EP1456757B1
(de)
*
|
2001-12-20 |
2010-08-04 |
TELEFONAKTIEBOLAGET LM ERICSSON (publ) |
Adressendecodierungsschema ohne kostenfaktor
|
JP4419049B2
(ja)
*
|
2003-04-21 |
2010-02-24 |
エルピーダメモリ株式会社 |
メモリモジュール及びメモリシステム
|
KR20050022798A
(ko)
*
|
2003-08-30 |
2005-03-08 |
주식회사 이즈텍 |
유전자 어휘 분류체계를 이용하여 바이오 칩을 분석하기위한 시스템 및 그 방법
|
US8250295B2
(en)
|
2004-01-05 |
2012-08-21 |
Smart Modular Technologies, Inc. |
Multi-rank memory module that emulates a memory module having a different number of ranks
|
US7289386B2
(en)
*
|
2004-03-05 |
2007-10-30 |
Netlist, Inc. |
Memory module decoder
|
US7916574B1
(en)
|
2004-03-05 |
2011-03-29 |
Netlist, Inc. |
Circuit providing load isolation and memory domain translation for memory module
|
US7532537B2
(en)
*
|
2004-03-05 |
2009-05-12 |
Netlist, Inc. |
Memory module with a circuit providing load isolation and memory domain translation
|
US7590796B2
(en)
*
|
2006-07-31 |
2009-09-15 |
Metaram, Inc. |
System and method for power management in memory systems
|
US7392338B2
(en)
*
|
2006-07-31 |
2008-06-24 |
Metaram, Inc. |
Interface circuit system and method for autonomously performing power management operations in conjunction with a plurality of memory circuits
|
US8081474B1
(en)
|
2007-12-18 |
2011-12-20 |
Google Inc. |
Embossed heat spreader
|
US8041881B2
(en)
|
2006-07-31 |
2011-10-18 |
Google Inc. |
Memory device with emulated characteristics
|
US8386722B1
(en)
|
2008-06-23 |
2013-02-26 |
Google Inc. |
Stacked DIMM memory interface
|
US8111566B1
(en)
|
2007-11-16 |
2012-02-07 |
Google, Inc. |
Optimal channel design for memory devices for providing a high-speed memory interface
|
US8327104B2
(en)
|
2006-07-31 |
2012-12-04 |
Google Inc. |
Adjusting the timing of signals associated with a memory system
|
US8090897B2
(en)
|
2006-07-31 |
2012-01-03 |
Google Inc. |
System and method for simulating an aspect of a memory circuit
|
US7472220B2
(en)
*
|
2006-07-31 |
2008-12-30 |
Metaram, Inc. |
Interface circuit system and method for performing power management operations utilizing power management signals
|
US8335894B1
(en)
|
2008-07-25 |
2012-12-18 |
Google Inc. |
Configurable memory system with interface circuit
|
US9171585B2
(en)
|
2005-06-24 |
2015-10-27 |
Google Inc. |
Configurable memory circuit system and method
|
US8438328B2
(en)
|
2008-02-21 |
2013-05-07 |
Google Inc. |
Emulation of abstracted DIMMs using abstracted DRAMs
|
US20080028136A1
(en)
|
2006-07-31 |
2008-01-31 |
Schakel Keith R |
Method and apparatus for refresh management of memory modules
|
US20080082763A1
(en)
|
2006-10-02 |
2008-04-03 |
Metaram, Inc. |
Apparatus and method for power management of memory circuits by a system or component thereof
|
US8089795B2
(en)
|
2006-02-09 |
2012-01-03 |
Google Inc. |
Memory module with memory stack and interface with enhanced capabilities
|
US7386656B2
(en)
|
2006-07-31 |
2008-06-10 |
Metaram, Inc. |
Interface circuit system and method for performing power management operations in conjunction with only a portion of a memory circuit
|
US8060774B2
(en)
|
2005-06-24 |
2011-11-15 |
Google Inc. |
Memory systems and memory modules
|
US10013371B2
(en)
|
2005-06-24 |
2018-07-03 |
Google Llc |
Configurable memory circuit system and method
|
US8397013B1
(en)
|
2006-10-05 |
2013-03-12 |
Google Inc. |
Hybrid memory module
|
US8055833B2
(en)
|
2006-10-05 |
2011-11-08 |
Google Inc. |
System and method for increasing capacity, performance, and flexibility of flash storage
|
US9542352B2
(en)
|
2006-02-09 |
2017-01-10 |
Google Inc. |
System and method for reducing command scheduling constraints of memory circuits
|
US8130560B1
(en)
|
2006-11-13 |
2012-03-06 |
Google Inc. |
Multi-rank partial width memory modules
|
US8796830B1
(en)
|
2006-09-01 |
2014-08-05 |
Google Inc. |
Stackable low-profile lead frame package
|
US8077535B2
(en)
|
2006-07-31 |
2011-12-13 |
Google Inc. |
Memory refresh apparatus and method
|
US9507739B2
(en)
|
2005-06-24 |
2016-11-29 |
Google Inc. |
Configurable memory circuit system and method
|
US8169233B2
(en)
|
2009-06-09 |
2012-05-01 |
Google Inc. |
Programming of DIMM termination resistance values
|
US8244971B2
(en)
|
2006-07-31 |
2012-08-14 |
Google Inc. |
Memory circuit system and method
|
US8359187B2
(en)
|
2005-06-24 |
2013-01-22 |
Google Inc. |
Simulating a different number of memory circuit devices
|
US7327592B2
(en)
*
|
2005-08-30 |
2008-02-05 |
Micron Technology, Inc. |
Self-identifying stacked die semiconductor components
|
GB2444663B
(en)
*
|
2005-09-02 |
2011-12-07 |
Metaram Inc |
Methods and apparatus of stacking drams
|
US7930492B2
(en)
*
|
2005-09-12 |
2011-04-19 |
Samsung Electronics Co., Ltd. |
Memory system having low power consumption
|
US7966446B2
(en)
*
|
2005-09-12 |
2011-06-21 |
Samsung Electronics Co., Ltd. |
Memory system and method having point-to-point link
|
DE102005046997B4
(de)
*
|
2005-09-30 |
2013-02-21 |
Qimonda Ag |
Vorrichtung zum Speichern von Speicherwörtern
|
US9632929B2
(en)
|
2006-02-09 |
2017-04-25 |
Google Inc. |
Translating an address associated with a command communicated between a system and memory circuits
|
US7564735B2
(en)
*
|
2006-07-05 |
2009-07-21 |
Qimonda Ag |
Memory device, and method for operating a memory device
|
US7724589B2
(en)
|
2006-07-31 |
2010-05-25 |
Google Inc. |
System and method for delaying a signal communicated from a system to at least one of a plurality of memory circuits
|
US9262326B2
(en)
*
|
2006-08-14 |
2016-02-16 |
Qualcomm Incorporated |
Method and apparatus to enable the cooperative signaling of a shared bus interrupt in a multi-rank memory subsystem
|
US7840732B2
(en)
*
|
2006-09-25 |
2010-11-23 |
Honeywell International Inc. |
Stacked card address assignment
|
JP5040306B2
(ja)
*
|
2006-12-28 |
2012-10-03 |
富士通株式会社 |
記憶制御装置及び記憶制御方法
|
KR100906999B1
(ko)
*
|
2007-06-11 |
2009-07-08 |
주식회사 하이닉스반도체 |
메모리 모듈 및 메모리 시스템
|
US8209479B2
(en)
|
2007-07-18 |
2012-06-26 |
Google Inc. |
Memory circuit system and method
|
US7861014B2
(en)
|
2007-08-31 |
2010-12-28 |
International Business Machines Corporation |
System for supporting partial cache line read operations to a memory module to reduce read data traffic on a memory channel
|
US7840748B2
(en)
|
2007-08-31 |
2010-11-23 |
International Business Machines Corporation |
Buffered memory module with multiple memory device data interface ports supporting double the memory capacity
|
US7584308B2
(en)
*
|
2007-08-31 |
2009-09-01 |
International Business Machines Corporation |
System for supporting partial cache line write operations to a memory module to reduce write data traffic on a memory channel
|
US8086936B2
(en)
|
2007-08-31 |
2011-12-27 |
International Business Machines Corporation |
Performing error correction at a memory device level that is transparent to a memory channel
|
US8082482B2
(en)
|
2007-08-31 |
2011-12-20 |
International Business Machines Corporation |
System for performing error correction operations in a memory hub device of a memory module
|
US7818497B2
(en)
|
2007-08-31 |
2010-10-19 |
International Business Machines Corporation |
Buffered memory module supporting two independent memory channels
|
US7899983B2
(en)
|
2007-08-31 |
2011-03-01 |
International Business Machines Corporation |
Buffered memory module supporting double the memory device data width in the same physical space as a conventional memory module
|
US7865674B2
(en)
|
2007-08-31 |
2011-01-04 |
International Business Machines Corporation |
System for enhancing the memory bandwidth available through a memory module
|
US7558887B2
(en)
*
|
2007-09-05 |
2009-07-07 |
International Business Machines Corporation |
Method for supporting partial cache line read and write operations to a memory module to reduce read and write data traffic on a memory channel
|
US8019919B2
(en)
|
2007-09-05 |
2011-09-13 |
International Business Machines Corporation |
Method for enhancing the memory bandwidth available through a memory module
|
US8080874B1
(en)
|
2007-09-14 |
2011-12-20 |
Google Inc. |
Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween
|
US7930470B2
(en)
|
2008-01-24 |
2011-04-19 |
International Business Machines Corporation |
System to enable a memory hub device to manage thermal conditions at a memory device level transparent to a memory controller
|
US7925824B2
(en)
|
2008-01-24 |
2011-04-12 |
International Business Machines Corporation |
System to reduce latency by running a memory channel frequency fully asynchronous from a memory device frequency
|
US7925825B2
(en)
|
2008-01-24 |
2011-04-12 |
International Business Machines Corporation |
System to support a full asynchronous interface within a memory hub device
|
US7930469B2
(en)
|
2008-01-24 |
2011-04-19 |
International Business Machines Corporation |
System to provide memory system power reduction without reducing overall memory system performance
|
US7770077B2
(en)
|
2008-01-24 |
2010-08-03 |
International Business Machines Corporation |
Using cache that is embedded in a memory hub to replace failed memory cells in a memory subsystem
|
US7925826B2
(en)
|
2008-01-24 |
2011-04-12 |
International Business Machines Corporation |
System to increase the overall bandwidth of a memory channel by allowing the memory channel to operate at a frequency independent from a memory device frequency
|
US8140936B2
(en)
|
2008-01-24 |
2012-03-20 |
International Business Machines Corporation |
System for a combined error correction code and cyclic redundancy check code for a memory channel
|
US7948786B2
(en)
*
|
2008-02-06 |
2011-05-24 |
Micron Technology, Inc. |
Rank select using a global select pin
|
KR101471574B1
(ko)
|
2008-04-10 |
2014-12-24 |
삼성전자주식회사 |
반도체 칩과 반도체 장치
|
US8154901B1
(en)
|
2008-04-14 |
2012-04-10 |
Netlist, Inc. |
Circuit providing load isolation and noise reduction
|
US8787060B2
(en)
|
2010-11-03 |
2014-07-22 |
Netlist, Inc. |
Method and apparatus for optimizing driver load in a memory package
|
US8516185B2
(en)
|
2009-07-16 |
2013-08-20 |
Netlist, Inc. |
System and method utilizing distributed byte-wise buffers on a memory module
|
US8417870B2
(en)
*
|
2009-07-16 |
2013-04-09 |
Netlist, Inc. |
System and method of increasing addressable memory space on a memory board
|
US7978721B2
(en)
*
|
2008-07-02 |
2011-07-12 |
Micron Technology Inc. |
Multi-serial interface stacked-die memory architecture
|
US9104557B2
(en)
*
|
2008-08-01 |
2015-08-11 |
Lenovo Enterprise Solutions (Singapore) Pte. Ltd. |
Encoded chip select for supporting more memory ranks
|
US9128632B2
(en)
|
2009-07-16 |
2015-09-08 |
Netlist, Inc. |
Memory module with distributed data buffers and method of operation
|
US9361955B2
(en)
|
2010-01-28 |
2016-06-07 |
Hewlett Packard Enterprise Development Lp |
Memory access methods and apparatus
|
US9123552B2
(en)
|
2010-03-30 |
2015-09-01 |
Micron Technology, Inc. |
Apparatuses enabling concurrent communication between an interface die and a plurality of dice stacks, interleaved conductive paths in stacked devices, and methods for forming and operating the same
|
KR101033491B1
(ko)
*
|
2010-03-31 |
2011-05-09 |
주식회사 하이닉스반도체 |
반도체 장치
|
US20110289247A1
(en)
*
|
2010-05-21 |
2011-11-24 |
National Semiconductor Corporation |
Autonomous positional addressing in stacked multi-board systems
|
JP5348321B2
(ja)
*
|
2010-05-27 |
2013-11-20 |
富士通株式会社 |
メモリシステム、メモリ装置及びメモリインターフェース装置
|
KR101796116B1
(ko)
|
2010-10-20 |
2017-11-10 |
삼성전자 주식회사 |
반도체 장치, 이를 포함하는 메모리 모듈, 메모리 시스템 및 그 동작방법
|
JP6000655B2
(ja)
*
|
2012-05-30 |
2016-10-05 |
キヤノン株式会社 |
情報処理装置、情報処理装置の制御方法及びプログラム
|
KR101987426B1
(ko)
|
2012-09-07 |
2019-09-30 |
삼성전자주식회사 |
불휘발성 메모리 모듈, 불휘발성 메모리 모듈을 포함하는 메모리 시스템, 그리고 불휘발성 메모리 모듈의 제어 방법
|
US8737108B2
(en)
*
|
2012-09-25 |
2014-05-27 |
Intel Corporation |
3D memory configurable for performance and power
|
WO2015017356A1
(en)
|
2013-07-27 |
2015-02-05 |
Netlist, Inc. |
Memory module with local synchronization
|
US9826638B2
(en)
*
|
2013-10-15 |
2017-11-21 |
Rambus Inc. |
Load reduced memory module
|
US10216659B2
(en)
|
2014-05-30 |
2019-02-26 |
Hewlett Packard Enterprise Development Lp |
Memory access signal detection utilizing a tracer DIMM
|
US10679722B2
(en)
|
2016-08-26 |
2020-06-09 |
Sandisk Technologies Llc |
Storage system with several integrated components and method for use therewith
|
KR102559537B1
(ko)
|
2018-11-13 |
2023-07-26 |
에스케이하이닉스 주식회사 |
메모리 컨트롤러, 이를 포함하는 데이터 저장 장치 및 스토리지 시스템
|