DE602005024208D1 - Dielektrisches Element, piezoelektrisches Element, Tintenstrahlkopf, Tintenstrahlaufzeichnungsgerät sowie deren Herstellungsverfahren - Google Patents

Dielektrisches Element, piezoelektrisches Element, Tintenstrahlkopf, Tintenstrahlaufzeichnungsgerät sowie deren Herstellungsverfahren

Info

Publication number
DE602005024208D1
DE602005024208D1 DE200560024208 DE602005024208T DE602005024208D1 DE 602005024208 D1 DE602005024208 D1 DE 602005024208D1 DE 200560024208 DE200560024208 DE 200560024208 DE 602005024208 T DE602005024208 T DE 602005024208T DE 602005024208 D1 DE602005024208 D1 DE 602005024208D1
Authority
DE
Germany
Prior art keywords
ink jet
production method
recording device
piezoelectric element
jet recording
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE200560024208
Other languages
German (de)
English (en)
Inventor
Kenichi Takeda
Toshihiro Ifuku
Tetsuro Fukui
Hiroshi Funakubo
Shoji Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of DE602005024208D1 publication Critical patent/DE602005024208D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/87Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877Conductive materials
    • H10N30/878Conductive materials the principal material being non-metallic, e.g. oxide or carbon based
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/06Forming electrodes or interconnections, e.g. leads or terminals
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/01Manufacture or treatment
    • H10N30/07Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/074Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
    • H10N30/076Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/80Constructional details
    • H10N30/85Piezoelectric or electrostrictive active materials
    • H10N30/853Ceramic compositions
    • H10N30/8548Lead-based oxides
    • H10N30/8554Lead-zirconium titanate [PZT] based
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047Membrane type

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Chemical Vapour Deposition (AREA)
  • Ceramic Capacitors (AREA)
  • Semiconductor Memories (AREA)
  • Physical Vapour Deposition (AREA)
DE200560024208 2004-03-29 2005-03-23 Dielektrisches Element, piezoelektrisches Element, Tintenstrahlkopf, Tintenstrahlaufzeichnungsgerät sowie deren Herstellungsverfahren Expired - Lifetime DE602005024208D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004094597 2004-03-29

Publications (1)

Publication Number Publication Date
DE602005024208D1 true DE602005024208D1 (de) 2010-12-02

Family

ID=34909426

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200560024208 Expired - Lifetime DE602005024208D1 (de) 2004-03-29 2005-03-23 Dielektrisches Element, piezoelektrisches Element, Tintenstrahlkopf, Tintenstrahlaufzeichnungsgerät sowie deren Herstellungsverfahren

Country Status (7)

Country Link
US (1) US7265483B2 (https=)
EP (1) EP1585180B1 (https=)
JP (2) JP2005313628A (https=)
KR (1) KR100777468B1 (https=)
CN (1) CN100418768C (https=)
DE (1) DE602005024208D1 (https=)
TW (1) TWI253392B (https=)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060000542A1 (en) * 2004-06-30 2006-01-05 Yongki Min Metal oxide ceramic thin film on base metal electrode
US7497962B2 (en) * 2004-08-06 2009-03-03 Canon Kabushiki Kaisha Method of manufacturing liquid discharge head and method of manufacturing substrate for liquid discharge head
US7290315B2 (en) * 2004-10-21 2007-11-06 Intel Corporation Method for making a passive device structure
US7629269B2 (en) * 2005-03-31 2009-12-08 Intel Corporation High-k thin film grain size control
US20060220177A1 (en) * 2005-03-31 2006-10-05 Palanduz Cengiz A Reduced porosity high-k thin film mixed grains for thin film capacitor applications
US7375412B1 (en) * 2005-03-31 2008-05-20 Intel Corporation iTFC with optimized C(T)
US7453144B2 (en) * 2005-06-29 2008-11-18 Intel Corporation Thin film capacitors and methods of making the same
JP5188076B2 (ja) * 2006-04-03 2013-04-24 キヤノン株式会社 圧電素子及びその製造方法、電子デバイス、インクジェット装置
JP2008258516A (ja) * 2007-04-09 2008-10-23 Funai Electric Co Ltd 圧電素子及び結晶質セラミックスの成膜方法
KR100901201B1 (ko) * 2008-02-22 2009-06-08 서울시립대학교 산학협력단 초음파 스피커용 세슘디옥사이드가 첨가된피에스엔-피지티 세라믹스의 제조방법
JP2010137485A (ja) * 2008-12-15 2010-06-24 Seiko Epson Corp 液体噴射ヘッド、液体噴射装置及びアクチュエーター装置並びに液体噴射ヘッドの製造方法
WO2010084711A1 (ja) * 2009-01-20 2010-07-29 パナソニック株式会社 圧電体薄膜とその製造方法、インクジェットヘッド、インクジェットヘッドを用いて画像を形成する方法、角速度センサ、角速度センサを用いて角速度を測定する方法、圧電発電素子ならびに圧電発電素子を用いた発電方法
JP5527527B2 (ja) 2010-03-12 2014-06-18 セイコーエプソン株式会社 液体噴射ヘッド及び液体噴射装置
TWI450426B (zh) * 2010-09-09 2014-08-21 Microjet Technology Co Ltd 壓電致動模組及其所適用之壓電噴墨頭之製造方法
CN103210515B (zh) * 2010-09-15 2015-06-03 株式会社理光 机电转换器件及其制造方法及液滴排出头和液滴排出设备
JP5743059B2 (ja) * 2011-01-19 2015-07-01 セイコーエプソン株式会社 液体噴射ヘッド、液体噴射装置、圧電素子、超音波センサー及び赤外線センサー
JP6020784B2 (ja) * 2011-01-19 2016-11-02 セイコーエプソン株式会社 圧電素子、液体噴射ヘッド、液体噴射装置、超音波デバイス及びセンサー
JP5743060B2 (ja) * 2011-01-19 2015-07-01 セイコーエプソン株式会社 液体噴射ヘッド、液体噴射装置、圧電素子、超音波センサー及び赤外線センサー
JP5751407B2 (ja) * 2011-01-19 2015-07-22 セイコーエプソン株式会社 液体噴射ヘッド、液体噴射装置、圧電素子、超音波センサー及び赤外線センサー
CN102136315B (zh) * 2011-03-21 2012-08-15 四川师范大学 多层陶瓷全面积LNO/Ag/LNO复合电极及制备方法
JP5783252B2 (ja) * 2011-07-29 2015-09-24 株式会社村田製作所 弾性波デバイスの製造方法
JP5836754B2 (ja) * 2011-10-04 2015-12-24 富士フイルム株式会社 圧電体素子及びその製造方法
US8866367B2 (en) 2011-10-17 2014-10-21 The United States Of America As Represented By The Secretary Of The Army Thermally oxidized seed layers for the production of {001} textured electrodes and PZT devices and method of making
US9761785B2 (en) 2011-10-17 2017-09-12 The United States Of America As Represented By The Secretary Of The Army Stylo-epitaxial piezoelectric and ferroelectric devices and method of manufacturing
US10387824B2 (en) * 2012-12-21 2019-08-20 United Parcel Service Of America, Inc. Systems and methods for delivery of an item
JP5382196B2 (ja) * 2012-12-27 2014-01-08 セイコーエプソン株式会社 液体吐出ヘッドの製造方法
JP6123992B2 (ja) * 2013-03-05 2017-05-10 セイコーエプソン株式会社 液体噴射ヘッド、液体噴射装置、圧電素子及びその製造方法
JP6142597B2 (ja) * 2013-03-18 2017-06-07 株式会社リコー 圧電体薄膜素子および該圧電体薄膜素子の製造方法、並びに圧電アクチュエータ、液滴吐出ヘッドおよび液滴吐出装置
JP5528612B1 (ja) * 2013-07-09 2014-06-25 Roca株式会社 半導体装置
JP2015033799A (ja) 2013-08-09 2015-02-19 セイコーエプソン株式会社 液体噴射ヘッド、および、液体噴射装置
EP2942804B1 (en) 2014-05-08 2017-07-12 Flosfia Inc. Crystalline multilayer structure and semiconductor device
CN104505146B (zh) * 2014-11-20 2017-02-22 北京工业大学 一种具有纳米核壳及内晶型结构的介电复合材料及制备方法
EP3458270A4 (en) * 2016-09-26 2020-01-01 Hewlett-Packard Development Company, L.P. THIN FILM STACK
CN108400020B (zh) * 2018-03-06 2020-10-30 云南大学 一类层状钙钛矿型纳米氧化物的超级电容器电极材料
US11302618B2 (en) * 2018-04-09 2022-04-12 Intel Corporation Microelectronic assemblies having substrate-integrated perovskite layers
WO2020066713A1 (ja) * 2018-09-28 2020-04-02 日本碍子株式会社 センサ素子
CN113226887B (zh) 2019-04-29 2024-05-28 惠普发展公司,有限责任合伙企业 耐腐蚀微机电流体喷射器件
EP3877184A4 (en) * 2019-04-29 2022-06-15 Hewlett-Packard Development Company, L.P. MANUFACTURING OF A CORROSION TOLERANT MICROELECTRO-MECHANICAL FLUID EJECTION DEVICE
US12308365B2 (en) 2021-06-21 2025-05-20 Samsung Electronics Co., Ltd. Thin film structure including method of manufacturing

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3104550B2 (ja) 1994-10-17 2000-10-30 松下電器産業株式会社 圧電アクチュエータおよびその製造方法
WO1997001854A1 (en) * 1995-06-28 1997-01-16 Bell Communication Research, Inc. Barrier layer for ferroelectric capacitor integrated on silicon
JP3435966B2 (ja) * 1996-03-13 2003-08-11 株式会社日立製作所 強誘電体素子とその製造方法
JP3347010B2 (ja) * 1997-01-30 2002-11-20 株式会社東芝 薄膜誘電体素子
JP3684059B2 (ja) * 1998-01-07 2005-08-17 株式会社東芝 半導体装置
JP3109485B2 (ja) * 1998-08-03 2000-11-13 日本電気株式会社 金属酸化物誘電体膜の気相成長方法
JP3817729B2 (ja) * 2001-11-08 2006-09-06 セイコーエプソン株式会社 圧電アクチュエータ及び液体吐出ヘッド
JP4099818B2 (ja) 2001-12-10 2008-06-11 セイコーエプソン株式会社 圧電アクチュエータ及びインクジェット式記録ヘッド
JP3817730B2 (ja) * 2001-12-10 2006-09-06 セイコーエプソン株式会社 圧電アクチュエータの製造方法、インクジェット式記録ヘッド、及びプリンタ
KR100581257B1 (ko) * 2001-12-18 2006-05-22 마쯔시다덴기산교 가부시키가이샤 압전소자, 잉크젯헤드, 각속도센서 및 이들의 제조방법,그리고 잉크젯방식 기록장치
JP3902023B2 (ja) 2002-02-19 2007-04-04 セイコーエプソン株式会社 圧電アクチュエータ、液滴噴射ヘッド、およびそれを用いた液滴噴射装置
JP2004006722A (ja) * 2002-03-27 2004-01-08 Seiko Epson Corp 圧電アクチュエータ、インクジェット式ヘッド及び吐出装置
CN100421275C (zh) 2002-05-15 2008-09-24 精工爱普生株式会社 压电致动器及液体喷头
JP2003347618A (ja) * 2002-05-28 2003-12-05 Matsushita Electric Ind Co Ltd 圧電素子、インクジェットヘッド及びこれらの製造方法、並びにインクジェット式記録装置
US6969157B2 (en) 2002-05-31 2005-11-29 Matsushita Electric Industrial Co., Ltd. Piezoelectric element, ink jet head, angular velocity sensor, method for manufacturing the same, and ink jet recording apparatus
US7083270B2 (en) * 2002-06-20 2006-08-01 Matsushita Electric Industrial Co., Ltd. Piezoelectric element, ink jet head, angular velocity sensor, method for manufacturing the same, and ink jet recording apparatus
JP4178888B2 (ja) 2002-09-04 2008-11-12 セイコーエプソン株式会社 強誘電体デバイスの作製方法、およびそれを用いた強誘電体メモリ、圧電素子、インクジェット式ヘッドおよびインクジェットプリンタ
JP4457587B2 (ja) * 2002-09-05 2010-04-28 セイコーエプソン株式会社 電子デバイス用基体の製造方法及び電子デバイスの製造方法
JP3873935B2 (ja) * 2003-06-18 2007-01-31 セイコーエプソン株式会社 強誘電体メモリ素子
JP4165347B2 (ja) * 2003-06-25 2008-10-15 セイコーエプソン株式会社 圧電素子の製造方法

Also Published As

Publication number Publication date
TW200602195A (en) 2006-01-16
EP1585180A3 (en) 2007-10-03
JP2011192975A (ja) 2011-09-29
CN1676331A (zh) 2005-10-05
CN100418768C (zh) 2008-09-17
US20050213020A1 (en) 2005-09-29
US7265483B2 (en) 2007-09-04
JP2005313628A (ja) 2005-11-10
EP1585180B1 (en) 2010-10-20
KR20060044810A (ko) 2006-05-16
TWI253392B (en) 2006-04-21
KR100777468B1 (ko) 2007-11-20
EP1585180A2 (en) 2005-10-12

Similar Documents

Publication Publication Date Title
DE602005024208D1 (de) Dielektrisches Element, piezoelektrisches Element, Tintenstrahlkopf, Tintenstrahlaufzeichnungsgerät sowie deren Herstellungsverfahren
DE602005002060D1 (de) Piezoelektrisches Element und dessen Herstellungsverfahren sowie Tintenstrahldruckkopf und -aufzeichnungsgerät mit demselben
DE60325919D1 (de) Piezoelektrisches Element, Tintenstrahlkopf, Winkelgeschwindigkeitssensor, deren Herstellungsverfahren sowie Tintenstrahlaufzeichnungsgerät
DE602006015009D1 (de) Piezoelektrischer Tintenstrahldruckkopf und dazugehöriges Herstellungsverfahren
TWI318933B (en) Manufacturing method for ink jet recording head chip, and manufacturing method for ink jet recording head
DE60303623D1 (de) Tintenstrahlaufzeichnungsverfahren
DE602004005080D1 (de) Tintenausstossverfahren und Tintenstrahldruckkopf dafür
DE602005013876D1 (de) Piezoelektrischer Tintenstrahldruckkopf und Herstellungsverfahren dafür
DE602006001310D1 (de) Piezoelektrisches Element, Flüssigkeitstrahlkopf und -gerät
DE60304399D1 (de) Tintenstrahltinte und Tintenstrahlaufzeichnungsverfahren
DE602004009135D1 (de) Tintenstrahldrucker, Tintenstrahlkopf und Verfarhen zur Tintenstrahlkopfsherstellung
DE602005013684D1 (de) Aufzeichnungstinte, tintenpatrone, tintenstrahlaufzeichnungsvorrichtung, tintenstrahlaufzeichnungsverfahren und tintenaufzeichnung
DE602004012502D1 (de) Tröpfchenausstosskopf und Tintenstrahlaufzeichnungsgerät
DE60321642D1 (de) Tintenstrahldrucker undTintenstrahlaufzeichnungsverfahren
DE602006008083D1 (de) Piezoelektrischer Aktuator mit Herstellungsverfahren und Tintenstrahlaufzeichnungskopf
DE602005000785D1 (de) Piezoelektrischer Betätiger für Tintenstrahldruckkopf und dazugehöriges Herstellungsverfahren
DE60327142D1 (de) Flüssigkeitsausstosskopf, damit versehenes Bildaufzeichnungsgerät und dazugehöriges Herstellungsverfahren
DE60325818D1 (de) Piezoelektrisches Bauelement, Tintenstrahlkopf, sowie Verfahren zur Herstellung des piezoelektrischen Bauelementes
DE602006003102D1 (de) Piezoelektrischer Tintenstrahldruckkopf und Herstellungsverfahren dafür
DE602005007284D1 (de) Tintenstrahlkopfsteuerung, Tintenstrahlkopfsteuerverfahren und Tintenstrahlaufzeichnungsgerät
DE602004010215D1 (de) Tintenstrahldruckkopf und dazugehöriges Überprüfungsverfahren
DE602004003297D1 (de) Tintenstrahlkopf und dazugehöriges Herstellungsverfahren
DE602004027525D1 (de) Piezoelektrisches element, tintenstrahlkopf damit und herstellungsverfahren dafür
DE602004014845D1 (de) Tintenstrahldruckkopf und dazugehöriges Herstellungsverfahren
DE602006000805D1 (de) Tintenstrahlaufzeichnungsgerät und Tintenstrahlaufzeichnungsverfahren