DE602004020396D1 - Leitfähige metallpaste - Google Patents

Leitfähige metallpaste

Info

Publication number
DE602004020396D1
DE602004020396D1 DE602004020396T DE602004020396T DE602004020396D1 DE 602004020396 D1 DE602004020396 D1 DE 602004020396D1 DE 602004020396 T DE602004020396 T DE 602004020396T DE 602004020396 T DE602004020396 T DE 602004020396T DE 602004020396 D1 DE602004020396 D1 DE 602004020396D1
Authority
DE
Germany
Prior art keywords
conductive metal
metal paste
paste
conductive
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602004020396T
Other languages
English (en)
Inventor
Masayuki Ueda
Hiroshi Saito
Kazuo Hosoya
Noriaki Hata
Yorishige Matsuba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harima Chemical Inc
Original Assignee
Harima Chemical Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harima Chemical Inc filed Critical Harima Chemical Inc
Publication of DE602004020396D1 publication Critical patent/DE602004020396D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/773—Nanoparticle, i.e. structure having three dimensions of 100 nm or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE602004020396T 2004-06-23 2004-06-23 Leitfähige metallpaste Active DE602004020396D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2004/008806 WO2006011180A1 (ja) 2004-06-23 2004-06-23 導電性金属ペースト

Publications (1)

Publication Number Publication Date
DE602004020396D1 true DE602004020396D1 (de) 2009-05-14

Family

ID=35785938

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004020396T Active DE602004020396D1 (de) 2004-06-23 2004-06-23 Leitfähige metallpaste

Country Status (6)

Country Link
US (1) US8021580B2 (de)
EP (1) EP1780732B1 (de)
JP (1) JP4496216B2 (de)
CN (1) CN100587855C (de)
DE (1) DE602004020396D1 (de)
WO (1) WO2006011180A1 (de)

Families Citing this family (34)

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WO2004075211A1 (en) * 2003-02-20 2004-09-02 The Regents Of The University Of California Method of forming conductors at low temperatures using metallic nanocrystals and product
WO2005099941A1 (ja) * 2004-04-16 2005-10-27 National Institute For Materials Science 金属微粒子コロイド溶液、導電ペースト材料、導電性インク材料とそれらの製造方法
EP2050319A4 (de) 2006-07-21 2010-12-08 Valtion Teknillinen Verfahren zur herstellung von leitern und halbleitern
JP2008069374A (ja) * 2006-09-12 2008-03-27 Nippon Shokubai Co Ltd 金属ナノ粒子分散体および金属被膜
KR100709724B1 (ko) * 2007-01-30 2007-04-24 (주)이그잭스 도전막 형성을 위한 금속 페이스트
JP5368683B2 (ja) * 2007-07-17 2013-12-18 株式会社日本触媒 金属ナノ粒子分散体および金属被膜
JP4838219B2 (ja) * 2007-10-01 2011-12-14 ハリマ化成株式会社 金属ナノ粒子焼結体の製造方法
KR101874125B1 (ko) * 2009-09-04 2018-07-03 바스프 에스이 전극을 인쇄하기 위한 조성물
JP5468885B2 (ja) * 2009-12-01 2014-04-09 ハリマ化成株式会社 導電性アルミニウムペースト
JP2011252194A (ja) * 2010-06-01 2011-12-15 Murata Mfg Co Ltd 金属粉末とその製造方法および金属粉末を用いた導電性ペーストとそれを用いた積層セラミック電子部品
JP5506042B2 (ja) * 2010-07-27 2014-05-28 ハリマ化成株式会社 導電性銅ペースト
KR101228675B1 (ko) 2010-12-06 2013-01-31 삼성전기주식회사 내부 전극용 도전성 페이스트 및 이를 포함한 적층 세라믹 전자부품
US8643165B2 (en) 2011-02-23 2014-02-04 Texas Instruments Incorporated Semiconductor device having agglomerate terminals
KR101879018B1 (ko) * 2011-09-06 2018-07-16 헨켈 아이피 앤드 홀딩 게엠베하 솔더 페이스트용 이- 또는 다-관능성 전자 결핍 올레핀 코팅된 금속 분말
KR102020914B1 (ko) 2011-09-06 2019-09-11 헨켈 아이피 앤드 홀딩 게엠베하 전도성 물질 및 방법
KR102109390B1 (ko) 2011-12-23 2020-05-12 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 전도성 은 구조체 제조용 잉크 조성물
JP6037494B2 (ja) * 2012-01-11 2016-12-07 国立大学法人山形大学 銀ナノ粒子の製造方法及び銀ナノ粒子、並びに銀塗料組成物
KR101412812B1 (ko) * 2012-07-18 2014-06-27 삼성전기주식회사 도전성 구리 페이스트 조성물 및 이를 이용한 금속 박막의 형성방법
JP2014034697A (ja) * 2012-08-08 2014-02-24 Furukawa Co Ltd 銅微粒子の製造方法、導電性ペーストおよび導電性ペーストの製造方法
JP5960543B2 (ja) * 2012-08-08 2016-08-02 古河機械金属株式会社 銅微粒子の製造方法、および導電性ペーストの製造方法
US9725614B2 (en) * 2013-04-19 2017-08-08 Xerox Corporation Conductive ink compositions and methods for preparation of stabilized metal-containing nanoparticles
EP3033401B1 (de) 2013-08-16 2019-06-05 Henkel IP & Holding GmbH Tintenzusammensetzungen mit submikronsilberpartikeln, verfahren und anwendungen
JP6132716B2 (ja) 2013-09-10 2017-05-24 株式会社東芝 金属粒子ペースト、これを用いた硬化物、および半導体装置
WO2015083307A1 (ja) * 2013-12-03 2015-06-11 国立大学法人山形大学 金属薄膜の製造方法及び導電構造
CN103745763B (zh) * 2014-01-21 2016-04-27 江苏欧耐尔新型材料有限公司 太阳能电池背面电极浆料及其制备方法
US9982154B2 (en) 2014-04-17 2018-05-29 Electroninks Incorporated Solid ink composition
EP3172738A4 (de) * 2014-07-21 2018-03-07 Sun Chemical Corporation Silberpaste mit organobismutverbindungen und deren verwendung in solarzellen
WO2016156221A1 (en) * 2015-03-27 2016-10-06 Heraeus Deutschland Gmbh & Co Kg Electro-conductive pastes comprising an organic metal oxide
WO2017094166A1 (ja) 2015-12-03 2017-06-08 ハリマ化成株式会社 導電性ペーストの製造方法
US9865527B1 (en) 2016-12-22 2018-01-09 Texas Instruments Incorporated Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation
US9941194B1 (en) 2017-02-21 2018-04-10 Texas Instruments Incorporated Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer
JP2017162824A (ja) * 2017-04-17 2017-09-14 株式会社東芝 金属粒子ペースト、これを用いた硬化物、および半導体装置
TW201921382A (zh) * 2017-09-29 2019-06-01 日商播磨化成股份有限公司 導電性糊
KR102239330B1 (ko) * 2019-06-12 2021-04-12 엘지전자 주식회사 제어된 산화막을 가지는 면상 발열체 및 그 제조방법

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2561537B2 (ja) * 1989-03-30 1996-12-11 真空冶金株式会社 金属ペースト及びその製造方法
US5882722A (en) * 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
US5922403A (en) * 1996-03-12 1999-07-13 Tecle; Berhan Method for isolating ultrafine and fine particles
JP3662715B2 (ja) 1997-06-16 2005-06-22 アルプス電気株式会社 導電性材料および導電ペーストと電子機器
JP3666371B2 (ja) * 2000-08-08 2005-06-29 株式会社村田製作所 導電性ペーストおよび積層セラミック電子部品
KR100647238B1 (ko) 2000-10-25 2006-11-17 하리마카세이 가부시기가이샤 도전성 금속 페이스트 및 그 제조 방법
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
US7553512B2 (en) * 2001-11-02 2009-06-30 Cabot Corporation Method for fabricating an inorganic resistor
JP4066247B2 (ja) * 2002-10-07 2008-03-26 日本ペイント株式会社 ニッケルコロイド溶液及びその製造方法
US9006296B2 (en) * 2003-09-12 2015-04-14 Harima Chemicals, Inc. Metal nanoparticle dispersion usable for ejection in the form of fine droplets to be applied in the layered shape
JP2005174824A (ja) 2003-12-12 2005-06-30 Tanaka Kikinzoku Kogyo Kk 金属ペースト及び該金属ペーストを用いた膜形成方法
CN101237952B (zh) * 2005-04-20 2012-08-15 法布罗技术有限公司 微粒铜粉的制备

Also Published As

Publication number Publication date
WO2006011180A1 (ja) 2006-02-02
CN100587855C (zh) 2010-02-03
EP1780732B1 (de) 2009-04-01
US8021580B2 (en) 2011-09-20
JPWO2006011180A1 (ja) 2008-05-01
CN1973341A (zh) 2007-05-30
EP1780732A4 (de) 2008-07-30
JP4496216B2 (ja) 2010-07-07
US20080105853A1 (en) 2008-05-08
EP1780732A1 (de) 2007-05-02

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Legal Events

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