc Opto-electrical transceiver module and active optical cable
US9549470B2 (en) 2013-09-27 2017-01-17 Exfo Inc. Transceiver module adapter device
EP3087558A4 (de) * 2013-12-26 2017-06-21 Intel Corporation Verfahren und vorrichtung für flexible elektronische kommunikationsvorrichtung
CN105137546B (zh) * 2015-09-17 2017-01-04 中国电子科技集团公司第八研究所 有源光缆连接器组件
US20180188460A1 (en) * 2017-01-05 2018-07-05 Versalume LLC Light Generating Apparatus
CN107046206B (zh) * 2017-01-23 2021-07-20 富士康(昆山)电脑接插件有限公司 电连接器
WO2022218045A1 (zh) * 2021-04-16 2022-10-20 青岛海信宽带多媒体技术有限公司 光模块
US12085770B2 (en) * 2021-10-13 2024-09-10 Electronics And Telecommunications Research Institute Optical submodule

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Also Published As

Publication number Publication date
JP2008544557A (ja) 2008-12-04
CN1972157A (zh) 2007-05-30
EP1897255B1 (de) 2010-09-29
JP4700731B2 (ja) 2011-06-15
WO2007002628A2 (en) 2007-01-04
WO2007002628A3 (en) 2007-03-29
US7309173B2 (en) 2007-12-18
CN1972157B (zh) 2011-08-03
ATE483285T1 (de) 2010-10-15
EP1897255A2 (de) 2008-03-12
US20060291785A1 (en) 2006-12-28

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