DE602005027743D1 - Laminat für flexible leiterplatten - Google Patents

Laminat für flexible leiterplatten

Info

Publication number
DE602005027743D1
DE602005027743D1 DE200560027743 DE602005027743T DE602005027743D1 DE 602005027743 D1 DE602005027743 D1 DE 602005027743D1 DE 200560027743 DE200560027743 DE 200560027743 DE 602005027743 T DE602005027743 T DE 602005027743T DE 602005027743 D1 DE602005027743 D1 DE 602005027743D1
Authority
DE
Germany
Prior art keywords
laminate
flexible pcb
pcb
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200560027743
Other languages
English (en)
Inventor
Tsuyoshi Iwasa
Atsushi Funaki
Yoshiaki Higuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of DE602005027743D1 publication Critical patent/DE602005027743D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18—Monomers containing fluorine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18—Monomers containing fluorine
    • C08F214/24—Trifluorochloroethene
    • C08F214/245—Trifluorochloroethene with non-fluorinated comonomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18—Monomers containing fluorine
    • C08F214/26—Tetrafluoroethene
    • C08F214/265—Tetrafluoroethene with non-fluorinated comonomers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/034—Organic insulating material consisting of one material containing halogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0278—Polymeric fibers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
DE200560027743 2004-12-20 2005-12-07 Laminat für flexible leiterplatten Active DE602005027743D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004367710 2004-12-20
PCT/JP2005/022494 WO2006067970A1 (ja) 2004-12-20 2005-12-07 フレキシブルプリント配線板用積層体

Publications (1)

Publication Number Publication Date
DE602005027743D1 true DE602005027743D1 (de) 2011-06-09

Family

ID=36601573

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200560027743 Active DE602005027743D1 (de) 2004-12-20 2005-12-07 Laminat für flexible leiterplatten

Country Status (7)

Country Link
US (1) US7476434B2 (de)
EP (1) EP1830613B1 (de)
JP (1) JP4816459B2 (de)
KR (1) KR101214419B1 (de)
CN (1) CN101080957B (de)
DE (1) DE602005027743D1 (de)
WO (1) WO2006067970A1 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5286669B2 (ja) * 2004-12-09 2013-09-11 旭硝子株式会社 プリント配線板用積層体
JP4607826B2 (ja) * 2006-06-28 2011-01-05 河村産業株式会社 アラミド−ポリエステル積層体
TWI461119B (zh) * 2009-01-20 2014-11-11 Toyoboseki Kabushikikaisha 多層氟樹脂膜及印刷配線板
KR101397247B1 (ko) * 2010-03-30 2014-06-27 코오롱인더스트리 주식회사 아라미드 복합재 및 그 제조방법
JP5981089B2 (ja) * 2010-08-23 2016-08-31 トヨタ自動車株式会社 コイル固定用絶縁樹脂シート、コイル固定用絶縁樹脂シートを用いたモータ用ステータおよびモータ用ステータの製造方法
US9392689B2 (en) 2010-10-25 2016-07-12 Daikin Industries, Ltd. Metal-clad laminate, method for producing same, and flexible printed board
WO2012057168A1 (ja) * 2010-10-29 2012-05-03 新日本製鐵株式会社 電磁鋼板及びその製造方法
JPWO2012161162A1 (ja) * 2011-05-23 2014-07-31 住友電工ファインポリマー株式会社 高周波回路基板
JP5884358B2 (ja) * 2011-09-22 2016-03-15 ダイキン工業株式会社 積層体、積層体の製造方法、平板、及び、被覆金属線
EP2818516B1 (de) * 2012-02-22 2020-11-04 AGC Inc. Fluorhaltige copolymerzusammensetzung, formkörper und elektrischer draht
JP2013201344A (ja) * 2012-03-26 2013-10-03 Sumitomo Electric Fine Polymer Inc フッ素樹脂基板
CN103635015A (zh) * 2012-08-28 2014-03-12 昆山雅森电子材料科技有限公司 高频基板结构及其制造方法
JP6235787B2 (ja) * 2013-03-29 2017-11-22 東レ・デュポン株式会社 高周波回路基板用カバーレイ
CN105339166B (zh) * 2013-05-31 2018-06-22 住友电气工业株式会社 金属-树脂复合体、配线材料、以及金属-树脂复合体的制造方法
EP3056343B1 (de) * 2013-10-11 2020-05-06 Sumitomo Electric Printed Circuits, Inc. Fluorharzbasismaterial, leiterplatte und schaltungsmodul
JP6517146B2 (ja) * 2013-11-01 2019-05-22 東レ・デュポン株式会社 グラファイト積層体
WO2015080260A1 (ja) * 2013-11-29 2015-06-04 旭硝子株式会社 接着フィルム及びフレキシブル金属積層板
JP6507607B2 (ja) * 2013-12-10 2019-05-08 Ａｇｃ株式会社 カバーレイ用接着フィルム、カバーレイ、配線板、及び電子機器の製造方法
US20150282299A1 (en) * 2014-04-01 2015-10-01 Xilinx, Inc. Thin profile metal trace to suppress skin effect and extend package interconnect bandwidth
WO2016017801A1 (ja) * 2014-08-01 2016-02-04 旭硝子株式会社 樹脂パウダー、その製造方法、複合体、成形体、セラミックス成形体の製造方法、金属積層板、プリント基板及びプリプレグ
JP6565936B2 (ja) * 2014-12-26 2019-08-28 Ａｇｃ株式会社 積層板およびフレキシブルプリント基板の製造方法
WO2016181936A1 (ja) 2015-05-11 2016-11-17 旭硝子株式会社 プリント基板用材料、金属積層板、それらの製造方法およびプリント基板の製造方法
TWI750132B (zh) * 2015-08-20 2021-12-21 日商Ａｇｃ股份有限公司 積層基材及其成形體之製造方法
KR102556333B1 (ko) * 2015-12-18 2023-07-17 (주)와이솔 표면 탄성파 웨이퍼 레벨 패키지 및 이를 위한 pcb 제작 방법
JP6722480B2 (ja) * 2016-03-16 2020-07-15 デュポン帝人アドバンスドペーパー株式会社 アラミド紙とポリイミドフィルムの積層体及びその製造方法
CN108925132B (zh) * 2016-04-11 2020-07-07 Ａｇｃ株式会社 层叠体、印刷基板和层叠体的制造方法
CN106671511B (zh) * 2016-12-28 2018-12-25 广东生益科技股份有限公司 双面挠性覆铜板及其制作方法
US20180269853A1 (en) * 2017-03-14 2018-09-20 Wisol Co., Ltd. Surface acoustic wave wafer level package and method of manufacturing pcb for the same
CN108666410A (zh) * 2017-03-28 2018-10-16 天津威盛电子有限公司 表面声波晶片级封装及其所用的pcb的制造方法
CN107666769A (zh) * 2017-09-29 2018-02-06 广东欧珀移动通信有限公司 一种移动终端及其双面电路板
KR102630306B1 (ko) 2017-10-31 2024-01-29 에이지씨 가부시키가이샤 성형체, 금속 피복 적층체, 프린트 배선판 및 그것들의 제조 방법
US11879041B2 (en) 2019-02-15 2024-01-23 Sumitomo Chemical Company, Limited Film and laminate
EP3998297A4 (de) * 2019-08-06 2023-12-06 Daikin Industries, Ltd. Fluorhaltiges polymer für metallkaschierte laminierte folie, zusammensetzung für metallkaschierte laminierte folie, härtbare zusammensetzung, metallkaschierte laminierte folie und bedrucktes substrat
TWI725538B (zh) 2019-09-04 2021-04-21 台燿科技股份有限公司 金屬箔積層板、印刷電路板、及金屬箔積層板之製法
CN116056892A (zh) 2020-08-12 2023-05-02 株式会社村田制作所 布线基板以及多层布线基板

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63290735A (ja) * 1987-05-22 1988-11-28 Matsushita Electric Works Ltd フレキシブル積層板
US4869956A (en) * 1987-08-20 1989-09-26 Olin Corporation Polymer/copper laminate and method for fabrication thereof
JPH02502804A (ja) * 1987-08-20 1990-09-06 オリン コーポレーション 新規のポリマー／金属ラミネートおよびその製造方法
JP2621950B2 (ja) * 1987-09-25 1997-06-18 三井東圧化学株式会社 フレキシブルな金属とプラスチックの積層板
JPH0555746A (ja) * 1991-08-29 1993-03-05 Hitachi Chem Co Ltd 高周波用銅張り積層板及びプリント配線板
JPH0725954A (ja) * 1993-07-09 1995-01-27 Asahi Glass Co Ltd 接着性弗素ゴムおよびそれを用いた積層体
EP0650987B1 (de) 1993-10-28 2010-04-28 Asahi Glass Company Ltd. Fluorid-enthaltender Polymerklebstoff und diesen gebrauchendes Laminat
JP3605861B2 (ja) * 1993-10-28 2004-12-22 旭硝子株式会社 接着性テトラフルオロエチレン−エチレン系共重合体の積層体およびその製造方法
JPH09201900A (ja) * 1995-11-24 1997-08-05 Mitsui Toatsu Chem Inc 積層体
AU3735797A (en) * 1996-06-26 1998-01-14 Park Electrochemical Corporation A process for producing polytetrafluoroethylene (ptfe) dielectric boards on metal plates
EP0911347B1 (de) * 1997-10-15 2006-08-23 E.I. Du Pont De Nemours And Company Copolymere aus Maleinsäure oder dessen Anhydrid und fluorierten Olefinen
JP2001301088A (ja) * 2000-04-24 2001-10-30 Jsr Corp 積層フィルムおよびその積層フィルムを用いたプリント基板
JP3590784B2 (ja) * 2001-08-02 2004-11-17 株式会社巴川製紙所 フッ素樹脂繊維紙を用いたプリント基板用銅張り板及びその製造方法
JP2003211545A (ja) * 2002-01-29 2003-07-29 Mitsui Chemicals Inc フレキシブル両面金属積層板の製造方法
JP4240201B2 (ja) 2002-02-22 2009-03-18 旭硝子株式会社 含フッ素共重合体
US6916544B2 (en) 2002-05-17 2005-07-12 E. I. Du Pont De Nemours And Company Laminate type materials for flexible circuits or similar-type assemblies and methods relating thereto
KR100602896B1 (ko) * 2002-06-04 2006-07-19 미쓰이 긴조꾸 고교 가부시키가이샤 저유전성 기재용 표면처리 동박과 그것을 사용한 동클래드적층판 및 프린트 배선판
EP1531164B1 (de) 2002-06-27 2006-09-27 Asahi Glass Company Ltd. Fluorocopolymer
JP4844788B2 (ja) * 2002-06-27 2011-12-28 旭硝子株式会社 含フッ素共重合体
JP2004128361A (ja) 2002-10-04 2004-04-22 Daikin Ind Ltd 帯電性部材、帯電性部材製造方法及びエレクトレットマイクロホン・アセンブリーの製造方法
JP4424246B2 (ja) 2004-10-28 2010-03-03 旭硝子株式会社 含フッ素共重合体及びその用途

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KR20070090198A (ko) 2007-09-05
US20080107866A1 (en) 2008-05-08
CN101080957A (zh) 2007-11-28
CN101080957B (zh) 2010-04-07
US7476434B2 (en) 2009-01-13
EP1830613B1 (de) 2011-04-27
EP1830613A4 (de) 2009-07-01
JPWO2006067970A1 (ja) 2008-06-12
WO2006067970A1 (ja) 2006-06-29
JP4816459B2 (ja) 2011-11-16
KR101214419B1 (ko) 2012-12-21

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