DE60143728D1 - Belichtungsverfahren und Belichtungsvorrichtung zur Verwendung von Nahfeldlicht und Photomaske - Google Patents

Belichtungsverfahren und Belichtungsvorrichtung zur Verwendung von Nahfeldlicht und Photomaske

Info

Publication number
DE60143728D1
DE60143728D1 DE60143728T DE60143728T DE60143728D1 DE 60143728 D1 DE60143728 D1 DE 60143728D1 DE 60143728 T DE60143728 T DE 60143728T DE 60143728 T DE60143728 T DE 60143728T DE 60143728 D1 DE60143728 D1 DE 60143728D1
Authority
DE
Germany
Prior art keywords
photomask
near field
field light
exposure
exposure apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60143728T
Other languages
English (en)
Inventor
Yasuhisa Inao
Ryo Kuroda
Takako Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE60143728D1 publication Critical patent/DE60143728D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/50—Mask blanks not covered by G03F1/20 - G03F1/34; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70325—Resolution enhancement techniques not otherwise provided for, e.g. darkfield imaging, interfering beams, spatial frequency multiplication, nearfield lenses or solid immersion lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558—Dose control, i.e. achievement of a desired dose
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/703—Gap setting, e.g. in proximity printer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
DE60143728T 2000-03-03 2001-03-02 Belichtungsverfahren und Belichtungsvorrichtung zur Verwendung von Nahfeldlicht und Photomaske Expired - Lifetime DE60143728D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000058278 2000-03-03
JP2001050898A JP4532761B2 (ja) 2000-03-03 2001-02-26 近接場光による露光方法

Publications (1)

Publication Number Publication Date
DE60143728D1 true DE60143728D1 (de) 2011-02-10

Family

ID=26586691

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60143728T Expired - Lifetime DE60143728D1 (de) 2000-03-03 2001-03-02 Belichtungsverfahren und Belichtungsvorrichtung zur Verwendung von Nahfeldlicht und Photomaske

Country Status (4)

Country Link
US (1) US6720115B2 (de)
EP (1) EP1150162B1 (de)
JP (1) JP4532761B2 (de)
DE (1) DE60143728D1 (de)

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JP2001308002A (ja) 2000-02-15 2001-11-02 Canon Inc フォトマスクを用いたパターン作製方法、及びパターン作製装置
JP2002246307A (ja) * 2000-12-12 2002-08-30 Canon Inc 露光装置及び露光方法
JP3715973B2 (ja) 2002-05-07 2005-11-16 キヤノン株式会社 近接場光露光用のフォトマスク、該フォトマスクを用いたパターン作製方法およびパターン作製装置
JP2004297032A (ja) * 2003-02-03 2004-10-21 Toshiba Corp 露光方法及びこれを用いた半導体装置製造方法
JP4266661B2 (ja) * 2003-02-20 2009-05-20 キヤノン株式会社 近接場露光用フォトマスク
JP4183245B2 (ja) * 2003-05-12 2008-11-19 キヤノン株式会社 アライメント方法、該アライメント方法を用いた露光方法
JP4018591B2 (ja) * 2003-05-12 2007-12-05 キヤノン株式会社 近接場光露光用フォトマスク、該フォトマスクを用いた近接場光強度分布の制御方法、パターン作製方法
JP4194516B2 (ja) * 2003-06-24 2008-12-10 キヤノン株式会社 露光方法、露光用マスク及びデバイスの製造方法
JP4194514B2 (ja) * 2003-06-26 2008-12-10 キヤノン株式会社 露光用マスクの設計方法及び製造方法
JP4027286B2 (ja) * 2003-08-08 2007-12-26 キヤノン株式会社 近接場露光方法及び装置
JP4185830B2 (ja) 2003-08-08 2008-11-26 キヤノン株式会社 近接場露光方法、近接場露光装置、および近接場露光マスク
JP2005085922A (ja) * 2003-09-08 2005-03-31 Canon Inc マスク作製方法及び微小開口を有するマスク
JP2005093528A (ja) * 2003-09-12 2005-04-07 Canon Inc 近接場露光用マスクの支持固定構造、該支持固定構造を有する近接場露光装置
US7279253B2 (en) * 2003-09-12 2007-10-09 Canon Kabushiki Kaisha Near-field light generating structure, near-field exposure mask, and near-field generating method
US7276316B2 (en) * 2004-02-02 2007-10-02 International Business Machines Corporation Common second level frame exposure methods for making embedded attenuated phase shift masks
JP4099589B2 (ja) * 2004-02-20 2008-06-11 ソニー株式会社 マスクパターン補正方法、露光用マスクおよびマスク製造方法
JP2006013216A (ja) * 2004-06-28 2006-01-12 Canon Inc 近接場露光によるレジストパターンの形成方法、及び該レジストパターンの形成方法を用いた基板の加工方法、デバイスの作製方法
JP2006013402A (ja) * 2004-06-29 2006-01-12 Canon Inc 露光装置
JP4522166B2 (ja) 2004-06-29 2010-08-11 キヤノン株式会社 露光方法
JP4250570B2 (ja) * 2004-06-30 2009-04-08 キヤノン株式会社 近接場露光方法及びこれを用いた素子の製造方法
JP4574250B2 (ja) * 2004-06-30 2010-11-04 キヤノン株式会社 フォトマスク
JP2006019447A (ja) * 2004-06-30 2006-01-19 Canon Inc レジストパターンの形成方法、基板の加工方法及びデバイスの作製方法
JP2006049538A (ja) * 2004-08-04 2006-02-16 Canon Inc 近接場露光用マスクの密着制御装置及び方法、近接場露光用マスク
JP2007329214A (ja) * 2006-06-07 2007-12-20 Canon Inc 近接場露光方法
JP2008098263A (ja) * 2006-10-10 2008-04-24 Canon Inc 近接場露光用マスク及び該マスクを用いたレジストパターンの形成方法
US20080085479A1 (en) * 2006-10-10 2008-04-10 Canon Kabushiki Kaisha Pattern forming method and device production process using the method
KR100876836B1 (ko) * 2007-06-29 2009-01-07 주식회사 하이닉스반도체 반도체 소자의 제조 방법
US8890874B2 (en) 2007-12-14 2014-11-18 Microsoft Corporation Changing visual content communication
US20110300473A1 (en) * 2010-06-04 2011-12-08 Lightware Power, Inc. Method for nanopatterning using nanomasks and light exposure

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774080A (ja) * 1993-09-03 1995-03-17 Hitachi Ltd パターン形成方法
JPH08179493A (ja) 1994-12-22 1996-07-12 Hitachi Ltd 光露光または転写方法および装置またはそのためのマスク
JPH08321070A (ja) * 1995-05-25 1996-12-03 Sanyo Electric Co Ltd 光記録媒体の再生方法及び再生装置
JPH097935A (ja) * 1995-06-23 1997-01-10 Nikon Corp レジストの露光方法
US5973316A (en) 1997-07-08 1999-10-26 Nec Research Institute, Inc. Sub-wavelength aperture arrays with enhanced light transmission
JPH1126360A (ja) * 1997-07-09 1999-01-29 Sony Corp マスクパターンの作成方法およびマスクパターン作成装置並びにマスク作成装置
JP3950538B2 (ja) * 1997-12-24 2007-08-01 キヤノン株式会社 エバネッセント光露光装置及びエバネッセント光露光方法
US6171730B1 (en) 1997-11-07 2001-01-09 Canon Kabushiki Kaisha Exposure method and exposure apparatus
TW380282B (en) * 1997-12-31 2000-01-21 United Microelectronics Corp Proximity effect correction method for mask
JP4346701B2 (ja) 1998-03-25 2009-10-21 キヤノン株式会社 エバネッセント光を用いた露光方法
JP3809500B2 (ja) * 1998-10-05 2006-08-16 正喜 江刺 近接場光露光マスク及びその製造方法並びに近接場光露光装置及び近接場光露光方法

Also Published As

Publication number Publication date
US20010036581A1 (en) 2001-11-01
US6720115B2 (en) 2004-04-13
EP1150162A3 (de) 2003-12-03
EP1150162B1 (de) 2010-12-29
JP2001319875A (ja) 2001-11-16
EP1150162A2 (de) 2001-10-31
JP4532761B2 (ja) 2010-08-25

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