DE602005026579D1 - Klebstoff für schaltkreisverbindungen - Google Patents

Klebstoff für schaltkreisverbindungen

Info

Publication number
DE602005026579D1
DE602005026579D1 DE602005026579T DE602005026579T DE602005026579D1 DE 602005026579 D1 DE602005026579 D1 DE 602005026579D1 DE 602005026579 T DE602005026579 T DE 602005026579T DE 602005026579 T DE602005026579 T DE 602005026579T DE 602005026579 D1 DE602005026579 D1 DE 602005026579D1
Authority
DE
Germany
Prior art keywords
adhesive
circuit connections
connections
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602005026579T
Other languages
English (en)
Inventor
Hideaki Toshioka
Masamichi Yamamoto
Kazuhiro Kawabata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Publication of DE602005026579D1 publication Critical patent/DE602005026579D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)
DE602005026579T 2004-12-16 2005-12-02 Klebstoff für schaltkreisverbindungen Active DE602005026579D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004363757 2004-12-16
JP2005096886A JP5030196B2 (ja) 2004-12-16 2005-03-30 回路接続用接着剤
PCT/JP2005/022190 WO2006064678A1 (ja) 2004-12-16 2005-12-02 回路接続用接着剤

Publications (1)

Publication Number Publication Date
DE602005026579D1 true DE602005026579D1 (de) 2011-04-07

Family

ID=36587735

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602005026579T Active DE602005026579D1 (de) 2004-12-16 2005-12-02 Klebstoff für schaltkreisverbindungen

Country Status (8)

Country Link
US (1) US7588698B2 (de)
EP (1) EP1850351B1 (de)
JP (1) JP5030196B2 (de)
KR (1) KR101187953B1 (de)
CN (1) CN1950912B (de)
DE (1) DE602005026579D1 (de)
TW (1) TWI360821B (de)
WO (1) WO2006064678A1 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007091959A (ja) 2005-09-30 2007-04-12 Sumitomo Electric Ind Ltd 異方導電性接着剤
JP2008094908A (ja) * 2006-10-10 2008-04-24 Sumitomo Electric Ind Ltd 電極接続用接着剤
KR100787381B1 (ko) * 2006-11-16 2007-12-24 한국과학기술연구원 미세 캡슐-도전성 입자 복합체, 이의 제조 방법 및 이를이용한 이방 도전성 접착 필름
CN102010679B (zh) * 2007-01-10 2013-05-08 日立化成株式会社 电路部件连接用粘接剂及使用该粘接剂的半导体装置
CN101245227B (zh) * 2007-02-13 2010-09-08 核工业第八研究所 一种led用环氧导电银胶及其制造方法
KR100946589B1 (ko) * 2008-04-03 2010-03-09 엘지이노텍 주식회사 반도체 소자 제조용 접착 페이스트 조성물
EP2145929B1 (de) * 2008-07-18 2020-06-24 Evonik Operations GmbH Verfahren zur Herstellung redispergierbarer, oberflächenmodifizierter Siliciumdioxidpartikel
JP2010150362A (ja) * 2008-12-25 2010-07-08 Sumitomo Electric Ind Ltd フィルム状接着剤及び異方導電性接着剤
JP4816750B2 (ja) * 2009-03-13 2011-11-16 住友電気工業株式会社 プリント配線基板の接続方法
JP5519956B2 (ja) * 2009-05-20 2014-06-11 株式会社Ｎｂｃメッシュテック 導電性部材及びその製造方法
JP2011233633A (ja) * 2010-04-26 2011-11-17 Hitachi Chem Co Ltd 回路接続材料及び回路部材の接続体
JP5557324B2 (ja) * 2010-09-01 2014-07-23 信越化学工業株式会社 ダイボンド剤及び光半導体装置
CN103189464B (zh) * 2010-10-22 2015-11-25 日立化成株式会社 粘接剂组合物、半导体装置的制造方法以及半导体装置
JP5643623B2 (ja) 2010-12-02 2014-12-17 デクセリアルズ株式会社 異方性導電材料及びその製造方法
JP5712588B2 (ja) * 2010-12-07 2015-05-07 ウシオ電機株式会社 蛍光ランプおよびその製造方法
JP2012169263A (ja) * 2011-01-24 2012-09-06 Sekisui Chem Co Ltd 異方性導電材料、接続構造体の製造方法及び接続構造体
TW201308354A (zh) * 2011-07-07 2013-02-16 Hitachi Chemical Co Ltd 電路連接材料及電路基板的連接構造體
JP5842664B2 (ja) * 2012-02-23 2016-01-13 日立金属株式会社 熱硬化性接着剤組成物並びにそれを用いた耐熱接着フィルム、積層フィルム、配線フィルム及び多層配線フィルム
TWI500737B (zh) * 2013-05-06 2015-09-21 Chi Mei Corp 導電性接著劑
TWI653312B (zh) * 2014-03-11 2019-03-11 日商味之素股份有限公司 接著薄膜
JP6826362B2 (ja) * 2015-06-30 2021-02-03 リンテック株式会社 粘着シート
GB2563433A (en) * 2017-06-16 2018-12-19 Saralon Gmbh Method of attaching rigid printed circuit boards on a substrate
CN114350294B (zh) * 2021-04-09 2023-08-22 杭州安誉科技有限公司 一种线路板用导电胶膜的制备方法
KR102636170B1 (ko) * 2023-06-12 2024-02-15 오컴퍼니 주식회사 미니/마이크로 led용 접합 소재 조성물

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5964685A (ja) * 1982-10-05 1984-04-12 Shin Etsu Polymer Co Ltd 異方導電熱接着性フイルム
JP3540830B2 (ja) * 1994-01-31 2004-07-07 ナミックス株式会社 接着性組成物
JPH08176521A (ja) * 1994-12-26 1996-07-09 Showa Denko Kk 導電性接着剤
JP4178565B2 (ja) 1997-08-25 2008-11-12 日立化成工業株式会社 回路部材接続用接着剤
JP2000204324A (ja) 1999-01-08 2000-07-25 Nagase Chiba Kk エポキシ樹脂系シ―ト状接着剤組成物
KR100305750B1 (ko) * 1999-03-10 2001-09-24 윤덕용 플라스틱 기판의 플립 칩 접속용 이방성 전도성 접착제의 제조방법
US6372839B1 (en) * 1999-03-17 2002-04-16 Shin-Etsu Chemical Co., Ltd. Flip-chip type semiconductor device underfill
JP4807481B2 (ja) * 1999-05-27 2011-11-02 吉野化成株式会社 識別表示を有する粘着シートまたはテープ
TWI262795B (en) * 1999-05-31 2006-10-01 Kuraray Co Adhesive composition and method for producing it
JP4675456B2 (ja) * 1999-05-31 2011-04-20 株式会社クラレ 接着性の組成物
US7235192B2 (en) * 1999-12-01 2007-06-26 General Electric Company Capped poly(arylene ether) composition and method
KR100931744B1 (ko) * 2000-02-15 2009-12-14 히다치 가세고교 가부시끼가이샤 접착제 조성물, 그 제조 방법, 이것을 이용한 접착 필름, 반도체 탑재용 기판 및 반도체 장치
JP4667588B2 (ja) * 2000-12-06 2011-04-13 富士通株式会社 接着・封止用樹脂組成物
JP3897543B2 (ja) * 2001-06-01 2007-03-28 丸尾カルシウム株式会社 樹脂用表面処理無機フィラー及びこれを配合した樹脂組成物
CN1250663C (zh) * 2001-06-25 2006-04-12 泰勒弗氏股份有限公司 具有增强粘度的各向异性导电粘合剂及使用它的粘接方法和集成电路封装件
JP2004033952A (ja) 2002-07-04 2004-02-05 Komatsu Ltd 水熱反応処理装置における反応容器からの塩の排出方法、水熱反応処理装置
CN101232128B (zh) * 2003-06-25 2010-12-08 日立化成工业株式会社 电路连接材料、电路构件的连接结构及其制造方法
JP2004339520A (ja) * 2004-05-31 2004-12-02 Sony Chem Corp 熱硬化性接着材料

Also Published As

Publication number Publication date
TW200631040A (en) 2006-09-01
CN1950912B (zh) 2010-05-05
JP2006196850A (ja) 2006-07-27
EP1850351A1 (de) 2007-10-31
KR101187953B1 (ko) 2012-10-04
US7588698B2 (en) 2009-09-15
JP5030196B2 (ja) 2012-09-19
EP1850351A4 (de) 2009-06-03
US20070215838A1 (en) 2007-09-20
WO2006064678A1 (ja) 2006-06-22
EP1850351B1 (de) 2011-02-23
KR20070089766A (ko) 2007-09-03
TWI360821B (en) 2012-03-21
CN1950912A (zh) 2007-04-18

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