ATE483285T1 - Optisches transpondermodul mit flexibler schaltung mit doppelter platte - Google Patents

Optisches transpondermodul mit flexibler schaltung mit doppelter platte

Info

Publication number
ATE483285T1
ATE483285T1 AT06785617T AT06785617T ATE483285T1 AT E483285 T1 ATE483285 T1 AT E483285T1 AT 06785617 T AT06785617 T AT 06785617T AT 06785617 T AT06785617 T AT 06785617T AT E483285 T1 ATE483285 T1 AT E483285T1
Authority
AT
Austria
Prior art keywords
flexible circuit
transponder module
optical transponder
double plate
plate flexible
Prior art date
Application number
AT06785617T
Other languages
English (en)
Inventor
Marc Epitaux
Pete Kirkpatrick
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Application granted granted Critical
Publication of ATE483285T1 publication Critical patent/ATE483285T1/de

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
AT06785617T 2005-06-27 2006-06-27 Optisches transpondermodul mit flexibler schaltung mit doppelter platte ATE483285T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/168,179 US7309173B2 (en) 2005-06-27 2005-06-27 Optical transponder module with dual board flexible circuit
PCT/US2006/024891 WO2007002628A2 (en) 2005-06-27 2006-06-27 Optical transponder module with dual board flexible circuit

Publications (1)

Publication Number Publication Date
ATE483285T1 true ATE483285T1 (de) 2010-10-15

Family

ID=37067609

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06785617T ATE483285T1 (de) 2005-06-27 2006-06-27 Optisches transpondermodul mit flexibler schaltung mit doppelter platte

Country Status (7)

Country Link
US (1) US7309173B2 (de)
EP (1) EP1897255B1 (de)
JP (1) JP4700731B2 (de)
CN (1) CN1972157B (de)
AT (1) ATE483285T1 (de)
DE (1) DE602006017214D1 (de)
WO (1) WO2007002628A2 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7860398B2 (en) 2005-09-15 2010-12-28 Finisar Corporation Laser drivers for closed path optical cables
US8083417B2 (en) * 2006-04-10 2011-12-27 Finisar Corporation Active optical cable electrical adaptor
US20080045534A1 (en) * 2006-08-18 2008-02-21 Valeant Pharmaceuticals North America Derivatives of 1,3-diamino benzene as potassium channel modulators
US8244124B2 (en) 2007-04-30 2012-08-14 Finisar Corporation Eye safety mechanism for use in optical cable with electrical interfaces
US7918611B2 (en) * 2007-07-11 2011-04-05 Emcore Corporation Reconfiguration and protocol adaptation of optoelectronic modules and network components
US8165471B2 (en) * 2008-04-14 2012-04-24 Cisco Technology, Inc. Form factor adapter module
US8057109B2 (en) * 2008-05-20 2011-11-15 Finisar Corporation Transceiver module with dual printed circuit boards
US8459881B2 (en) * 2008-05-20 2013-06-11 Finisar Corporation Electromagnetic radiation containment in an optoelectronic module
US8328435B2 (en) * 2008-05-20 2012-12-11 Finisar Corporation Printed circuit board positioning spacers in an optoelectronic module
US9112616B2 (en) * 2008-08-13 2015-08-18 Avago Technologies General Ip (Singapore) Pte. Ltd. Transceiver system on a card for simultaneously transmitting and receiving information at a rate equal to or greater than approximately one terabit per second
US8396370B2 (en) * 2008-11-26 2013-03-12 Avago Technologies Fiber Ip (Singapore) Pte. Ltd Parallel optical transceiver module that utilizes a folded flex circuit that reduces the module footprint and improves heat dissipation
US9081156B2 (en) * 2009-10-05 2015-07-14 Finisar Corporation Simplified and shortened parallel cable
EP2290860B1 (de) * 2009-08-06 2021-03-31 ADVA Optical Networking SE Steckumwandlungsmodul für eine Datentransportkarte eines Wellenlängenteilungs-Multiplexsystems
US8075199B2 (en) * 2009-09-10 2011-12-13 Cisco Technology, Inc. Form factor adapter module
US8391667B2 (en) * 2009-10-05 2013-03-05 Finisar Corporation Latching mechanism for a module
JP5839274B2 (ja) * 2011-11-11 2016-01-06 日立金属株式会社 光モジュール
US9042735B2 (en) * 2011-12-13 2015-05-26 Sumitomo Electric Industries, Ltd. Optical transceiver having an extra area in circuit board for mounting electronic circuits
JP5780148B2 (ja) * 2011-12-16 2015-09-16 富士通オプティカルコンポーネンツ株式会社 光送受信器、及び光送受信器の製造方法
JP5900133B2 (ja) * 2012-04-27 2016-04-06 日立金属株式会社 光モジュール
WO2014026150A1 (en) 2012-08-10 2014-02-13 Finisar Corporation Biasing assembly for a latching mechanism
US9638876B2 (en) * 2013-08-02 2017-05-02 Fci Americas Technology Llc Opto-electrical transceiver module and active optical cable
US9549470B2 (en) 2013-09-27 2017-01-17 Exfo Inc. Transceiver module adapter device
EP3087558A4 (de) * 2013-12-26 2017-06-21 Intel Corporation Verfahren und vorrichtung für flexible elektronische kommunikationsvorrichtung
CN105137546B (zh) * 2015-09-17 2017-01-04 中国电子科技集团公司第八研究所 有源光缆连接器组件
US20180188460A1 (en) * 2017-01-05 2018-07-05 Versalume LLC Light Generating Apparatus
CN107046206B (zh) * 2017-01-23 2021-07-20 富士康(昆山)电脑接插件有限公司 电连接器
WO2022218045A1 (zh) * 2021-04-16 2022-10-20 青岛海信宽带多媒体技术有限公司 光模块
US20230115731A1 (en) * 2021-10-13 2023-04-13 Electronics And Telecommunications Research Institute Optical submodule

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08228059A (ja) * 1995-02-20 1996-09-03 Toshiba Corp 回路モジュールの実装装置およびこの回路モジュールを有する電子機器
US6350387B2 (en) * 1997-02-14 2002-02-26 Teledyne Industries, Inc. Multilayer combined rigid/flex printed circuit board containing flexible soldermask
KR100269947B1 (ko) 1997-09-13 2000-10-16 윤종용 인쇄회로기판및이를이용한엘씨디모듈
US6061249A (en) * 1997-11-12 2000-05-09 Ericsson Inc. Sealing system and method for sealing circuit card connection sites
JPH11177278A (ja) * 1997-12-09 1999-07-02 Hitachi Cable Ltd 論理機能付き光送受信モジュール
JPH11345987A (ja) * 1998-06-02 1999-12-14 Sony Corp 光リンク用送受信モジュール実装方法及びそのリジッド・フレキシブル基板
US6845184B1 (en) 1998-10-09 2005-01-18 Fujitsu Limited Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making
JP3712105B2 (ja) * 1999-11-25 2005-11-02 シャープ株式会社 フレキシブルビルドアップ多層プリント配線板の製造方法
GB0123475D0 (en) 2001-09-28 2001-11-21 Agilent Technologies Inc Flexible electrical interconnector for optical fibre transceivers
US6918179B2 (en) * 2002-04-10 2005-07-19 International Business Machines Corporation Method of deforming flexible cable sections extending between rigid printed circuit boards
JP2003324205A (ja) * 2002-05-02 2003-11-14 Shinko Electric Ind Co Ltd 光受信装置
JP2004047574A (ja) * 2002-07-09 2004-02-12 Sumitomo Electric Ind Ltd 多層配線基板、光トランシーバ、およびトランスポンダ
US7130194B2 (en) * 2002-10-31 2006-10-31 Finisar Corporation Multi-board optical transceiver
JP3759494B2 (ja) * 2002-12-12 2006-03-22 セイコーエプソン株式会社 光通信装置
JP2004241915A (ja) * 2003-02-04 2004-08-26 Sumitomo Electric Ind Ltd 光送受信モジュール、光送信モジュール及び光受信モジュール
US7156562B2 (en) * 2003-07-15 2007-01-02 National Semiconductor Corporation Opto-electronic module form factor having adjustable optical plane height
US7359641B2 (en) 2003-07-28 2008-04-15 Emcore Corporation Modular optical transceiver
JP4041048B2 (ja) * 2003-09-26 2008-01-30 山一電機株式会社 フレキシブル・リジッド型配線板およびその製造方法
DE10348675B3 (de) 2003-10-15 2005-06-09 Infineon Technologies Ag Modul für eine bidirektionale optische Signalübertragung
JP4534503B2 (ja) * 2004-01-30 2010-09-01 日立電線株式会社 光送受信モジュール
JP4461869B2 (ja) * 2004-03-25 2010-05-12 セイコーエプソン株式会社 電気光学装置及び電子機器
JP2006171398A (ja) * 2004-12-16 2006-06-29 Hitachi Cable Ltd 光伝送モジュール
US7153043B1 (en) * 2006-01-19 2006-12-26 Fiberxon, Inc. Optical transceiver having improved printed circuit board

Also Published As

Publication number Publication date
US20060291785A1 (en) 2006-12-28
WO2007002628A2 (en) 2007-01-04
DE602006017214D1 (de) 2010-11-11
CN1972157A (zh) 2007-05-30
EP1897255B1 (de) 2010-09-29
JP4700731B2 (ja) 2011-06-15
WO2007002628A3 (en) 2007-03-29
JP2008544557A (ja) 2008-12-04
EP1897255A2 (de) 2008-03-12
US7309173B2 (en) 2007-12-18
CN1972157B (zh) 2011-08-03

Similar Documents

Publication Publication Date Title
ATE483285T1 (de) Optisches transpondermodul mit flexibler schaltung mit doppelter platte
WO2009041771A3 (en) Optical interconnection system using optical waveguide-integrated optical printed circuit board
WO2008157143A3 (en) Edge connection structure for printed circuit boards
TW200712644A (en) Back-light module
WO2009143293A3 (en) Transceiver module with dual printed circuit boards
DE602005019375D1 (de) Wellenleiter- Leiterplatte Verbindung
TW200710507A (en) Light emitting diode module, backlight assembly and display device provided with the same
TW200709162A (en) Structure for circuit assembly
TW200636309A (en) An optical sub-assembly
TW200615656A (en) Light source module and panel shape light source device
TW200642174A (en) Board-to-board connector
DE502008001628D1 (de) Trägerelement mit Leuchtdiodeneinheiten
ATE550809T1 (de) Elektrisches steckverbindersystem mit reduzierten einrückkräften
EP2286468A4 (de) Indikator für oberflächenmontierte leiterplatte
TW200737109A (en) Display module
TW200833236A (en) Printed circuit board assembly, enclosure of information technology equipment, and information technology equipment
TW200942885A (en) Optoelectric interconnection module
WO2007081928A3 (en) 360 degree viewable light emitting apparatus
GB2460803A (en) Cable management system and method
WO2012030086A3 (en) Backlight unit
ATE429803T1 (de) Befestigungselement
TW200641582A (en) Low profile structure
EG24186A (en) Communication bus and electric panel comprising said bus
TW200603487A (en) Connecting design of a flexible circuit board
ATE555641T1 (de) Anordnung mit reduzierten abmessungen

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties